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    • 1. 发明授权
    • Light emitting diode with a step section between the base and the lens of the diode
    • 发光二极管,其基极与二极管的透镜之间具有台阶
    • US07470936B2
    • 2008-12-30
    • US11684473
    • 2007-03-09
    • Akira Takekuma
    • Akira Takekuma
    • H01L29/26
    • H01L33/58H01L33/486H01L2924/0002H01L2924/00
    • It is to be made easy to arrange light emitting diodes, each including a lens having a hemispherical light emitting surface, and cover the base of the light emitting diodes with resin material.A light emitting diode 1 has a light emitting element 2, a lead section 3 that supplies power to the light emitting element 2, a base 4 that covers the lead section 3, a lens 5 having a convex light emitting surface and connected to the base 4 to cover the light emitting element 2, and a step section 6 disposed such that it surrounds the outer side of the lens 5, part of the step 6 having a different width. The step section 6 has a height that defines the amount of resin material enough to cover the lead section 3. There is also provided a light emitting diode display device 10 using a plurality of such light emitting diodes.
    • 可以容易地布置发光二极管,每个发光二极管包括具有半球形发光表面的透镜,并用树脂材料覆盖发光二极管的基部。 发光二极管1具有发光元件2,向发光元件2供电的引线部3,覆盖引线部3的基座4,具有凸出的发光面的透镜5,并与基座 4,覆盖发光元件2;以及台阶部6,其布置成使得其包围透镜5的外侧,台阶6的一部分具有不同的宽度。 步骤部分6具有限定足以覆盖引线部分3的树脂材料的量的高度。还提供了使用多个这种发光二极管的发光二极管显示装置10。
    • 7. 发明授权
    • Opto-electronic package, and methods and systems for making and using same
    • 光电子封装,以及制造和使用相同的方法和系统
    • US07311420B2
    • 2007-12-25
    • US11208834
    • 2005-08-22
    • Siew Kim TanSundar YoganandanAkira Takekuma
    • Siew Kim TanSundar YoganandanAkira Takekuma
    • F21V11/00
    • F21K9/00H01L25/0753H01L2224/48091Y10S362/80H01L2924/00014H01L2924/00
    • In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.
    • 在一个实施例中,光电子封装包括衬底,空腔,安装焊盘和沿着空腔散布的横向壁,由横向壁分隔的焊盘以及比空腔限定壁低的横向壁; 和LED骰子安装在垫上。 在另一个实施例中,公开了一种用于背光LCD屏幕的系统。 该系统包括具有基板的光电子封装; LED芯片安装在基板上; 设置在LED骰子上的密封剂; 以及导光体,其具有用于接收由LED芯片提供的光的输入部分,附着到密封剂的输入部分和被配置为将光传输到LCD屏幕的输出部分。 在又一个实施例中,制造光电封装的方法包括:制造衬底; 将LED骰子连接到基板上; 将每个LED晶片电连接到所述衬底的外部; 并将密封剂放置在LED骰子上。
    • 9. 发明授权
    • Light-emitting diode
    • 发光二极管
    • US06617617B2
    • 2003-09-09
    • US09929332
    • 2001-08-14
    • Akira TakekumaShunichi Ishikawa
    • Akira TakekumaShunichi Ishikawa
    • H01L3300
    • H01L33/62H01L2224/16H01L2924/12041
    • A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.
    • LED芯片不会被破坏的发光二极管包括安装在发光二极管内的板状布线装置60上的LED芯片40。 导线装置60包括电导向一对相对表面的导电通路61和62。 上表面用于安装LED芯片。 导电路径61,62的一部分电连接到LED芯片40,从LED被安装的位置延伸到引线21和22,它们通过焊接连接到它们。 此时,LED芯片40被保持在一个引​​线21内的凹部23内。