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1. 发明授权

US06940724B2 DC-DC converter implemented in a land grid array package 失效
标题翻译： DC-DC转换器实现在一个平面阵列封装中
公开(公告)号：US06940724B2
公开(公告)日：2005-09-06
申请号：US10691833
申请日：2003-10-22
申请人： Mysore Purushotham Divakar , David Keating , Antoin Russell
发明人： Mysore Purushotham Divakar , David Keating , Antoin Russell
IPC分类号： H01L23/48 , H01L23/36 , H01L23/367 , H01L23/538 , H01L25/16 , H02M3/00 , H02M3/10 , H02M3/158 , H05K7/20
CPC分类号： H01L25/165 , H01L23/36 , H01L23/3677 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/49111 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01077 , H01L2924/01078 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H02M3/00 , H02M3/10 , H02M3/1588 , Y02B70/1466 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/01033
摘要： A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC—DC converter is conducted out of the LGA package through the plurality of pads.
摘要翻译：一种半导体芯片封装，其包括用陆架网格阵列（LGA）封装实现的DC-DC转换器，用于互连和表面安装到印刷电路板。 LGA封装集成了DC-DC电源转换器的所有必需的有源组件，包括同步降压PWM控制器，驱动器电路和MOSFET器件。特别地，LGA封装包括具有顶表面和底表面的衬底，其中设置在衬底上的DC-DC转换器。所述DC-DC转换器包括设置在所述衬底的顶表面上的至少一个功率硅片。多个导电和导热焊盘设置在基板的底表面上，通过相应的导电通孔与DC-DC转换器电连通。所述多个焊盘包括具有第一表面区域的第一焊盘和具有第二表面区域的第二焊盘，所述第二表面区域基本上大于所述第一表面区域。由DC-DC转换器产生的热量通过多个焊盘从LGA封装中导出。

2. 发明申请

US20050052849A1 Arrangement for surface mounting of subassemblies on a mother board 有权
标题翻译：组件表面安装在母板上的布置
公开(公告)号：US20050052849A1
公开(公告)日：2005-03-10
申请号：US10715907
申请日：2003-11-18
申请人： David Keating , Antoin Russell , Mysore Divakar , Thomas Templeton , John Maxwell
发明人： David Keating , Antoin Russell , Mysore Divakar , Thomas Templeton , John Maxwell
IPC分类号： H01R20060101 , H01R43/02 , H05K7/20
CPC分类号： H01R12/52 , H01R12/57 , H01R12/7064 , H01R43/0263
摘要： The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.
摘要翻译：本发明提供了便于在具有可靠的高导电性互连的母板上表面安装子组件板的布置。根据本发明，子组件互连装置由形成在一个或多个底部集管上的分开的功率和感测连接臂构成。该布置将主组件板上的子组件板互连并支撑。每个动力臂有利地包括以共面构造固定到臂的多个基于分组的安装凸耳。每个感测连接器臂优选地包括以共面构造固定到臂的多个连接器销。公开了用于垂直和水平表面安装的实施例。

3. 发明授权

US06815614B1 Arrangement for co-planar vertical surface mounting of subassemblies on a mother board 有权
标题翻译：组件在母板上的共面垂直表面安装的布置
公开(公告)号：US06815614B1
公开(公告)日：2004-11-09
申请号：US10716134
申请日：2003-11-18
申请人： David Keating , Antoin Russell
发明人： David Keating , Antoin Russell
IPC分类号： H02G308
CPC分类号： H05K3/366 , H05K3/303 , H05K7/1431 , H05K2203/0195 , H05K2203/082
摘要： The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. A pickup cap attached at the board edge opposite the base permits pick-and-place positioning of the subassembly by conventional equipment without the need for special grippers.
摘要翻译：本发明提供了一种子组件，以便于子组件板的共面垂直表面安装。 “垂直安装”是指具有主表面的子组装电路板垂直于电路母板的主表面安装。根据本发明，用于共面垂直表面安装的子组件包括联接在一对基座之间的子组件板。有利地，一个基座头部包括以共平面构造固定到横向元件的多个安装凸耳。另一个基座头部方便地包括多个连接器销，该连接器销以共平面构造固定到细长的头部元件。两个头部与电路板互锁以提供连接和共面支撑。连接在与基座相对的板边缘处的拾取盖允许通过常规设备的子组件的拾取和定位定位，而不需要特殊的夹具。

