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    • 3. 发明授权
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法相同
    • US08492904B2
    • 2013-07-23
    • US12762697
    • 2010-04-19
    • Akira Fujihara
    • Akira Fujihara
    • H01L23/522H01L21/764H01L23/535H01L21/768
    • H01L23/4824H01L23/4821H01L2924/0002H01L2924/3011H01L2924/00
    • One aspect of the present invention is a semiconductor device including: a semiconductor substrate; a first wiring that is formed on the semiconductor substrate; a second wiring that is formed to cross over the first wiring with a space interposed therebetween at a cross portion in which the first wiring and the second wiring cross each other; a protective film that is formed on the semiconductor substrate to cover at least a part of the first wiring, the part being located under the second wiring in the cross portion; and an insulator film that is formed in an island shape on the protective film under the second wiring in the cross portion to be located between edges of the protective film and to cover the first wiring in the cross portion.
    • 本发明的一个方面是一种半导体器件,包括:半导体衬底; 形成在所述半导体基板上的第一布线; 第二布线,其形成为在第一布线和第二布线彼此交叉的交叉部分处跨过第一布线而间隔开的空间; 形成在所述半导体基板上以覆盖所述第一布线的至少一部分的所述保护膜,所述部分位于所述第二布线的所述十字部分的下方; 以及绝缘体膜,其形成为岛状,位于保护膜的边缘之间的第二布线的保护膜下方,并且覆盖该十字部分中的第一布线。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    • 半导体器件及其制造方法
    • US20100270687A1
    • 2010-10-28
    • US12762697
    • 2010-04-19
    • Akira FUJIHARA
    • Akira FUJIHARA
    • H01L23/522H01L21/768
    • H01L23/4824H01L23/4821H01L2924/0002H01L2924/3011H01L2924/00
    • One aspect of the present invention is a semiconductor device including: a semiconductor substrate; a first wiring that is formed on the semiconductor substrate; a second wiring that is formed to cross over the first wiring with a space interposed therebetween at a cross portion in which the first wiring and the second wiring cross each other; a protective film that is formed on the semiconductor substrate to cover at least a part of the first wiring, the part being located under the second wiring in the cross portion; and an insulator film that is formed in an island shape on the protective film under the second wiring in the cross portion to be located between edges of the protective film and to cover the first wiring in the cross portion.
    • 本发明的一个方面是一种半导体器件,包括:半导体衬底; 形成在所述半导体基板上的第一布线; 第二布线,其形成为在第一布线和第二布线彼此交叉的交叉部分处跨过第一布线而间隔开的空间; 形成在所述半导体基板上以覆盖所述第一布线的至少一部分的所述保护膜,所述部分位于所述第二布线的所述十字部分的下方; 以及绝缘体膜,其形成为岛状,位于保护膜的边缘之间的第二布线的保护膜下方,并且覆盖该十字部分中的第一布线。