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1. 发明授权

US11774669B1 Edge-lit solid-state lighting apparatus 有权
公开(公告)号：US11774669B1
公开(公告)日：2023-10-03
申请号：US18085321
申请日：2022-12-20
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： David Neuman
IPC分类号： F21V8/00
CPC分类号： G02B6/0083 , G02B6/009
摘要： A lighting apparatus includes an elongate substrate, a supply rail disposed on one surface of the substrate, and first and second ground rails disposed on the other surface. SSL packages are disposed parallel to the longitudinal axis of the substrate and between the first and second ground rails. Each package has SSL elements disposed on a first side and pairs of contact pads disposed on a second side. The SSL packages are serially coupled from the first package to the last package. One contact pad of each pair of the contact pads of the first package is coupled to the supply rail through the substrate, one contact pad of a first pair of the pairs of contact pads of the last package is coupled to the first ground rail at the first surface of the substrate, and one contact pad of a second pair of the pairs of contact pads of the last package is coupled to the second ground rail at the first surface of the substrate.

2. 发明授权

US11561339B1 Edge-lit solid-state lighting apparatus 有权
公开(公告)号：US11561339B1
公开(公告)日：2023-01-24
申请号：US17185232
申请日：2021-02-25
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： David Neuman
IPC分类号： F21V8/00
摘要： A lighting apparatus includes a flexible elongate substrate, a supply rail disposed on one surface of the substrate, and first and second ground rails disposed on the other surface. Groups of SSL packages are disposed parallel to the longitudinal axis of the substrate and between the first and second ground rails. Each package has SSL elements disposed on a first side and pairs of contact pads disposed on a second side. The SSL packages in each group are serially coupled from the first package to the last package of the group. One contact pad of each pair of the contact pads of the first package of each group is coupled to the supply rail through the substrate, one contact pad of a first pair of the pairs of contact pads of the last package of each group is coupled to the first ground rail at the first surface of the substrate, and one contact pad of a second pair of the pairs of contact pads of the last package of each group is coupled to the second ground rail at the first surface of the substrate.

3. 发明授权

US10949631B1 Multi-part RF transponder and multi-way engagement signaling 有权
公开(公告)号：US10949631B1
公开(公告)日：2021-03-16
申请号：US16672894
申请日：2019-11-04
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Kimmo Kyllonen
IPC分类号： G06K7/10 , H01Q21/28
摘要： A disclosed transponder arrangement includes a transponder integrated circuit (IC), an inductive loop, and a dipole antenna. First and second wires are coupled to the transponder IC and have portions configured for different levels of electrical coupling between one another. Engagement of the inductive loop with an induction portion of the dipole antenna induces current flow in the inductive loop in response to the dipole antenna resonating from a radio frequency (RF) signal, and disengagement makes the transponder IC non-responsive to the RF signal. Depending on a level of electrical coupling between the first and second wires, the transponder IC generates an RF signal that encodes either a first value indicating partial engagement or a second value indicating full engagement in response to the current flow in the inductive loop.

4. 发明授权

US10655823B1 SSL lighting apparatus 有权
公开(公告)号：US10655823B1
公开(公告)日：2020-05-19
申请号：US16266546
申请日：2019-02-04
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Scott Lindblad , Aaron M. Anderson
IPC分类号： F21V19/00 , F21V8/00 , F21Y115/15
摘要： A lighting apparatus includes a light-diffusive panel that has opposing first and second faces bounded by one or more sides. A first conductor is disposed on the first face of the light-diffusive panel and proximate a first side of the one or more sides. A second conductor is disposed on the second face of the light-diffusive panel and proximate the first side. A first plurality of solid-state lighting (SSL) elements have light emitting portions that face a second side that is adjacent to the first side of the light-diffusive panel. The first plurality of SSL elements are electrically coupled to the first conductor and to the second conductor.

5. 发明授权

US09989223B1 LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive 有权
公开(公告)号：US09989223B1
公开(公告)日：2018-06-05
申请号：US14642329
申请日：2015-03-09
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Scott Lindblad , David Neuman
IPC分类号： F21V23/00 , F21V19/00 , F21K99/00 , H01L27/15 , F21Y101/02 , F21Y105/00
CPC分类号： F21V19/005 , F21K9/30 , F21S8/026 , F21V19/0025 , F21V23/001 , F21Y2101/02 , F21Y2105/001 , F21Y2105/16 , F21Y2115/10 , H01L27/153
摘要： A disclosed lighting apparatus includes a support structure having a sheet metal member. The sheet metal member has a first surface. An adhesive layer is directly attached to the first surface of the sheet metal member. A plurality of light-emitting diode (LED) components are attached to the sheet metal member by the adhesive layer. A plurality of wires are attached to the sheet metal member by the adhesive layer and are coupled to the plurality of LED components for providing power to the LED components.

