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    • 1. 发明授权
    • Thermal head
    • 热头
    • US5781220A
    • 1998-07-14
    • US752554
    • 1996-11-20
    • Atsuo NishizonoHideo NoguchiKeijiro MinamiShinji HirataHitoshi TakaoKoji KatoTetsuji HyodoKazuyuki Itaki
    • Atsuo NishizonoHideo NoguchiKeijiro MinamiShinji HirataHitoshi TakaoKoji KatoTetsuji HyodoKazuyuki Itaki
    • B41J2/345
    • B41J2/345
    • The invention relates to a thermal head which comprises: a plurality of heating elements arranged at regular intervals on the top surface of an electrically insulating substrate; a common electrode connected to one ends of the respective heating elements; a plurality of discrete lead wires connected to the other ends of the respective heating elements and led out in directions at predetermined angles with respect to the direction of arrangement of the heating elements; and driving IC including a plurality of connecting pads arranged nearly parallel with the direction of arrangement of the heating elements and with intervals smaller than the intervals of arrangement of the heating elements, the connecting pads connected to lead-out sections of the discrete lead wires, wherein the connecting pads of the driving IC are arranged with intervals between the neighboring connecting pads which vary depending on the sine values of angles between the direction of arrangement of the heating elements and the lead-out directions of the respective discrete lead wires.
    • 本发明涉及一种热敏头,其特征在于,包括:在电绝缘基板的上表面上以规则间隔布置的多个加热元件; 连接到各个加热元件的一端的公共电极; 多个分立引线,其连接到各个加热元件的另一端并相对于加热元件的布置方向以预定角度被引导出; 以及驱动IC,其包括多个连接焊盘,所述多个连接焊盘与所述加热元件的布置方向几乎平行,并且间隔小于所述加热元件的布置间隔,所述连接焊盘连接到所述分立引线的引出部分, 其中驱动IC的连接焊盘以相邻的连接焊盘之间的间隔布置,这些间隔根据加热元件的布置方向和相应的分立引线的引出方向之间的角度的正弦值而变化。