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    • 2. 发明授权
    • Multi-phase back contacts for CIS solar cells
    • CIS太阳能电池的多相背触点
    • US5477088A
    • 1995-12-19
    • US60284
    • 1993-05-12
    • Angus A. RockettLi-Chung Yang
    • Angus A. RockettLi-Chung Yang
    • H01L31/0224H01L31/032H01L31/0336H01L23/48H01L29/46H01L29/62H01L29/64
    • H01L31/0749H01L31/022425H01L31/0322Y02E10/541
    • Multi-phase, single layer, non-interdiffusing M-Mo back contact metallized films, where M is selected from Cu, Ga, or mixtures thereof, for CIS cells are deposited by a sputtering process on suitable substrates, preferably glass or alumina, to prevent delamination of the CIS from the back contact layer. Typical CIS compositions include CuXSe.sub.2 where X is In or/and Ga. The multi-phase mixture is deposited on the substrate in a manner to provide a columnar microstructure, with micro-vein Cu or/and Ga regions which partially or fully vertically penetrate the entire back contact layer. The CIS semiconductor layer is then deposited by hybrid sputtering and evaporation process. The Cu/Ga-Mo deposition is controlled to produce the single layer two-phase columnar morphology with controllable Cu or Ga vein size less than about 0.01 microns in width. During the subsequent deposition of the CIS layer, the columnar Cu/Ga regions within the molybdenum of the Cu/Ga-Mo back layer tend to partially leach out, and are replaced by columns of CIS. Narrower Cu and/or Ga regions, and those with fewer inner connections between regions, leach out more slowly during the subsequent CIS deposition. This gives a good mechanical and electrical interlock of the CIS layer into the Cu/Ga-Mo back layer. Solar cells employing In-rich CIS semiconductors bonded to the multi-phase columnar microstructure back layer of this invention exhibit vastly improved photo-electrical conversion on the order of 17% greater than Mo alone, improved uniformity of output across the face of the cell, and greater Fill Factor.
    • 对于CIS电池,其中M选自Cu,Ga或其混合物的多相单层,非相互扩散的M-Mo背接触金属化膜通过溅射工艺沉积在合适的衬底上,优选玻璃或氧化铝上,至 防止CIS从背面接触层分层。 典型的CIS组合物包括CuXSe2,其中X是In或/和Ga。多相混合物以提供柱状微结构的方式沉积在基底上,其中微静脉Cu或/和Ga区域部分地或完全垂直地穿透 整个背面接触层。 然后通过混合溅射和蒸发过程沉积CIS半导体层。 控制Cu / Ga-Mo沉积以产生单层两相柱状形态,其可控的Cu或Ga静电尺寸的宽度小于约0.01微米。 在CIS层的随后沉积过程中,Cu / Ga-Mo背层的钼内的柱状Cu / Ga区倾向于部分浸出,并被CIS列所取代。 较窄的Cu和/或Ga区域,以及区域之间的内部连接较少的区域,在随后的CIS沉积期间较慢地浸出。 这使得CIS层进入Cu / Ga-Mo背层的良好机械和电气互锁。 使用与本发明的多相柱状微结构背层结合的富In CIS半导体的太阳能电池显示出大大提高了大约比单独Mo高17%的光电转换,提高了电池表面的输出均匀性, 和更大的填充因子。