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    • 6. 发明申请
    • Metallocene Polyolefin Based Low Activation Temperature Heat Seal Hot Melt Adhesive
    • 茂金属聚烯烃低活化温度热封热熔胶
    • US20160215176A1
    • 2016-07-28
    • US15004312
    • 2016-01-22
    • Bostik, Inc.
    • Monina D. KanderskiMichael D. Vitrano
    • C09J123/08B32B27/08B32B27/32
    • C09J123/0815B32B27/08B32B27/32B32B27/327B32B2250/242B32B2439/70C08K5/005C08L91/06C08L2203/162
    • A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.0 pound per inch in order to meet the sealing performance requirements for packaging food and other consumer goods.
    • 基于茂金属催化聚烯烃聚合物,增粘树脂,蜡和其他任选添加剂的共混物的包装应用的低活化温度热熔粘合剂。 为了达到适用于挤出热封应用的高粘度,本发明的粘合剂组合物高度负载聚合物,因此在300°F的温度下应该具有约50,000厘泊或更高的粘度。因此, 热熔粘合剂组合物含有约50%至约90%重量的茂金属催化的聚烯烃聚合物,约5%至约50%重​​量的增粘树脂,约0.5%至约40%重量的蜡,约0.1%至 约5重量%的稳定剂或抗氧化剂,和0重量%至约25重量%的任选添加剂。 热熔粘合剂组合物必须具有约160°F或更低的活化温度,并提供约1.0磅/英寸的最小剥离力,以满足包装食品和其它消费品的密封性能要求。
    • 8. 发明申请
    • Cohesively Failing, Non-Staining Hot Melt Adhesives
    • 凝结失效,不污染热熔胶
    • US20160002508A1
    • 2016-01-07
    • US14789727
    • 2015-07-01
    • Bostik, Inc.
    • Monina D. KanderskiMichael D. Vitrano
    • C09J153/00B42D15/00B42D15/04C09J7/04
    • B42D15/04B42D15/0093C08L23/0815C08L91/00C08L91/06C09J153/025
    • A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear. In addition, the presence of the secondary polymer allows additional oil absorption into the polymer, thus preventing oil from staining the substrates or surfaces without significantly increasing the viscosity.
    • 用于邮寄应用的非压敏热熔粘合剂使用具有氢化中间嵌段的苯乙烯嵌段共聚物(SBC)作为组合物中的主要聚合物。 粘合剂包含约10重量%至约50重量%的SBC,约2重量%至约30重量%的作为组合物中的第二聚合物的聚烯烃聚合物,约10重量%至约70重量%的合适的增塑剂 ,约0%至约30%重量的蜡,约0%至约50%重​​量的一种或多种增粘树脂,约0.1%至约4%重量的稳定剂和约0%至约3% 重量的辅助添加剂,使得组合物的粘度在163℃下等于或小于约10000cP。制剂平衡了粘合剂失效所需的内聚力和粘合强度,从而防止纸张撕裂。 此外,二次聚合物的存在允许另外的油吸收到聚合物中,从而防止油污染基底或表面而不显着增加粘度。
    • 9. 发明申请
    • Hot Melt Positioning Adhesive
    • 热熔胶定位胶
    • US20150203725A1
    • 2015-07-23
    • US14598468
    • 2015-01-16
    • Bostik, Inc.
    • Kevin StafeilKelley GerschkeKyle Gerarden
    • C09J153/02
    • C09J153/02C08L53/02C08L2205/02
    • A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.
    • 由具有相对高的二嵌段含量的苯乙烯 - 丁二烯 - 苯乙烯聚合物和苯乙烯含量组成的热熔粘合剂,具有比苯乙烯 - 丁二烯 - 苯乙烯聚合物更低的二嵌段含量的第二苯乙烯嵌段共聚物,其优选为苯乙烯 - 异戊二烯 - 苯乙烯聚合物,增粘树脂和液体增塑剂。 优选的苯乙烯 - 丁二烯 - 苯乙烯聚合物含有大于30%的苯乙烯含量和大于30重量%的二嵌段含量。 当与苯乙烯 - 异戊二烯 - 苯乙烯聚合物一起使用时,热熔组合物在5℃下提供改善的剥离强度,并且当用作垫附着定位粘合剂时,在40℃下不显示粘合剂转移。