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1. 发明申请

US20070228108A1 Repair Soldering Method for Repairing a Component Which Comprises a Base Material with an Oriented Microstructure 失效
标题翻译：用于修复包含具有定向微结构的基材的组分的修复焊接方法
公开(公告)号：US20070228108A1
公开(公告)日：2007-10-04
申请号：US10588024
申请日：2005-01-28
申请人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
发明人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
IPC分类号： B23K31/02
CPC分类号： F01D5/005 , B23K1/0008 , B23K1/0018 , B23K1/002 , B23K1/005 , B23K2101/001 , B23P6/007
摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
摘要翻译：本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。

2. 发明申请

US20060113009A1 High-temperature-resistant component and process for producing the high-temperature-resistant component 审中-公开
标题翻译：耐高温部件及高温部件的制造方法
公开(公告)号：US20060113009A1
公开(公告)日：2006-06-01
申请号：US11180839
申请日：2005-07-13
申请人： Ralf Burgel , Winfried Esser , Jorn Grossmann , Wolfgang Hermann , Hael Mughrabi , Jurgen Preuhs , Florian Pyczak , Alfred Scholz , Robert Singer , Andreas Volek
发明人： Ralf Burgel , Winfried Esser , Jorn Grossmann , Wolfgang Hermann , Hael Mughrabi , Jurgen Preuhs , Florian Pyczak , Alfred Scholz , Robert Singer , Andreas Volek
IPC分类号： C22C19/05
CPC分类号： C22C19/056 , C30B11/00 , C30B29/52
摘要： A high-temperature component made of a nickel super-alloy has the following composition in wt %: 11-13% of Cr, 3-5% of W, 0.5-2.5% of Mo, 3-5% of Al, 3-5% of Ti, 3-7% of Ta, 1-5% of Re and a remainder of nickel.
摘要翻译：由镍超合金制成的高温部件具有以下重量％的组成：Cr：11-13％，W：3-5％，Mo：0.5〜2.5％，Al：3- 5％的Ti，3-7％的Ta，1-5％的Re和剩余的镍。

3. 发明授权

US07967183B2 Repair soldering method for repairing a component which comprises a base material with an oriented microstructure 失效
标题翻译：用于修复包括具有取向微结构的基材的部件的修补焊接方法
公开(公告)号：US07967183B2
公开(公告)日：2011-06-28
申请号：US10588024
申请日：2005-01-28
申请人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
发明人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
IPC分类号： B23K31/02
CPC分类号： F01D5/005 , B23K1/0008 , B23K1/0018 , B23K1/002 , B23K1/005 , B23K2101/001 , B23P6/007
摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
摘要翻译：本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。

4. 发明申请

US20100000976A1 Process for Repairing a Component Comprising a Directional Microstructure by Setting a Temperature Gradient During the Laser Heat Action, and a Component Produced by Such a Process 失效
标题翻译：通过在激光热作用期间设定温度梯度来修复包含定向微结构的组分的方法和由这种方法产生的组分
公开(公告)号：US20100000976A1
公开(公告)日：2010-01-07
申请号：US11989214
申请日：2005-07-22
申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
发明人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
IPC分类号： B23K15/00 , B23K31/02 , B23K26/34
CPC分类号： B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
摘要： In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
摘要翻译：在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化要修理的位置。

5. 发明申请

US20090283572A1 Method for Repairing Cracks in Components and Solder Material for Soldering Components 有权
标题翻译：焊接部件组件和焊料的裂纹修复方法
公开(公告)号：US20090283572A1
公开(公告)日：2009-11-19
申请号：US12085277
申请日：2006-10-31
申请人： Andreas Volek
发明人： Andreas Volek
IPC分类号： B23K31/02 , B23K35/24
CPC分类号： B23K1/0018 , B23K1/19 , B23K35/3033 , B23K35/304 , B23K2101/001 , B23P6/007 , B23P6/045 , C22C19/056 , C22C19/057 , C22C19/058 , C22C19/07 , C22F1/10 , F05B2230/238 , F05B2230/80
摘要： The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.
摘要翻译：本发明涉及一种用于修复由超级合金组成的部件的方法，特别是用于修补由具有对准的微结构的超级合金组成的部件，使得修复的部位同样具有对准的微观结构。该方法包括以下步骤：将焊料材料施加到修复部位; 使用所施加的焊料材料的修复部位加热直到熔化; 并使熔化的焊料材料固化。焊料材料是与组分合金具有相同合金成分的合金。焊料材料组合物中的一种合金组分的至少一部分相对于组分合金组合物中该合金组分的分数进行改性，使得焊料材料的熔融温度相对于熔融温度降低的组分合金。

