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1. 发明申请

US20090046411A1 C0G Multi-Layered Ceramic Capacitor 有权
标题翻译： C0G多层陶瓷电容器
公开(公告)号：US20090046411A1
公开(公告)日：2009-02-19
申请号：US12257532
申请日：2008-10-24
申请人： Michael S. Randall , Corey Antoniades , Daniel E. Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Thomas Poole , Azizuddin Tajuddin , Ian Burn
发明人： Michael S. Randall , Corey Antoniades , Daniel E. Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Thomas Poole , Azizuddin Tajuddin , Ian Burn
IPC分类号： H01G4/258
CPC分类号： C04B35/49 , C04B35/64 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3267 , C04B2235/3275 , C04B2235/3281 , C04B2235/3286 , C04B2235/3287 , C04B2235/3409 , C04B2235/3418 , C04B2235/5445 , C04B2235/6025 , C04B2235/656 , C04B2235/6584 , C04B2235/663 , H01G4/1209 , H01G4/1227 , H01G4/30
摘要： A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0≦x≦0.08, 0.0001≦s≦0.043 and x≧1.86s; and b) 0≦x≦0.0533, 0.0001≦s≦0.08 and x≦0.667s.
摘要翻译：一种具有下列组成的多层陶瓷电容器中的介电陶瓷组合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> {[（CaO）t（SrO）1-t] m [（ZrO 2）v（TiO 2）1-v]} 1-s-x AsEx <？in-line-formula description =“In-line Formulas”end =“tail”？>其中：A是过渡金属氧化物; E是选自Ge，Si，Ga及其组合的元素的氧化物; m为0.98〜1.02; t为0.50〜0.90; v为0.8〜1.0; s和x选自：a）0 <= x <= 0.08,0 0.0001 <= s <= 0.043和x> = 1.86s; 和b）0 <= x <= 0.0533，0.0001 <= s <= 0.08和x <= 0.667s。

2. 发明申请

US20070253140A1 Base metal electrode multilayer capacitor with localized oxidizing source 审中-公开
标题翻译：具有局部氧化源的基体金属电极层叠电容器
公开(公告)号：US20070253140A1
公开(公告)日：2007-11-01
申请号：US11413863
申请日：2006-04-28
申请人： Michael Randall , Ian Burn , Daniel Barber , Aiying Wang , James Beeson , Pascal Pinceloup , Abhijit Gurav , Tom Poole , Azizuddin Tajuddin
发明人： Michael Randall , Ian Burn , Daniel Barber , Aiying Wang , James Beeson , Pascal Pinceloup , Abhijit Gurav , Tom Poole , Azizuddin Tajuddin
IPC分类号： H01G5/019
CPC分类号： H01G4/1218 , H01G4/0085 , H01G4/1227 , H01G4/30
摘要： A ceramic capacitor is disclosed. The capacitor comprises a plurality of base metal inner electrode layers, a plurality of ceramic dielectric layers between the inner electrode layers, and external electrodes in electrical conductivity with the inner electrode layers. At least one secondary component having an intentionally added chemistry is dispersed in the inner electrode layers and/or the dielectric layers. The chemistry evolves an oxidizing species in a controlled manner, such that it offsets localized highly reducing atmospheres that are present when the capacitor is fired in a reducing atmosphere, thereby promoting enhanced electrode connectivity in thin layer base metal multilayer capacitors.
摘要翻译：公开了一种陶瓷电容器。电容器包括多个基底金属内部电极层，内部电极层之间的多个陶瓷电介质层和与内部电极层的导电性的外部电极。具有有意添加的化学物质的至少一种次要组分分散在内部电极层和/或电介质层中。化学以受控的方式演化氧化物质，使得它抵消了当电容器在还原性气氛中烧制时存在的局部高度还原气氛，从而促进薄层贱金属多层电容器中增强的电极连接性。

