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    • 1. 发明授权
    • Semiconductor-on-insulator apparatus, device and system with buried decoupling capacitors
    • 绝缘体上半导体器件,具有埋入去耦电容器的器件和系统
    • US08618633B2
    • 2013-12-31
    • US13357322
    • 2012-01-24
    • Badih El-Kareh
    • Badih El-Kareh
    • H01L21/02
    • H01L27/1203H01L21/84H01L23/5223H01L29/94H01L2924/0002H01L2924/00
    • A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a semiconductor-on-insulator substrate having a buried insulator region and top semiconductor region on the buried insulator region. The apparatus embodiment also includes a first capacitor plate having a doped region in the top semiconductor region in the semiconductor-on-insulator substrate. The apparatus embodiment further includes a dielectric material on the first capacitor plate, and a second capacitor plate on the dielectric material. According to various embodiments, the first capacitor plate, the dielectric material and the second capacitor plate form a decoupling capacitor for use in an integrated circuit.
    • 提供了一种埋地去耦电容器装置和方法。 根据各种实施例,掩埋去耦电容器装置包括在绝缘体区域上具有掩埋绝缘体区域和顶部半导体区域的绝缘体上半导体衬底。 该装置实施例还包括在绝缘体上半导体衬底中的顶部半导体区域中具有掺杂区域的第一电容器板。 该装置实施例还包括在第一电容器板上的电介质材料和介电材料上的第二电容器板。 根据各种实施例,第一电容器板,电介质材料和第二电容器板形成用于集成电路的去耦电容器。