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1. 发明授权

US06692111B2 Electrical interconnect for an inkjet die 失效
标题翻译：喷墨模具的电气互连
公开(公告)号：US06692111B2
公开(公告)日：2004-02-17
申请号：US10081802
申请日：2002-02-22
申请人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
发明人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
IPC分类号： B41S205
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1646
摘要： An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel. In a preferred embodiment of the current invention, the conductive material trace is substantially below the surface of the printhead thereby creating a robust printhead having several advantages including but not limited to: (1) electrical interconnects that are solidified in an encapsulant and therefore protected from chemical etching of the ink and vibrational/physical forces generated by the printer, (2) minimized die to printing medium distance and (3) minimized ESD effects on the beveled die.
摘要翻译：描述了一种用于包括喷墨半导体管芯的喷墨打印头的电互连。喷墨模具还包括具有相对的上表面，下表面和薄膜叠层的基板。基板的上表面在至少一个边缘上倾斜，使得斜面的下部在斜面的上部下方。导电材料迹线设置在上表面和薄膜堆叠的至少一部分的顶部上，并且朝向斜面的下部的斜面上。电导体在斜面的上部下方的预定位置处联接到导电材料迹线。在本发明的优选实施例中，导电材料迹线基本上在打印头的表面下方，从而形成具有若干优点的坚固的打印头，包括但不限于：（1）在密封剂中固化的电互连，油墨的化学蚀刻以及打印机产生的振动/物理力，（2）使模具与打印介质距离最小化，（3）最小化对斜面模具的ESD影响。

2. 发明授权

US06454955B1 Electrical interconnect for an inkjet die 失效
公开(公告)号：US06454955B1
公开(公告)日：2002-09-24
申请号：US09541122
申请日：2000-03-31
申请人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
发明人： Timothy E. Beerling , Marvin G. Wong , Wan Sin Ng , Juliana Arifin , Jiansan Sun , Arief Budiman Suriadi , Naoto Kawamura
IPC分类号： B41J204
CPC分类号： B41J2/1643 , B41J2/14024 , B41J2/14072 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1646 , B41J2202/20
摘要： An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel. In a preferred embodiment of the current invention, the conductive material trace is substantially below the surface of the printhead thereby creating a robust printhead having several advantages including but not limited to: (1) electrical interconnects that are solidified in an encapsulant and therefore protected from chemical etching of the ink and vibrational/physical forces generated by the printer, (2) minimized die to printing medium distance and (3) minimized ESD effects on the beveled die.

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