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1. 发明授权

US08741927B2 Production method of intermediate compound for synthesizing medicament 有权
标题翻译：用于合成药物的中间体化合物的制备方法
公开(公告)号：US08741927B2
公开(公告)日：2014-06-03
申请号：US13820197
申请日：2011-08-25
申请人： Bong Chan Kim , Kyu Young Kim , Hee Bong Lee , Ji Eun An , Kyu Woong Lee
发明人： Bong Chan Kim , Kyu Young Kim , Hee Bong Lee , Ji Eun An , Kyu Woong Lee
IPC分类号： A01N43/40 , A61K31/445 , A61K31/435 , A61K31/44 , C07D211/00 , C07D211/72 , C07D211/84 , C07D213/63 , C07D213/70
CPC分类号： C07D211/76
摘要： The present invention relates to a novel method for preparing a compound of formula (2) as the intermediate, which can be effectively used for preparation of a compound of formula (1) exhibiting good inhibitory activity against dipeptidyl peptidase IV enzyme.
摘要翻译：本发明涉及一种制备作为中间体的式（2）化合物的新方法，其可有效用于制备对二肽基肽酶IV酶具有良好抑制活性的式（1）化合物。

2. 发明申请

US20130165659A1 PRODUCTION METHOD OF INTERMEDIATE COMPOUND FOR SYNTHESIZING MEDICAMENT 有权
标题翻译：用于合成药物的中间体化合物的生产方法
公开(公告)号：US20130165659A1
公开(公告)日：2013-06-27
申请号：US13820197
申请日：2011-08-25
申请人： Bong Chan Kim , Kyu Young Kim , Hee Bong Lee , Ji Eun An , Kyu Woong Lee
发明人： Bong Chan Kim , Kyu Young Kim , Hee Bong Lee , Ji Eun An , Kyu Woong Lee
IPC分类号： C07D211/76 , C07C227/14 , C07C67/03
CPC分类号： C07D211/76
摘要： The present invention relates to a novel method for preparing a compound of formula (2) as the intermediate, which can be effectively used for preparation of a compound of formula (1) exhibiting good inhibitory activity against dipeptidyl peptidase IV enzyme.
摘要翻译：本发明涉及一种制备作为中间体的式（2）化合物的新方法，其可有效用于制备对二肽基肽酶IV酶具有良好抑制活性的式（1）化合物。

3. 发明授权

US07170183B1 Wafer level stacked package 有权
标题翻译：晶圆级堆叠封装
公开(公告)号：US07170183B1
公开(公告)日：2007-01-30
申请号：US11128633
申请日：2005-05-13
申请人： Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
发明人： Bong Chan Kim , Yoon Joo Kim , Ji Young Chung
IPC分类号： H01L23/48 , H01L23/31 , H05K3/34 , H05K1/14 , H01I23/13
CPC分类号： H01L25/0657 , H01L23/49575 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2225/06517 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2224/05599
摘要： Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically connected to a lower surface of the substrate. That is, with respect to one substrate, semiconductor dies can be stacked on upper and lower surfaces of the substrate. Also, underfill is formed between the respective semiconductor dies and the substrate, thereby enhancing bonding forces between the respective semiconductor dies and the substrate. In addition to stacking the semiconductor dies, packages can be stacked with each other. That is, it is possible to stack a plurality of completed wafer level packages with each other in an up-and-down direction.
摘要翻译：公开了一种晶片级堆叠封装及其制造方法。作为一个示例，在这种晶片级堆叠封装中，第一半导体管芯电连接到衬底的上表面，并且第二半导体管芯电连接到衬底的下表面。也就是说，相对于一个衬底，半导体管芯可以堆叠在衬底的上表面和下表面上。此外，在各个半导体管芯和衬底之间形成底部填料，从而增强了各个半导体管芯和衬底之间的结合力。除了堆叠半导体管芯之外，封装可以彼此堆叠。也就是说，可以在上下方向上堆叠多个完成的晶片级封装。