4. 发明授权

US09996126B2 Configuration method for a power supply controller and a controller employing same 有权
公开(公告)号：US09996126B2
公开(公告)日：2018-06-12
申请号：US13878965
申请日：2011-09-20
申请人： Karl Rinne , Antoin Russell
发明人： Karl Rinne , Antoin Russell
IPC分类号： G06F19/00 , G06F1/26 , H02M3/156
CPC分类号： G06F1/26 , H02M3/156
摘要： The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

5. 发明授权

US07145085B2 Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board 有权
标题翻译：用于母板上的子组件的共面垂直表面安装的增强的连接布置
公开(公告)号：US07145085B2
公开(公告)日：2006-12-05
申请号：US10972488
申请日：2004-10-21
申请人： David Keating , Antoin Russell , Thomas H. Templeton, Jr. , Mysore Purushotham Divakar
发明人： David Keating , Antoin Russell , Thomas H. Templeton, Jr. , Mysore Purushotham Divakar
IPC分类号： H05K5/00
CPC分类号： H05K3/366 , H01R12/721 , H05K3/303 , H05K3/3421 , H05K7/1431 , H05K2201/10189 , H05K2201/10537 , H05K2203/0195 , H05K2203/082
摘要： The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.
摘要翻译：本发明提供了一种子组件，以便于子组件板的共面垂直表面安装。 “垂直安装”是指具有主表面的子组装电路板垂直于电路母板的主表面安装。根据本发明，用于共面垂直表面安装的子组件包括联接在一对基座之间的子组件板。有利地，一个基座头部包括以共平面构造固定到横向元件的多个安装凸耳。另一个基座头部方便地包括多个连接器销，该连接器销以共平面构造固定到细长的头部元件。两个头部与电路板互锁以提供连接和共面支撑。子组件板的边缘金属化可以提供与一个或多个凸耳的下面部分的增强的热或电连接。

6. 发明申请

US20060086522A1 Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board 有权
公开(公告)号：US20060086522A1
公开(公告)日：2006-04-27
申请号：US10972488
申请日：2004-10-21
申请人： David Keating , Antoin Russell , Thomas Templeton , Mysore Purushotham Divakar
发明人： David Keating , Antoin Russell , Thomas Templeton , Mysore Purushotham Divakar
IPC分类号： H05K5/00
CPC分类号： H05K3/366 , H01R12/721 , H05K3/303 , H05K3/3421 , H05K7/1431 , H05K2201/10189 , H05K2201/10537 , H05K2203/0195 , H05K2203/082
摘要： The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

7. 发明申请

US20050042941A1 CONNECTOR FOR SURFACE MOUNTING SUBASSEMBLIES VERTICALLY ON A MOTHER BOARD AND ASSEMBLIES COMPRISING THE SAME 失效
标题翻译：在主板上垂直安装底座的连接器和包括它的组件
公开(公告)号：US20050042941A1
公开(公告)日：2005-02-24
申请号：US10715908
申请日：2003-11-18
申请人： David Keating , Antoin Russell
发明人： David Keating , Antoin Russell
IPC分类号： H01R13/03 , H05K3/34 , H05K3/36 , H01R12/00
CPC分类号： H01R12/57 , H01R12/52 , H01R13/03 , H05K3/3405 , H05K3/3426 , H05K3/366 , H05K2201/1031 , Y02P70/611
摘要： In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board. With this mounting, problems of co-plurality are substantially eliminated, higher densities in the use of subassemblies can be achieved and low resistance, low inductance connection can be provided along with effective heat dissipation.
摘要翻译：根据本发明，提供了用于将一个电路装置垂直安装在另一电路装置上的表面安装连接器。 “垂直安装”是指具有主表面的电路装置垂直于另一个电路装置的主表面安装。连接器是导电体，其包括基部和横截面，所述基部具有大于横截面的宽度，并且延伸超过横截面的长度。有利地，基部在前部，后部和两侧延伸超过横截面。在典型的使用中，子组件的主表面可以连接到横截面，并且子组件的边缘可以连接到基部延伸部。然后可以将底座连接到母板。通过这种安装，基本上消除了共同的问题，可以实现使用子组件的更高的密度，并且可以提供低电阻，低电感连接以及有效的散热。

