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1. 发明授权

US07082034B2 Circuit cooling 有权
标题翻译：电路冷却
公开(公告)号：US07082034B2
公开(公告)日：2006-07-25
申请号：US10817081
申请日：2004-04-01
申请人： Nachiketa Tiwari , Bradford Kyle Subat , Benjamin G. Powers
发明人： Nachiketa Tiwari , Bradford Kyle Subat , Benjamin G. Powers
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H05K7/20436 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： A housing cover to cause electrical components to engage with at least one component pad of a heat sink, the cover including a projection integrally formed from the housing cover and positioned on the cover for biasing the electrical component against the component pad, and a mechanism that permits a vertical displacement of the projection relative to the vertical displacement of the housing cover. In one example, a slot extends around at least part of the projection so as to substantially decouple a vertical displacement of the projection from a vertical displacement of the housing cover.
摘要翻译：一种壳体盖，用于使电气部件与散热器的至少一个部件焊盘接合，所述盖子包括从所述壳体盖整体形成并且定位在所述盖上的突起，用于将所述电气部件偏压抵靠所述部件焊盘;以及机构，允许突起相对于壳体盖的垂直位移的垂直位移。在一个示例中，狭槽围绕突起的至少一部分延伸，以便基本上将突起的垂直位移与壳体盖的垂直位移基本上分离。

2. 发明申请

US20140146481A1 Circuit Cooling 有权
标题翻译：电路冷却
公开(公告)号：US20140146481A1
公开(公告)日：2014-05-29
申请号：US13688734
申请日：2012-11-29
申请人： Bradford Kyle Subat
发明人： Bradford Kyle Subat
IPC分类号： H05K7/20 , H05K13/04
CPC分类号： H05K13/046 , H05K7/20445 , H05K7/2049 , Y10T29/49826
摘要： An apparatus (e.g., an audio amplifier) includes a housing cover configured to be fitted to a heat sink for enclosing a circuit board therebetween. The apparatus also includes a contact member formed separately from and mounted to the housing cover to cause electrical components on the circuit board to engage with the heat sink when the housing cover is fastened to the heat sink. The contact member includes first and second projections connected to each other and configured such that displacement of the first projection in a first direction causes a proportional displacement of the second projection in a second direction opposite the first direction.
摘要翻译：装置（例如，音频放大器）包括壳体盖，其被配置成装配到散热器，用于在其间封装电路板。该装置还包括与外壳盖分开形成并安装到壳体盖上的接触构件，当壳体盖被紧固到散热器时，使电路板上的电气部件与散热器接合。接触构件包括彼此连接的第一和第二突起，并且构造为使得第一突起在第一方向上的位移导致第二突起在与第一方向相反的第二方向上的比例位移。

3. 发明申请

US20140355783A1 Automobile Headrest 有权
标题翻译：汽车头枕
公开(公告)号：US20140355783A1
公开(公告)日：2014-12-04
申请号：US13907428
申请日：2013-05-31
申请人： Bradford Kyle Subat
发明人： Bradford Kyle Subat
IPC分类号： B60N2/48 , H04R1/02
CPC分类号： B60N2/4876 , B60N2/879 , B60R11/0217 , B60R2011/0017 , H04R1/026 , H04R1/403 , H04R5/023 , H04R2499/13
摘要： An automobile headrest includes a main body portion having a front surface arranged to support a back of a head of a user. The main body portion includes first and second speakers which are disposed within the main body portion, and a core that is configured to support the speakers. The automobile headrest also includes a pair of support rods that are connected to the core. The core is configured such that at least a portion of the speakers is disposed directly behind the head of the user when the back of the user's head rests against the front surface of the main body portion and is centered relative to the main body portion. The core defines a portion of one or more acoustic chambers for the first and second speakers.
摘要翻译：汽车头枕包括主体部分，其具有布置成支撑使用者头部的后部的前表面。主体部分包括设置在主体部分内的第一和第二扬声器，以及配置成支撑扬声器的芯。汽车头枕还包括连接到芯的一对支撑杆。芯部构造成使得当使用者的头部的背部抵靠主体部分的前表面并且相对于主体部分居中时，扬声器的至少一部分直接设置在使用者的头部的后方。芯部定义用于第一和第二扬声器的一个或多个声学室的一部分。

4. 发明授权

US07340066B2 Audio device heat transferring 有权
标题翻译：音频设备传热
公开(公告)号：US07340066B2
公开(公告)日：2008-03-04
申请号：US11467845
申请日：2006-08-28
申请人： Scott H. Aronson , Damian Howard , Craig A. Liebel , Richard Warren Little , John Schussler , Lee J. Shumosic , Bradford Kyle Subat
发明人： Scott H. Aronson , Damian Howard , Craig A. Liebel , Richard Warren Little , John Schussler , Lee J. Shumosic , Bradford Kyle Subat
IPC分类号： H04R25/00
CPC分类号： H04R9/022
摘要： An acoustic device having a heat producing device, such as an amplifier and a heat sink for transferring heat from the amplifier. The acoustic device has a cone having an inner surface, and a support structure defining a volume. The heat producing element and the heat sink are positioned in the volume.
摘要翻译：具有发热装置的声学装置，例如用于从放大器传递热量的放大器和散热器。声学装置具有具有内表面的锥体和限定体积的支撑结构。发热元件和散热片位于容积中。

5. 发明授权

US07120270B2 Audio device heat transferring 有权
标题翻译：音频设备传热
公开(公告)号：US07120270B2
公开(公告)日：2006-10-10
申请号：US10246331
申请日：2002-09-18
申请人： Scott H. Aronson , Damian Howard , Craig A. Liebel , Richard Warren Little , John Schussler , Lee J. Shumosic , Bradford Kyle Subat
发明人： Scott H. Aronson , Damian Howard , Craig A. Liebel , Richard Warren Little , John Schussler , Lee J. Shumosic , Bradford Kyle Subat
IPC分类号： H04R1/02
CPC分类号： H04R9/022
摘要： An acoustic device having a heat producing device, such as an amplifier and a heat sink for transferring heat from the amplifier. The acoustic device has a cone having an inner surface, and a support structure defining a volume. The heat producing element and the heat sink are positioned in the volume.
摘要翻译：具有发热装置的声学装置，例如用于从放大器传递热量的放大器和散热器。声学装置具有具有内表面的锥体和限定体积的支撑结构。发热元件和散热片位于容积中。

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