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    • 2. 发明授权
    • Lead-free shot formed by liquid phase bonding
    • 通过液相键合形成的无铅射流
    • US5950064A
    • 1999-09-07
    • US785453
    • 1997-01-17
    • Peter W. RobinsonBrian MravicDerek E. Tyler
    • Peter W. RobinsonBrian MravicDerek E. Tyler
    • B22F1/00F42B7/04F42B12/74B22F3/12
    • B22F1/0003F42B12/74F42B7/046B22F2998/10
    • There is provided a lead-free projectile, such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate having a density greater than lead, a second, ductile, particulate having a melting temperature in excess of 400.degree. C. and a binder having a fluidity temperature that is less than the melting temperature of the second particulate. Unlike solid phase sintering that tends to produce articles having a porosity of about 20%, by volume, liquid phase sintering and liquid phase bonding achieve close to 0% porosity. Reducing the porosity level decreases the amount of high density, first particulate, required to achieve a density close to that of lead. Since the high density particulate tends to be the most expensive component of the projectile, this significantly reduces the cost of the projectile. The reduced porosity also allows for an increase in the amount of the second, ductile, component. Increased ductility generates a projectile with a reduced likelihood of fragmentation on being fired from a weapon and with better deformation on impact with a target. One suitable composition for the projectile is ferrotungten-iron-zinc.
    • 提供了一种无铅弹丸,例如子弹或弹道射击,其通过液相烧结或液相键合形成,该第一颗粒的密度大于铅,第二,延性,颗粒的熔点超过 的粘合剂和流动性温度小于第二颗粒的​​熔融温度的粘合剂。 与容易产生孔隙率为约20%(体积)的制品的固相烧结不同,液相烧结和液相粘合实现接近0%的孔隙率。 减少孔隙度降低了达到密度接近于铅的密度所需的高密度,第一颗粒的量。 由于高密度颗粒物往往是弹丸中最昂贵的成分,所以这显着降低了射弹的成本。 减小的孔隙率还允许第二,延性部件的量的增加。 增加的延性产生抛射物,从武器射出的碎片的可能性降低,并且与目标的冲击有更好的变形。 用于射弹的一种合适的组合物是铁铁 - 铁 - 锌。