6. 发明授权

US08034154B2 Method for repairing cracks in components and solder material for soldering components 有权
标题翻译：用于修复焊接部件的部件和焊料的裂纹的方法
公开(公告)号：US08034154B2
公开(公告)日：2011-10-11
申请号：US12085545
申请日：2006-11-27
申请人： Robert Singer , Andreas Volek
发明人： Robert Singer , Andreas Volek
IPC分类号： B22F1/00 , B23K35/24
CPC分类号： B23K1/0018 , B23K1/19 , B23K35/0244 , B23K35/3033 , B23K35/304 , B23K35/3053 , B23K2101/001 , B23P6/007 , B23P6/045 , C21D9/50 , C22C19/05 , C22C19/07 , C22F1/10 , F05B2230/238 , F05B2230/80
摘要： The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.
摘要翻译：本发明涉及一种用于修复由超级合金组成的部件的方法。该方法包括以下步骤：将焊料材料施加到修复部位; 使用所施加的焊料材料的修复部位加热直到熔化; 并使熔化的焊料材料固化。平均组成对应于组分合金的粉末混合物构成焊料材料，该共混物包括作为一种粉末类型的组分合金的至少一种基本粉末和/或组分合金的预合金。

7. 发明授权

US09780345B2 Device for electrically interconnecting cells in a battery pack by means of cell connectors and battery pack with such cell connectors 有权
公开(公告)号：US09780345B2
公开(公告)日：2017-10-03
申请号：US13499801
申请日：2010-09-30
申请人： Harald Heck , Andreas Volek , Ralf Hojda , Uwe Marx , Harald Wich , Rolf Pechloff , Frank Warmuth , Dirk Hopsch , Jörg Seybold , Hubertus Goesmann , Philipp Petz , Axelle Hauck
发明人： Harald Heck , Andreas Volek , Ralf Hojda , Uwe Marx , Harald Wich , Rolf Pechloff , Frank Warmuth , Dirk Hopsch , Jörg Seybold , Hubertus Goesmann , Philipp Petz , Axelle Hauck
IPC分类号： H01M2/20 , H01M10/04 , H01M2/10 , H01M10/42
CPC分类号： H01M2/1077 , H01M2/206 , H01M10/425
摘要： A device for electrical interconnection of cells of a battery pack through cell connectors, and a battery pack having the device and the cell connectors are provided. A plurality of cell connectors for connection of at least two cell poles are fitted on a mounting plate, electrically isolated from one another. Each cell connector has at least one flexible bracket which extends away from a connection area. The flexible brackets are coupled to the connection area through a resilient structure having a meandering shape.

8. 发明授权

US08141769B2 Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process 失效
标题翻译：通过在激光加热动作期间设定温度梯度来修复包括定向微结构的部件的工艺，以及通过这种工艺制造的部件
公开(公告)号：US08141769B2
公开(公告)日：2012-03-27
申请号：US11989214
申请日：2005-07-22
申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
发明人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
IPC分类号： B23K26/34 , B23K31/02
CPC分类号： B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
摘要： In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
摘要翻译：在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化要修理的位置。