3. 发明申请

US20070172592A1 Microcontact printed thin film capacitors 有权
标题翻译：微接触式薄膜电容器
公开(公告)号：US20070172592A1
公开(公告)日：2007-07-26
申请号：US11262524
申请日：2005-10-28
申请人： Susan Trolier-McKinstry , Clive Randall , Hajime Nagata , Pascal Pinceloup , James Beeson , Daniel Skamser , Michael Randall , Azizuddin Tajuddin
发明人： Susan Trolier-McKinstry , Clive Randall , Hajime Nagata , Pascal Pinceloup , James Beeson , Daniel Skamser , Michael Randall , Azizuddin Tajuddin
IPC分类号： B05D5/00 , B05D3/08
CPC分类号： H01G4/33 , H01G4/1227 , H01G4/306
摘要： The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
摘要翻译：本发明涉及薄膜单层，电子部件如利用薄膜层的多层电容器及其制造方法。公开了介电层和电极层的化学溶液沉积和微接触印刷。通过微接触印刷和化学溶液沉积在Ni箔基板上制备高介电常数BaTiO 3 3多层薄膜电容器。制备具有BaTiO 3 N 3电介质层和LaNiO 3 N 3 N电极的多层电容器，使得电介质层的厚度为1μm或更小。使用介电层和电极层的前体溶液的微接触印刷。

4. 发明申请

US20070165360A1 Low inductance capacitor 有权
标题翻译：低电感电容
公开(公告)号：US20070165360A1
公开(公告)日：2007-07-19
申请号：US11334271
申请日：2006-01-18
申请人： Michael Randall , John Prymak , Azizuddin Tajuddin
发明人： Michael Randall , John Prymak , Azizuddin Tajuddin
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/30
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译：低电感多层电容器。电容器包括交错并联的内部电极板，其间具有电介质。每个内部电极板包括两个引出片，并且通常为T形。第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

5. 发明申请

US20060114639A1 REFRACTORY METAL NICKEL ELECTRODES FOR CAPACITORS 有权
标题翻译：电容器用金属镍电极
公开(公告)号：US20060114639A1
公开(公告)日：2006-06-01
申请号：US10998368
申请日：2004-11-29
申请人： Daniel Barber , Aiying Wang , Michael Randall , Azizuddin Tajuddin
发明人： Daniel Barber , Aiying Wang , Michael Randall , Azizuddin Tajuddin
IPC分类号： H01G4/06
CPC分类号： H01G4/0085 , H01G4/008 , H01G4/30
摘要： A capacitor with conductive layers arranged in parallel relationship. The conductive layers have nickel alloyed with a refractory metal in an amount sufficient to raise the melting temperature of said conductive layer at least 1° C. above the melting temperature of nickel. A dielectric layers is between the conductive layers. Alternating layers of said conductive layers are in electrical contact with external terminations of opposing polarity.
摘要翻译：具有导电层平行关系的电容器。导电层具有与难熔金属合金的镍，其量足以将所述导电层的熔融温度升高至高于镍的熔融温度至少1℃。电介质层位于导电层之间。所述导电层的交替层与相反极性的外部端子电接触。

6. 发明授权

US08717774B2 Electronic passive device 有权
标题翻译：电子无源器件
公开(公告)号：US08717774B2
公开(公告)日：2014-05-06
申请号：US13292267
申请日：2011-11-09
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H05K7/00
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个馈电电容器。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

