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    • 1. 发明授权
    • Dual stage pre-heater
    • 双级预热器
    • US06897410B1
    • 2005-05-24
    • US10703680
    • 2003-11-07
    • Albert HoMike CarlomagnoArtem Mishin
    • Albert HoMike CarlomagnoArtem Mishin
    • H05K13/04B23K1/012B23K1/018
    • H05K13/0486
    • A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises: a first stage configured to direct heat over a wide area of the printed circuit board; and a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
    • 一种电子部件处理系统,包括:被配置为保持印刷电路板的框架; 连接到所述框架的工具头,所述工具头被配置为将电子部件定位在所述印刷电路板的顶部上; 设置在所述工具头中的加热器,所述加热器构造成将热量引向所述电子部件; 连接到所述框架的双级预热器,所述双级预热器被配置为将热量引向所述印刷电路板,其中所述预热器包括:第一级,被配置为将热量引导到 印刷电路板; 以及第二级,被配置为加热邻近电子部件的印刷电路板的聚焦区域。
    • 8. 发明申请
    • DUAL STAGE PRE-HEATER
    • 双级预热器
    • US20050109757A1
    • 2005-05-26
    • US10703680
    • 2003-11-07
    • Albert HoMike CarlomagnoArtem Mishin
    • Albert HoMike CarlomagnoArtem Mishin
    • H05K13/04F27D11/00
    • H05K13/0486
    • A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises: a first stage configured to direct heat over a wide area of the printed circuit board; and a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
    • 一种电子部件处理系统,包括:被配置为保持印刷电路板的框架; 连接到所述框架的工具头,所述工具头被配置为将电子部件定位在所述印刷电路板的顶部上; 设置在所述工具头中的加热器,所述加热器构造成将热量引向所述电子部件; 连接到所述框架的双级预热器,所述双级预热器被配置为将热量引向所述印刷电路板,其中所述预热器包括:第一级,被配置为将热量引导到 印刷电路板; 以及第二级,被配置为加热邻近电子部件的印刷电路板的聚焦区域。