4. 发明授权

US08859567B2 Hydrate of 1-{(2S)-2-amino-4-[2,4-bis(trifluoromethyl)-5,8-di-hydropyrido[3,4-D]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-difluoro-piperidin-2-one tartrate 有权
标题翻译： 1 - {（2S）-2-氨基-4- [2,4-双（三氟甲基）-5,8-二氢吡啶并[3,4-D]嘧啶-7（6H） - 基] -4 - 氧代丁基} -5,5-二氟 - 哌啶-2-酮酒石酸盐
公开(公告)号：US08859567B2
公开(公告)日：2014-10-14
申请号：US13879571
申请日：2011-10-31
申请人： Ki Sook Park , Jung Min Yun , Bong Chan Kim , Kyu Young Kim , Ji Hye Lee
发明人： Ki Sook Park , Jung Min Yun , Bong Chan Kim , Kyu Young Kim , Ji Hye Lee
IPC分类号： C07D471/04 , A61K31/519
CPC分类号： C07D471/04
摘要： The present invention relates to 1.5 hydrate of of 1-{(2S)-2-amino-4-[2,4-bis(trifluoromethyl)-5,8-dihydropyrido[3,4-d]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-difluoropiperidin-2-one tartrate, a process for preparing the same, and a pharmaceutical composition for inhibiting DPP-IV, which comprises said compound as the active component.
摘要翻译：本发明涉及1 - {（2S）-2-氨基-4- [2,4-双（三氟甲基）-5,8-二氢吡啶并[3,4-d]嘧啶-7（6H） - 基] -4-氧代丁基} -5,5-二氟哌啶-2-酮酒石酸盐，其制备方法和用于抑制DPP-IV的药物组合物，其包含所述化合物作为活性成分。

5. 发明授权

US08520319B2 Zoom lens barrel assembly 有权
标题翻译：变焦镜头组件
公开(公告)号：US08520319B2
公开(公告)日：2013-08-27
申请号：US13280575
申请日：2011-10-25
申请人： Young-eun Kim , Chan-ho Lee , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
发明人： Young-eun Kim , Chan-ho Lee , Hyun-min Oh , Hee-yun Chung , Bong-chan Kim , Jong-jun Kim
IPC分类号： G02B15/14
CPC分类号： G02B7/10 , G02B7/021 , G02B7/08 , G02B7/102 , G02B15/14 , G03B17/04
摘要： A zoom lens barrel assembly including: a first zoom ring comprising a first protrusion; a guide ring disposed around the first zoom ring comprising a first guide slot through which the first protrusion passes, and a second guide slot; a second zoom ring comprising a second protrusion, and movable in an axial direction; a first cylinder comprising a guide groove into which the second protrusion inserts, and a third protrusion passing through the second guide slot, and disposed between the first and second zoom rings; a second cylinder disposed around the guide ring comprising a fourth protrusion, a first groove portion into which the first protrusion inserts, and a second groove portion into which the third protrusion inserts, and supporting the first zoom ring and the first cylinder; and an external cylinder disposed around the second cylinder and comprising a third groove portion into which the fourth protrusion inserts.
摘要翻译：一种变焦镜头组件，包括：第一变焦环，包括第一突起; 设置在所述第一变焦环周围的引导环，包括所述第一突起穿过的第一引导槽和第二引导槽; 第二变焦环，包括第二突起，并且可沿轴向移动; 第一气缸，包括第二突起插入的引导槽和穿过第二引导槽的第三突起，并且设置在第一和第二变焦环之间; 设置在所述导向环周围的第二圆筒，包括第四突起，所述第一突起插入其中的第一凹槽部分和所述第三突起插入并支撑所述第一变焦环和所述第一气缸的第二凹槽部分; 以及设置在所述第二圆筒周围并包括第三凹槽部分的外圆筒，所述第四凸起插入所述第三凹槽部分。

6. 发明申请

US20130203787A1 HYDRATE OF 1--5,5-DIFLUORO-PIPERIDIN-2-ONE TARTRATE 有权
标题翻译： 1--5,5-二氟哌啶-2-酮的水合物
公开(公告)号：US20130203787A1
公开(公告)日：2013-08-08
申请号：US13879571
申请日：2011-10-31
申请人： Ki Sook Park , Jung Min Yun , Bong Chan Kim , Kyu Young Kim , Ji Hye Lee
发明人： Ki Sook Park , Jung Min Yun , Bong Chan Kim , Kyu Young Kim , Ji Hye Lee
IPC分类号： C07D471/04
CPC分类号： C07D471/04
摘要： The present invention relates to 1.5 hydrate of of 1-{(2S)-2-amino-4-[2,4-bis (trifluoromethyl)-5,8-dihydropyrido[3,4-d]pyrimidin-7(6H)-yl]-4-oxobutyl}-5,5-di-fluoropiperidin-2-one tartrate, a process for preparing the same, and a pharmaceutical composition for inhibiting DPP-IV, which comprises said compound as the active component.
摘要翻译：本发明涉及1 - {（2S）-2-氨基-4- [2,4-双（三氟甲基）-5,8-二氢吡啶并[3,4-d]嘧啶-7（6H） - 基] -4-氧代丁基} -5,5-二氟哌啶-2-酮酒石酸盐，其制备方法和用于抑制DPP-IV的药物组合物，其包含所述化合物作为活性成分。

