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    • 3. 发明申请
    • Multi-Layered Printed Circuit Board Comprising Conductive Test Surfaces, and Method for Determining a Misalignment of an Inner Layer
    • 包含导电测试表面的多层印刷电路板和确定内层的不对准的方法
    • US20080190651A1
    • 2008-08-14
    • US11883949
    • 2006-02-23
    • Arno KlammingerHeinz HabenbacherWilhelm Lobner
    • Arno KlammingerHeinz HabenbacherWilhelm Lobner
    • H05K1/00
    • H05K1/0268H05K3/429H05K3/4638H05K2201/09781H05K2203/166
    • The invention relates to a multi-layered printed circuit board (1) comprising conductive test surfaces (7) on at least one inner layer (2) for determining a possible misalignment of an inner layer or an inner layer structuring, the conductive test surfaces consisting of ring structures (7.i) which are arranged in a row and define inner non-conductive different-sized surfaces (8.i). The inventive printed circuit board also comprises metallised boreholes (5) in the region of the test surfaces. If there is no misalignment or only negligible misalignment, said boreholes (5) are located in the region of the inner, non-conductive surfaces (8.i). However, in the event of non-negligible misalignment, at least one borehole (5) is located in the region of one of the conductive ring structures (7.i) and thus comprises a conductive connection to the ring structure (7.i). The test surface ring structures (7.i) are divided into segments (a, b, c, d) in the peripheral direction, said segments (a, b, c, d) being separated from each other in the peripheral direction by non-conductive separating regions (9).
    • 本发明涉及一种多层印刷电路板(1),其包括在至少一个内层(2)上的导电测试表面(7),用于确定内层或内层结构的可能的未对准,导电测试表面 环形结构(7.i),其布置成一排并限定内部不导电的不同尺寸的表面(8.i)。 本发明的印刷电路板还包括在测试表面的区域中的金属化的钻孔(5)。 如果没有未对准或仅可忽略的未对准,则所述钻孔(5)位于内部非导电表面(8.i)的区域中。 然而,在不可忽视的未对准的情况下,至少一个钻孔(5)位于导电环结构(7.i)之一的区域中,并且因此包括与环结构(7a)的导电连接, 。 测试表面环结构(7.i)在圆周方向上分成段(a,b,c,d),所述段(a,b,c,d)在周向方向上彼此分离, 导电分离区域(9)。