专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070087637A1 CONNECTOR ASSEMBLY FOR AN IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING 审中-公开
公开(公告)号：US20070087637A1
公开(公告)日：2007-04-19
申请号：US11612278
申请日：2006-12-18
申请人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
发明人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
IPC分类号： H01R13/405
CPC分类号： H01R43/24 , A61N1/05 , A61N1/3752 , H01R13/405 , H01R13/504 , H01R43/18 , H05K1/0284 , H05K3/202 , Y10S439/905 , Y10T29/49146 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922
摘要： A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.

2. 发明申请

US20070293099A1 CONNECTOR ASSEMBLY FOR AN IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING 有权
标题翻译：用于可植入医疗设备的连接器组件及其制造方法
公开(公告)号：US20070293099A1
公开(公告)日：2007-12-20
申请号：US11842704
申请日：2007-08-21
申请人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
发明人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
IPC分类号： H01R13/405 , H05K3/30
CPC分类号： H01R43/24 , A61N1/05 , A61N1/3752 , H01R13/405 , H01R13/504 , H01R43/18 , H05K1/0284 , H05K3/202 , Y10S439/905 , Y10T29/49146 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922
摘要： A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
摘要翻译：用于可植入医疗装置的连接器电路组件，以及使用注射成型工艺或机械加工工艺制造包括由热塑性材料形成的芯部的组件的方法。该芯部分适于安装至少一个导电电路部件，例如连接器部件，固定螺丝块或导电跳线部件。在本发明的一个实施例中，芯部分包括适于装载各种电路部件的多个插座或其它空间。芯组件被定位成二次模具组件，并且将第二热塑性材料注入到模具中，使得第二热塑性材料延伸并粘附到芯部分和电路部件上。

3. 发明申请

US20070190866A1 CONNECTOR ASSEMBLY FOR AN IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING 有权
标题翻译：用于可植入医疗设备的连接器组件及其制造方法
公开(公告)号：US20070190866A1
公开(公告)日：2007-08-16
申请号：US11668260
申请日：2007-01-29
申请人： Bryan Zart , Andrew Ries , Brian Burwick , John Nicholson , Jay Lahti , Gregory Theis
发明人： Bryan Zart , Andrew Ries , Brian Burwick , John Nicholson , Jay Lahti , Gregory Theis
IPC分类号： H01R13/405
CPC分类号： H01R13/405 , A61N1/05 , A61N1/37229 , A61N1/3752 , H01R43/24 , Y10S439/909
摘要： A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
摘要翻译：用于联接到可植入医疗装置的连接器组件包括由第一热塑性材料形成的芯元件，该第一热塑性材料成形为接收用于接收引线的连接器构件。连接器组件还包括邻近核心元件定位的电路元件。电路构件包括沿芯体延伸到连接器构件的部分和在芯体元件外表面的一部分上延伸的天线结构。

4. 发明申请

US20050137642A1 Connector assembly for an implantable medical device and process for making 有权
公开(公告)号：US20050137642A1
公开(公告)日：2005-06-23
申请号：US10966636
申请日：2004-10-15
申请人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
发明人： Bryan Zart , Brian Burwick , Andrew Ries , John Nicholson , Jay Lahti , Gregory Theis
IPC分类号： A61N1/375 , H01R13/504 , H01R43/18
CPC分类号： H01R13/504 , A61N1/3752 , H01R43/18 , Y10T29/49146
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式