8. 发明授权

US08374008B2 Power converter 有权
标题翻译：电源转换器
公开(公告)号：US08374008B2
公开(公告)日：2013-02-12
申请号：US12687117
申请日：2010-01-13
申请人： Karl Rinne , Antoin Russell
发明人： Karl Rinne , Antoin Russell
IPC分类号： H02M7/00
CPC分类号： H02M3/1584 , H02M2003/1586
摘要： The present invention relates to power converters of the type known generally as switch mode power converters (SMPCs). In particular, the present invention addresses the problem of reducing thermal stress across the phases of a multi phase converter. Specifically, a method of controlling a multi-phase switch mode power arrangement is provided. The multi-phase arrangement comprises a plurality of phases configured to deliver DC power to a common load. The method comprises the steps of: determining the thermal stress of each phase along with at least one other stress for each phase and controlling the share of DC power provided by the individual phases in an effort to equalize the thermal and other stress across the individual phases.
摘要翻译：本发明涉及通常称为开关模式功率转换器（SMPC）的类型的功率转换器。特别地，本发明解决了降低多相转换器的相位上的热应力的问题。具体地，提供了一种控制多相开关模式电源装置的方法。多相装置包括被配置为向公共负载输送直流电力的多个相。该方法包括以下步骤：确定每个相的热应力以及每个相的至少一个其它应力，并且控制各相提供的直流电力的份额，以努力均衡各相之间的热应力和其他应力。

9. 发明授权

US06984156B2 Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same 失效
标题翻译：表面安装子组件的连接器垂直放置在母板上，以及包括该组件的组件
公开(公告)号：US06984156B2
公开(公告)日：2006-01-10
申请号：US10715908
申请日：2003-11-18
申请人： David Keating , Antoin Russell
发明人： David Keating , Antoin Russell
IPC分类号： H01R4/02
CPC分类号： H01R12/57 , H01R12/52 , H01R13/03 , H05K3/3405 , H05K3/3426 , H05K3/366 , H05K2201/1031 , Y02P70/611
摘要： In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board. With this mounting, problems of co-plurality are substantially eliminated, higher densities in the use of subassemblies can be achieved and low resistance, low inductance connection can be provided along with effective heat dissipation.
摘要翻译：根据本发明，提供了用于将一个电路装置垂直安装在另一电路装置上的表面安装连接器。 “垂直安装”是指具有主表面的电路装置垂直于另一个电路装置的主表面安装。连接器是导电体，其包括基部和横截面，所述基部具有大于横截面的宽度，并且延伸超过横截面的长度。有利地，基部在前部，后部和两侧延伸超过横截面。在典型的使用中，子组件的主表面可以连接到横截面，并且子组件的边缘可以连接到基部延伸部。然后可以将底座连接到母板。通过这种安装，基本上消除了共同的问题，可以实现使用子组件的更高的密度，并且可以提供低电阻，低电感连接以及有效的散热。

10. 发明授权

US06373726B1 Flyback converter with transistorized rectifier controlled by primary side control logic 失效
标题翻译：具有由初级侧控制逻辑控制的晶体管整流器的反激式转换器
公开(公告)号：US06373726B1
公开(公告)日：2002-04-16
申请号：US09494098
申请日：2000-01-28
申请人： Antoin Russell
发明人： Antoin Russell
IPC分类号： H02M3335
CPC分类号： H02M3/33507 , H02M3/33523 , H02M3/33592 , H02M2001/0006 , Y02B70/1475
摘要： The invention concerns a voltage converter of the flyback converter type, having a switching element on the primary side in relation to an inductor and an output capacitor on the secondary side which can be charged as a reaction to a current which flows in the inductor and which is switched by the switching element, said output capacitor being associated with a blocking element on the secondary side, wherein the blocking element is in the form of a further switching element which can be put into a blocking condition by a control signal, and there are provided control means for production on the primary side of the control signal, which are such that the control signal is produced a predetermined time interval before a conducting condition of the switching element on the primary side.
摘要翻译：本发明涉及一种反激式转换器类型的电压转换器，其具有相对于电感器的初级侧的开关元件和次级侧上的输出电容器，其可以作为对在电感器中流动的电流的反应而充电，并且其中由所述开关元件切换，所述输出电容器与次级侧上的阻断元件相关联，其中所述阻断元件为另一开关元件的形式，所述开关元件可通过控制信号进入阻塞状态，并且存在提供的控制装置，用于在控制信号的初级侧产生，使得在初级侧的开关元件的导通条件之前使控制信号产生预定的时间间隔。

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