7. 发明申请

US20120098688A1 CLOCK TIMING ADJUSTMENT DEVICE AND CONTINUOUS TIME DELTA-SIGMA MODULATOR USING THE SAME 有权
标题翻译：时钟调整装置和连续时间三角形调制器
公开(公告)号：US20120098688A1
公开(公告)日：2012-04-26
申请号：US13184182
申请日：2011-07-15
申请人： Yi-Gyeong KIM , Bong Chan KIM , Min-Hyung CHO , Jong-Kee KWON
发明人： Yi-Gyeong KIM , Bong Chan KIM , Min-Hyung CHO , Jong-Kee KWON
IPC分类号： H03M3/02 , H03H11/26
CPC分类号： H03M3/372 , H03M3/458
摘要： Provided is a clock timing adjustment device for adjusting a time difference of clocks and a delta-sigma modulator. The clock timing adjustment device includes a power detection unit and a timing adjustment unit. The power detection unit receives input signals which are generated using pairs of first and second clocks having a plurality of clock time differences and respectively correspond to the clock time differences, detects powers of the input signals, and outputs a control signal corresponding to a clock time difference where the power is minimized. The timing adjustment unit receives a reference clock and the control signal and outputs the first and second clocks having the clock time difference where the power is minimized from the reference clock according to the control signal.
摘要翻译：提供了一种用于调整时钟的时间差和Δ-Σ调制器的时钟定时调整装置。时钟定时调整装置包括功率检测单元和定时调整单元。功率检测单元接收使用具有多个时钟时间差的第一和第二时钟对生成的输入信号，并分别对应于时钟时间差，检测输入信号的功率，并输出对应于时钟时间的控制信号功率最小化的差异。定时调整单元接收参考时钟和控制信号，并根据控制信号从参考时钟输出具有最小功率的时钟时间差的第一和第二时钟。

8. 发明授权

US08129849B1 Method of making semiconductor package with adhering portion 有权
标题翻译：制造具有粘附部分的半导体封装的方法
公开(公告)号：US08129849B1
公开(公告)日：2012-03-06
申请号：US12589868
申请日：2009-10-28
申请人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
发明人： Youn Sang Kim , Bong Chan Kim , Yoon Joo Kim
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.
摘要翻译：公开了一种半导体封装及其制造方法。在半导体封装中，衬底和半导体管芯被在预定温度范围内具有流动性的垂直压制热固性树脂覆盖并包封，并且在凝胶中自身变质。因此，可以减小半导体封装的厚度并防止线扫。

9. 发明授权

US08004078B1 Adhesive composition for semiconductor device 有权
标题翻译：半导体器件用粘合剂组合物
公开(公告)号：US08004078B1
公开(公告)日：2011-08-23
申请号：US12405854
申请日：2009-03-17
申请人： Jae Kyu Song , Bong Chan Kim , Min Yoo
发明人： Jae Kyu Song , Bong Chan Kim , Min Yoo
IPC分类号： H01L23/48 , G02B6/12
CPC分类号： H01L24/29 , C08K3/14 , C08K3/38 , C09J7/38 , C09J2205/102 , C09J2467/00 , C09J2475/00 , H01L23/293 , H01L23/295 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/16225 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/0781 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.
摘要翻译：本发明提供一种半导体装置用粘合剂组合物。例如，粘合剂组合物包含粘合剂树脂和碳化硅填料。碳化硅填料具有较高的热导率和较低的热膨胀系数（CTE）。因此，含有碳化硅填料的粘合剂组合物由于高导热性而具有改善的散热性能和电性能，并且由于低CTE而显示出对半导体器件的分层或破裂的抑制。碳化硅具有高导热性，但是是非导电的。因此，通过向粘合剂树脂中另外并入银（Ag）填料可以获得导电粘合剂。

10. 发明授权

US07938308B1 Wire bonder for improved bondability of a conductive wire and method therefor 有权
标题翻译：导线接合器，用于改善导线的可接合性及其方法
公开(公告)号：US07938308B1
公开(公告)日：2011-05-10
申请号：US12429448
申请日：2009-04-24
申请人： Joon Su Kim , Mun Gil Ho , Yong Suk Yang , Jung Soo Park , Bong Chan Kim
发明人： Joon Su Kim , Mun Gil Ho , Yong Suk Yang , Jung Soo Park , Bong Chan Kim
IPC分类号： B23K37/00 , B23K20/14
CPC分类号： B23K20/007 , B23K20/10 , B23K20/14 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/207
摘要： A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.
摘要翻译：引线接合器具有毛细管，线通过该毛细管。放电尖端位于毛细管的底部附近，并向线的远端提供火焰。气体扩散器位于毛细管旁边，以将加热的气体扩散到电线的远端。

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