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    • 1. 发明申请
    • LASER ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    • 激光组件及其制造方法
    • US20140269795A1
    • 2014-09-18
    • US13832671
    • 2013-03-15
    • Boyang LiuAndrew John DaiberYinan Wu
    • Boyang LiuAndrew John DaiberYinan Wu
    • H01S3/02
    • H01S5/02208H01S5/02284H01S5/02469H05K1/0203H05K1/18H05K2201/10121Y10T29/49124
    • A laser assembly and a method for manufacturing the same are provided according to embodiments of the present disclosure. The laser assembly (900) may comprise a first plate (903) having first projections (918, 928); a printed circuit board assembly (902) including a printed circuit board (912) having first openings (913, 915) and a laser module (100) thereon, and a second plate (901) having second projections (917, 927). The printed circuit board assembly (902) can be retained between the first plate (903) and the second plate (901) by the first projections (918, 928) and the second projections (917, 927). The laser assembly may further comprises a first pad (930) provided between the laser module (100) and the first plate (903) and/or a second pad (920) provided between the laser module (100) and the second plate (901). Any of the first pad (930) and the second pad (920) may be adaptable to be compressed, and adaptable to hold the laser module (100) or to hold the laser module (100) and to dissipate the heat from the laser module (100).
    • 根据本公开的实施例提供了激光组件及其制造方法。 激光组件(900)可以包括具有第一突起(918,928)的第一板(903); 包括其上具有第一开口(913,915)和激光模块(100)的印刷电路板(912)的印刷电路板组件(902)和具有第二突起(917,927)的第二板(901)。 印刷电路板组件(902)可以通过第一突起(918,928)和第二突起(917,927)保持在第一板(903)和第二板(901)之间。 激光组件还可以包括设置在激光模块(100)和第一板(903)之间的第一焊盘(930)和/或设置在激光模块(100)和第二板(901)之间的第二焊盘(920) )。 第一焊盘(930)和第二焊盘(920)中的任一个可以适于被压缩,并且适于保持激光模块(100)或保持激光模块(100)并且从激光模块 (100)。
    • 4. 发明申请
    • Small Packaged Tunable Laser
    • 小封装可调谐激光器
    • US20110032955A1
    • 2011-02-10
    • US12722825
    • 2010-03-12
    • Andrew John Daiber
    • Andrew John Daiber
    • H01S3/10H01S3/04
    • H01S5/02446H01S5/005H01S5/0064H01S5/02248H01S5/02284H01S5/02415H01S5/101H01S5/141
    • According to one embodiment, the present application includes a tunable laser configured in a small package. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing and configured to receive an information-containing electrical signal. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A tunable semiconductor laser is positioned in the interior space and operable to emit a laser beam having a selectable wavelength. A focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface.
    • 根据一个实施例,本申请包括配置在小包装中的可调谐激光器。 可调激光器包括具有由外壁形成的体积的壳体。 电输入接口位于壳体的第一端,并被配置为接收含信息的电信号。 光输出接口位于壳体的第二端,并被配置为传输连续波光束。 可调谐半导体激光器定位在内部空间中并且可操作地发射具有可选波长的激光束。 聚焦透镜组件沿着激光束的光路定位在内部空间中,以将激光束可操作地耦合到光输出接口。