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    • 1. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US08058124B2
    • 2011-11-15
    • US12759091
    • 2010-04-13
    • Masataka OnoAkiko Fujita
    • Masataka OnoAkiko Fujita
    • H01L21/8249
    • H01L29/66242
    • The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
    • 提供了提供减小的电流泄漏和寄生电阻以实现稳定的电流增益的半导体器件。 在由含有p型多晶硅膜和氮化硅膜的多层膜构成的遮阳板部分的下表面露出的p型多晶硅膜上生长第一多晶半导体层,同时生长第一半导体 层,然后选择性地去除第一多晶半导体层。 此外,第二种生长操作用于在不接触氮化硅膜的情况下在露出在遮阳板部分的下表面的p型多晶半导体膜的暴露部分上选择性地生长第二多晶半导体层和第三多晶半导体层,同时生长 第二半导体层和第三半导体层,使得第三半导体层与第三多晶半导体层接触。
    • 3. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20100197122A1
    • 2010-08-05
    • US12759091
    • 2010-04-13
    • Masataka ONOAkiko FUJITA
    • Masataka ONOAkiko FUJITA
    • H01L21/20H01L21/36
    • H01L29/66242
    • The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
    • 提供了提供减小的电流泄漏和寄生电阻以实现稳定的电流增益的半导体器件。 在由含有p型多晶硅膜和氮化硅膜的多层膜构成的遮阳板部分的下表面露出的p型多晶硅膜上生长第一多晶半导体层,同时生长第一半导体 层,然后选择性地去除第一多晶半导体层。 此外,第二种生长操作用于在不接触氮化硅膜的情况下在露出在遮阳板部分的下表面的p型多晶半导体膜的暴露部分上选择性地生长第二多晶半导体层和第三多晶半导体层,同时生长 第二半导体层和第三半导体层,使得第三半导体层与第三多晶半导体层接触。
    • 4. 发明授权
    • Semiconductor device and method for manufacturing same
    • 半导体装置及其制造方法
    • US07728358B2
    • 2010-06-01
    • US12187619
    • 2008-08-07
    • Masataka OnoAkiko Fujita
    • Masataka OnoAkiko Fujita
    • H01L31/072H01L31/109
    • H01L29/66242
    • The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
    • 提供了提供减小的电流泄漏和寄生电阻以实现稳定的电流增益的半导体器件。 在由含有p型多晶硅膜和氮化硅膜的多层膜构成的遮阳板部分的下表面露出的p型多晶硅膜上生长第一多晶半导体层,同时生长第一半导体 层,然后选择性地去除第一多晶半导体层。 此外,第二种生长操作用于在不接触氮化硅膜的情况下在露出在遮阳板部分的下表面的p型多晶半导体膜的暴露部分上选择性地生长第二多晶半导体层和第三多晶半导体层,同时生长 第二半导体层和第三半导体层,使得第三半导体层与第三多晶半导体层接触。
    • 5. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20090039393A1
    • 2009-02-12
    • US12187619
    • 2008-08-07
    • Masataka ONOAkiko FUJITA
    • Masataka ONOAkiko FUJITA
    • H01L29/00H01L21/20
    • H01L29/66242
    • The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
    • 提供了提供减小的电流泄漏和寄生电阻以实现稳定的电流增益的半导体器件。 在由含有p型多晶硅膜和氮化硅膜的多层膜构成的遮阳板部分的下表面露出的p型多晶硅膜上生长第一多晶半导体层,同时生长第一半导体 层,然后选择性地去除第一多晶半导体层。 此外,第二种生长操作用于在不接触氮化硅膜的情况下在露出在遮阳板部分的下表面的p型多晶半导体膜的暴露部分上选择性地生长第二多晶半导体层和第三多晶半导体层,同时生长 第二半导体层和第三半导体层,使得第三半导体层与第三多晶半导体层接触。