9. 发明申请

US20120231320A1 DEVICE FOR ELECTRICALLY INTERCONNECTING CELLS IN A BATTERY PACK BY MEANS OF CELL CONNECTORS AND BATTERY PACK WITH SUCH CELL CONNECTORS 有权
标题翻译：用于通过单元连接器和具有这种单元连接器的电池组电池互连电池的装置
公开(公告)号：US20120231320A1
公开(公告)日：2012-09-13
申请号：US13499801
申请日：2010-09-30
申请人： Harald Heck , Andreas Volek , Ralf Hojda , Uwe Marx , Harald Wich , Rolf Pechloff , Frank Warmuth , Dirk Hopsch , Jörg Seybold , Hubertus Goesmann , Philipp Petz , Axelle Hauck
发明人： Harald Heck , Andreas Volek , Ralf Hojda , Uwe Marx , Harald Wich , Rolf Pechloff , Frank Warmuth , Dirk Hopsch , Jörg Seybold , Hubertus Goesmann , Philipp Petz , Axelle Hauck
IPC分类号： H01M2/20 , H01M10/04 , H01M2/10
CPC分类号： H01M2/1077 , H01M2/206 , H01M10/425
摘要： A device for electrical interconnection of cells (12) of a battery pack (11) by means of cell connectors (15) and a battery pack (11) having such cell connectors (15) are distinguished as being convenient for assembly and functionally reliable in that at least one mounting plate (16), which can be latched on the battery pack (11) in a mounting frame (17), is fitted with cell connectors (15) which are electrically isolated from one another, on the basis of the geometric requirement of cell poles (13) to be interconnected to one another, which cell connectors (15) each have flexible brackets (19) for their apex areas (23) to make elastic contact with the end surfaces (26) of cell poles (13). The brackets (19), which are supported by one flank in the form of a flexible spring on the mounting plate (16), are part of a stamped grid, which also comprises conductor tracks (32) which are integrally connected thereto, for example for connection of a battery management means. Preferably, holes (25) are stamped into the bracket apex areas (23), along the contours of which holes (25) the brackets (19) are connected, in particular laser-welded, in a force-fitting or integral manner, to the cell pole end surfaces (26), once the mounting plate (16) has been fitted to the cells (12). For this purpose, the mounting plate (16) has aperture openings (27), which are in contrast larger, coaxially with respect to those holes (25).
摘要翻译：用于通过电池连接器（15）和具有这种电池连接器（15）的电池组（11）电池组（11）的电池（12）的电互连的装置被区分为便于组装和功能可靠至少一个能够在安装框架（17）中锁定在电池组（11）上的安装板（16）装配有电池连接器（15），电池连接器（15）基于单元电极（13）彼此互连的几何要求，每个单元连接器（15）各自具有用于它们的顶点区域（23）的柔性支架（19）以与电池极的端面（26）弹性接触 13）。由安装板（16）上的柔性弹簧形式的一个侧面支撑的支架（19）是冲压格栅的一部分，其也包括与其整体连接的导体轨道（32），例如用于连接电池管理装置。优选地，孔（25）沿着支架（19）的孔（25）的轮廓，特别是激光焊接，以配合或整体的方式被冲压到支架顶点区域（23）中，到电池极端表面（26），一旦安装板（16）已经装配到电池（12）上。为此，安装板（16）具有相对于这些孔（25）同轴的孔径开口（27）。

10. 发明授权

US07887748B2 Solder material for soldering components 有权
标题翻译：用于焊接部件的焊料
公开(公告)号：US07887748B2
公开(公告)日：2011-02-15
申请号：US12085277
申请日：2006-10-31
申请人： Andreas Volek
发明人： Andreas Volek
IPC分类号： C22C19/05
CPC分类号： B23K1/0018 , B23K1/19 , B23K35/3033 , B23K35/304 , B23K2101/001 , B23P6/007 , B23P6/045 , C22C19/056 , C22C19/057 , C22C19/058 , C22C19/07 , C22F1/10 , F05B2230/238 , F05B2230/80
摘要： The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.
摘要翻译：本发明涉及一种用于修复由超级合金组成的部件的方法，特别是用于修补由具有对准的微结构的超级合金组成的部件，使得修复的部位同样具有对准的微观结构。该方法包括以下步骤：将焊料材料施加到修复部位; 使用所施加的焊料材料的修复部位加热直到熔化; 并使熔化的焊料材料固化。焊料材料是与组分合金具有相同合金成分的合金。焊料材料组合物中的一种合金组分的至少一部分相对于组分合金组合物中该合金组分的分数进行改性，使得焊料材料的熔融温度相对于熔融温度降低的组分合金。

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