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1. 发明申请

US20100207140A1 COMPACT MOLDED LED MODULE 审中-公开
标题翻译：紧凑型LED模组
公开(公告)号：US20100207140A1
公开(公告)日：2010-08-19
申请号：US12388525
申请日：2009-02-19
申请人： Serge Laurent RUDAZ , Serge BIERHUIZEN , Ashim Shatil HAQUE
发明人： Serge Laurent RUDAZ , Serge BIERHUIZEN , Ashim Shatil HAQUE
IPC分类号： H01L33/00 , H01L21/50
CPC分类号： H01L33/486 , G02B19/0028 , G02B19/0066 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a light emitting diode (LED) module molds an array of lens support frames over an array of connected lead frames. LEDs are bonded to the lead frame contacts within the support frames. Molded lenses are then affixed over each support frame, and the lead frames are diced to create individual LED modules. In another embodiment, the lenses are molded along with the support frames to create unitary pieces, and the support frames are affixed to the lead frames in the array of connected lead frames. In another embodiment, no lenses are used, and cups are molded with the lead frames so that the LED module is formed solely of the unitary lead frame/cup and the LED. Since each LED enclosure is formed of only one or two separate pieces, and the modules are fabricated on an array scale, the modules can be made very small and simply.
摘要翻译：形成发光二极管（LED）模块的方法在连接的引线框阵列上模制透镜支架的阵列。 LED在支撑框架内结合到引线框架触点。然后将模制的透镜固定在每个支撑框架上，并且引线框架被切割以形成单独的LED模块。在另一个实施例中，透镜与支撑框架一起模制以形成一体的部件，并且支撑框架固定到连接的引线框阵列中的引线框架上。在另一个实施例中，不使用透镜，并且用引线框模制杯子，使得LED模块仅由单一引线框架/杯和LED形成。由于每个LED外壳仅由一个或两个独立的部件形成，并且模块以阵列刻度尺制造，所以可以使模块非常小和简单。

2. 发明申请

US20080142833A1 Interconnects for semiconductor light emitting devices 审中-公开
公开(公告)号：US20080142833A1
公开(公告)日：2008-06-19
申请号：US12028925
申请日：2008-02-11
申请人： Stefano Schiaffino , Ashim Shatil Haque , Paul S. Martin , Daniel A. Steigerwald , Decai Sun
发明人： Stefano Schiaffino , Ashim Shatil Haque , Paul S. Martin , Daniel A. Steigerwald , Decai Sun
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/0095 , H01L33/20 , H01L33/38 , H01L2224/0603 , H01L2224/06102 , H01L2224/48091 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.

3. 发明授权

US07348212B2 Interconnects for semiconductor light emitting devices 有权
标题翻译：互连用于半导体发光器件
公开(公告)号：US07348212B2
公开(公告)日：2008-03-25
申请号：US11226151
申请日：2005-09-13
申请人： Stefano Schiaffino , Ashim Shatil Haque , Paul S. Martin , Daniel A. Steigerwald , Decai Sun
发明人： Stefano Schiaffino , Ashim Shatil Haque , Paul S. Martin , Daniel A. Steigerwald , Decai Sun
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/0095 , H01L33/20 , H01L33/38 , H01L2224/0603 , H01L2224/06102 , H01L2224/48091 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.
摘要翻译：包括设置在n型区域和p型区域之间的发光层和电连接到n型区域和p型区域的触点的半导体发光器件连接到安装件。任意图案化以覆盖半导体发光器件的面积的至少20％的金属层被镀在形成在安装件上的金属层或形成在其中一个触点上的金属层上。电镀金属层可以替代其他已知的互连技术，例如柱状凸块。半导体发光器件通过引起金属层的接触表面之间的相互扩散而物理连接到安装座。在一些实施例中，在电镀金属层上形成焊料层，然后半导体发光器件通过加热焊料物理连接到安装座。

4. 发明授权

US07791093B2 LED with particles in encapsulant for increased light extraction and non-yellow off-state color 有权
标题翻译： LED具有密封剂中的颗粒，用于增加光提取和非黄色截止色
公开(公告)号：US07791093B2
公开(公告)日：2010-09-07
申请号：US11849930
申请日：2007-09-04
申请人： Grigoriy Basin , Ashim Shatil Haque , Ching-hui Chen , Robert Scott West , Paul Martin
发明人： Grigoriy Basin , Ashim Shatil Haque , Ching-hui Chen , Robert Scott West , Paul Martin
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/16225 , H01L2933/0091 , H01L2924/00014
摘要： In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.
摘要翻译：在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。通常，大于5％的惰性材料的百分比开始降低光输出。如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

5. 发明申请

US20090057699A1 LED with Particles in Encapsulant for Increased Light Extraction and Non-Yellow Off-State Color 有权
标题翻译： LED用于增加光提取和非黄色关闭状态的密封剂中的颗粒
公开(公告)号：US20090057699A1
公开(公告)日：2009-03-05
申请号：US11849930
申请日：2007-09-04
申请人： Grigoriy Basin , Ashim Shatil Haque , Ching-hui Chen , Robert Scott West , Paul Martin
发明人： Grigoriy Basin , Ashim Shatil Haque , Ching-hui Chen , Robert Scott West , Paul Martin
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/16225 , H01L2933/0091 , H01L2924/00014
摘要： In one embodiment, sub-micron size granules of TiO2, ZrO2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant and applied over an LED. In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash in small cameras. The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.
摘要翻译：在一个实施方案中，将TiO 2，ZrO 2或其它白色非荧光剂惰性颗粒的亚微米尺寸颗粒与硅氧烷密封剂混合并涂覆在LED上。在一个实验中，当惰性材料占密封剂的约2.5-5重量％时，颗粒将GaN LED的光输出增加超过5％。通常，大于5％的惰性材料的百分比开始降低光输出。如果LED具有黄色的YAG荧光粉涂层，则当LED处于关闭状态时，密封剂中的白色颗粒使得LED显得更白，当LED用作小型相机中的白光闪光时，这是更令人愉快的颜色。颗粒的添加还减少了在LED上的视角和位置上的色温变化，这对于相机闪光和投影应用是重要的。

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