6. 发明授权

US09900992B1 Wire bonded electronic devices to round wire 有权
公开(公告)号：US09900992B1
公开(公告)日：2018-02-20
申请号：US15401143
申请日：2017-01-09
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Robert Neuman
IPC分类号： H01L33/62 , H05K3/32
CPC分类号： H05K3/32 , H01L21/4846 , H01L21/4853 , H01L21/56 , H01L21/563 , H01L23/3135 , H01L23/3157 , H01L23/4985 , H01L23/49883 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/45147 , H01L2224/48106 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/85201 , H01L2224/85423 , H01L2224/85447 , H01L2224/85801 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/1205 , H01L2924/1207 , H01L2924/1421 , H01L2933/005 , H01L2933/0066 , H05K1/189 , H05K3/284 , H05K3/321 , H05K3/3426 , H05K2201/0145 , H05K2201/0154 , H05K2201/10098 , H05K2201/10106 , H05K2203/049 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

7. 发明授权

US09870529B1 Transponder wire bonded to round wire on adhesive tape having a water-soluble backing 有权
公开(公告)号：US09870529B1
公开(公告)日：2018-01-16
申请号：US15416664
申请日：2017-01-26
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Robert Neuman
IPC分类号： G06K19/06 , G06K19/077 , H05K1/18 , H05K1/11 , H05K3/40 , H05K3/32 , H05K3/28
CPC分类号： G06K19/0775 , G06K19/07747 , H05K1/111 , H05K1/181 , H05K3/28 , H05K3/32 , H05K3/328 , H05K3/4007 , H05K2201/10098
摘要： A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

8. 发明授权

US09595501B1 Wire bonded electronic devices to round wire 有权
标题翻译：线接电子设备到圆线
公开(公告)号：US09595501B1
公开(公告)日：2017-03-14
申请号：US14928289
申请日：2015-10-30
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Robert Neuman
IPC分类号： H01L23/31 , H01L23/49 , H01L33/48 , H01L33/54 , H01L33/62 , H01L23/00 , H05K1/18 , H05K3/30 , H05K3/34 , H05K1/11 , H05K3/20 , H05K1/03 , H01L23/498 , H01L21/56 , H01L21/48
CPC分类号： H05K3/32 , H01L21/4846 , H01L21/4853 , H01L21/56 , H01L21/563 , H01L23/3135 , H01L23/3157 , H01L23/4985 , H01L23/49883 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/45147 , H01L2224/48106 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/85201 , H01L2224/85423 , H01L2224/85447 , H01L2224/85801 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/1205 , H01L2924/1207 , H01L2924/1421 , H01L2933/005 , H01L2933/0066 , H05K1/189 , H05K3/284 , H05K3/321 , H05K3/3426 , H05K2201/0145 , H05K2201/0154 , H05K2201/10098 , H05K2201/10106 , H05K2203/049 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
摘要翻译：所公开的电路装置包括柔性基板。压敏粘合剂层（PSA）直接粘附到基材的第一主表面。一个或多个金属箔垫和导电线直接附着在PSA层的表面上。导线具有圆形横截面，并且一个或多个部分分别直接连接到具有一个或多个焊接接头的一个或多个金属箔垫。电子器件直接附着在PSA层的表面上，并分别通过一根或多根接合线与圆形线的一个或多个部分电连接。

9. 发明授权

US09565752B1 Wire bonded electronic devices to round wire 有权
标题翻译：线接电子设备到圆线
公开(公告)号：US09565752B1
公开(公告)日：2017-02-07
申请号：US14737268
申请日：2015-06-11
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Robert Neuman , Scott Lindblad
IPC分类号： H01Q1/00 , H05K1/02 , H01Q1/50 , F21V23/00 , H05K1/03 , H05K1/09 , F21K99/00 , H05K3/10 , H05K3/32 , F21Y101/02
CPC分类号： H05K1/028 , F21Y2115/10 , H01Q1/2208 , H01Q7/00 , H05K1/032 , H05K1/0386 , H05K1/0393 , H05K1/09 , H05K3/103 , H05K3/32 , H05K2201/0145 , H05K2201/0158 , H05K2201/10098 , H05K2201/10106 , H05K2201/10287 , H05K2203/049
摘要： A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.
摘要翻译：所公开的电路装置包括衬底，附着到衬底的集成电路（IC）部件，附接到衬底并设置在电子器件附近的第一和第二交叉线以及附接到衬底的一个或多个线段。一个或多个线段具有分别在第一十字线的第三部分和第二十字线的第四部分附接的第一和第二部分。第一和第二十字线和一个或多个线段是具有圆形横截面的圆形线。第一部分和第三部分具有平坦的接触区域，并且第二和第四部分具有平坦的接触区域。第一接合线连接到电子设备和一个或多个线段的第一部分，并且第二接合线连接到电子设备和一个或多个线段的第二部分。

10. 发明授权

US09128222B1 LED lighting apparatus 有权
标题翻译： LED照明装置
公开(公告)号：US09128222B1
公开(公告)日：2015-09-08
申请号：US13945004
申请日：2013-07-18
申请人： AUTOMATED ASSEMBLY CORPORATION
发明人： Scott Linblad , Matthew Odden
IPC分类号： F21V8/00 , H01L33/52
CPC分类号： G02B6/0083 , G02B6/0021 , G02B6/0068
摘要： A lighting apparatus includes a light-diffusive plate having opposing faces bounded by one or more sides. The plate has disruptions on a first face of the opposing faces and a first channel along at least a portion of a first side of the one or more sides. A first cover has first and second surfaces disposed over the first channel with the first surface facing the first side of the light-diffusive plate. A plurality of light-emitting diodes (LEDs) is disposed on the first surface of the first cover and within the first channel. The LEDs electrically coupled with wiring are integrated with the first cover.
摘要翻译：照明装置包括具有由一个或多个侧面限定的相对面的光漫射板。板在相对面的第一面上具有中断，沿着一个或多个侧的第一侧的至少一部分具有第一通道。第一盖具有设置在第一通道上方的第一和第二表面，其中第一表面面向光扩散板的第一侧。多个发光二极管（LED）设置在第一盖的第一表面上并在第一通道内。与配线电耦合的LED与第一盖集成。

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