7. 发明授权

US08414962B2 Microcontact printed thin film capacitors 有权
标题翻译：微接触式薄膜电容器
公开(公告)号：US08414962B2
公开(公告)日：2013-04-09
申请号：US11262524
申请日：2005-10-28
申请人： Susan Trolier McKinstry , Clive A. Randall , Hajime Nagata , Pascal I. Pinceloup , James J. Beeson , Daniel J. Skamser , Michael S. Randall , Azizuddin Tajuddin
发明人： Susan Trolier McKinstry , Clive A. Randall , Hajime Nagata , Pascal I. Pinceloup , James J. Beeson , Daniel J. Skamser , Michael S. Randall , Azizuddin Tajuddin
IPC分类号： B05D5/12
CPC分类号： H01G4/33 , H01G4/1227 , H01G4/306
摘要： The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
摘要翻译：本发明涉及薄膜单层，电子部件如利用薄膜层的多层电容器及其制造方法。公开了介电层和电极层的化学溶液沉积和微接触印刷。高介电常数BaTiO3多层薄膜电容器通过微接触印刷和化学溶液沉积在Ni箔基板上制备。制备具有BaTiO3电介质层和LaNiO3内部电极的多层电容器，使电介质层的厚度为1μm以下。使用介电层和电极层的前体溶液的微接触印刷。

8. 发明申请

US20120081870A1 ELECTRONIC PASSIVE DEVICE 有权
标题翻译：电子被动设备
公开(公告)号：US20120081870A1
公开(公告)日：2012-04-05
申请号：US13292267
申请日：2011-11-09
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H01R12/70
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个馈电电容器。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

9. 发明申请

US20080192452A1 Passive electronic device 审中-公开
标题翻译：被动电子设备
公开(公告)号：US20080192452A1
公开(公告)日：2008-08-14
申请号：US11705260
申请日：2007-02-12
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H05K7/00 , H05K1/16
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H05K2201/10704 , H05K2201/10734
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个电容器。电容器具有多个平行板，其间具有电介质。至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

10. 发明申请

US20070275158A1 C0G multi-layered ceramic capacitor 审中-公开
标题翻译： C0G多层陶瓷电容器
公开(公告)号：US20070275158A1
公开(公告)日：2007-11-29
申请号：US11809967
申请日：2007-06-04
申请人： Michael Randall , Corey Antoniades , Daniel Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Tom Poole , Azizuddin Tajuddin , Ian Burn
发明人： Michael Randall , Corey Antoniades , Daniel Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Tom Poole , Azizuddin Tajuddin , Ian Burn
IPC分类号： B05D5/12
CPC分类号： H01G4/1227 , C01G25/006 , C01G45/006 , C01P2002/50 , C01P2002/52 , C01P2004/62 , C04B35/486 , C04B35/49 , C04B35/6261 , C04B35/62635 , C04B35/62805 , C04B35/62807 , C04B35/62886 , C04B35/64 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3267 , C04B2235/3275 , C04B2235/3281 , C04B2235/3286 , C04B2235/3287 , C04B2235/3409 , C04B2235/3418 , C04B2235/5445 , C04B2235/6025 , C04B2235/6584 , C04B2235/663 , H01G4/1245 , H01G4/30
摘要： A dielectric ceramic composition in a multilayer ceramic capacitor having a composition of formula: ((CaO)t(SrO)1-t(ZrO2)v(TiO2)1-v)1-s-x-y-zAsExGyHz wherein: A is a transition metal oxide; E is an oxide of a group III or IV element; G is an oxide of a group II element; H is an oxide of a lanthamide; t is 0.50 to 0.90; v is 0.8 to 1.0; s is 0.0001 to 0.08; x is 0 to 0.08; y is 0 to 0.20; and z is 0 to 0.20.
摘要翻译：具有下式的组合物的多层陶瓷电容器中的介电陶瓷组合物：<？in-line-formula description =“In-line formula”end =“lead”→（（CaO） 1/2（1/2）1-v（2）＆lt;＆lt;＆gt;＆lt;＆lt;＆lt;＆gt;＆lt;＆lt; ？in-line-formula description =“In-line formula”end =“tail”？>其中：A是过渡金属氧化物; E是III或IV族元素的氧化物; G是II族元素的氧化物; H是花生酰胺的氧化物; t为0.50〜0.90; v为0.8〜1.0; s为0.0001〜0.08; x为0〜0.08; y为0〜0.20; z为0〜0.20。

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