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    • 2. 发明授权
    • Method for producing an infrared light detector
    • 红外光检测器的制造方法
    • US08987035B2
    • 2015-03-24
    • US13518667
    • 2010-12-21
    • Ron LairdScott FreebornArchie Shaw Stewart
    • Ron LairdScott FreebornArchie Shaw Stewart
    • H01L31/18H01L27/146H05K3/34H01L23/00H01L31/0203H01L31/101
    • H01L27/1465H01L24/48H01L27/14618H01L27/14636H01L27/14649H01L27/1469H01L31/0203H01L31/101H01L31/18H01L2224/48H01L2924/00014H01L2924/15312H05K3/34H05K3/341H05K2201/09036H05K2201/10318H01L2224/45099H01L2224/45015H01L2924/207
    • A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.
    • 一种制造红外光检测器(1)的方法,包括以下步骤:提供多个连接销(11,12),所述多个连接销(11,12)保持彼此平行并且布置成其纵向端部(17,18)之一 一个水平平面和一个具有平面下侧(8)的印刷电路板(6),每个连接销(11,12)为每个壳体提供了相同形式的凹槽(15,16)。 用焊膏填充凹部(15,16),使得在每个凹部(15,16)中存在焊膏体(21),其具有相同量的焊膏; 将印刷电路板(6)定位在连接销(11,12)上方,使得每个连接销(11,12)的纵向端(17,18)延伸到分配给 它位于相应凹口(15,16)中的焊膏体(21)中并浸没; 使焊膏体(21)液化,从而在连接销(11,12)和焊膏体(21)之间形成导电连接,并且由于焊膏体(21)的表面张力和 印刷电路板(6)的重量,印刷电路板(6)的下侧(8)平行于水平面排列; 固化焊膏体(21),使得机械固定的连接由印刷电路板(6)和连接销(11,12)之间的焊膏体(21)形成,并且下侧(8)的对准 的平行于水平面的印刷电路板(6)是固定的。
    • 3. 发明授权
    • Infrared light sensor having a high signal voltage and a high signal/noise ratio
    • 红外光传感器具有高信号电压和高信噪比
    • US08963087B2
    • 2015-02-24
    • US13264908
    • 2010-04-16
    • Carsten GiebelerJeffrey WrightTim Chamberlain
    • Carsten GiebelerJeffrey WrightTim Chamberlain
    • G01J5/34G01J5/08
    • G01J5/34G01J5/08G01J5/0846
    • An infrared light sensor for an infrared light detector (1), including a substrate membrane section (2) and at least two sensor chips (7 to 10), which are fastened next to each other on the substrate membrane section (2) and each comprise a layer element (11) which is produced from pyroelectrically sensitive material and is electrically contacted by a base electrode (12) and a head electrode (13) and is arranged in such that there is a voltage difference in each case between the head electrode (13) and the base electrode (12) of each layer element (11) when the layer elements (11) are irradiated with infrared light; and a coupling line (14 to 16) in each case for two adjacently arranged sensor chips (7 to 10), the coupling line coupling the head electrode (13) of the one sensor chip (7 to 9) and the base electrode (12) of the other sensor chip (8 to 10) to each other in an electrically conductive manner so that the layer elements (11) of the sensor chips (7 to 10) are connected in a series circuit, which has one of the base electrodes (17) at one end thereof and one of the head electrodes (18) at the other end thereof, at which a total voltage difference of the series circuit can be tapped as the sum of the individual voltage differences of the layer elements (11).
    • 一种用于红外光检测器(1)的红外光传感器,包括基板膜部分(2)和至少两个传感器芯片(7至10),它们在基板膜部分(2)上彼此紧固并且每个 包括由热敏材料制成并与基底电极(12)和头部电极(13)电接触的层元件(11),并且被布置成使得在每个情况下在头部电极之间存在电压差 (11)被红外线照射时,各层元件(11)的基极(13)和基极(12) 和连接线(14〜16),用于两个相邻布置的传感器芯片(7至10),耦合线将一个传感器芯片(7至9)的头部电极(13)和基极(12) )以使得传感器芯片(7至10)的层元件(11)连接在串联电路中,该串联电路具有一个基极电极 (17)和其另一端的头电极(18)中的一个,串联电路的总电压差可以抽头作为层元件(11)的各个电压差之和, 。
    • 5. 发明申请
    • METHOD FOR PRODUCING A THIN FILM MADE OF LEAD ZIRCONATE TITANATE
    • 生产铅锌酸铅薄膜的方法
    • US20140049136A1
    • 2014-02-20
    • US13985646
    • 2012-02-13
    • Carsten GiebelerNeil Conway
    • Carsten GiebelerNeil Conway
    • H01L41/316H01L41/187
    • H01L41/1876C23C14/0036C23C14/088C23C14/3464H01L21/02197H01L21/02266H01L37/025H01L41/316
    • The invention relates to a method for producing the thin film made of lead zirconate titanate in a 111-oriented perovskite structure, comprising the following steps: providing a substrate having a substrate temperature above 450° C. and a lead target, a zirconium target, and a titanium target; applying the thin film by sputtering lead, zirconium, and titanium from the respective targets onto the substrate, wherein the total deposition rate of lead, zirconium, and titanium is greater than 10 nm/min, the deposition rate of zirconium is selected in such a way that the atomic concentration of zirconium with respect to the atomic concentration of zirconium together with titanium in the thin film is between 0.2 and 0.3, and the deposition rate of lead is selected to be sufficiently low, depending on the substrate temperature and the total deposition rate of lead, zirconium, and titanium, for an X-ray diffractometer graph of the 111-oriented lead zirconate titanate to have a significant peak value (19) in a diffraction angle range from 33 to 35.5°; and completing the thin film.
    • 本发明涉及一种在111取向的钙钛矿结构中制造由锆钛酸铅制成的薄膜的方法,包括以下步骤:提供基片温度高于450℃的基片和引线靶,锆靶, 和钛靶; 通过将铅,锆和钛从各个靶溅射到衬底上来施加薄膜,其中铅,锆和钛的总沉积速率大于10nm / min,锆的沉积速率选择在 锆的原子浓度相对于锆的原子浓度与钛一起在薄膜中的原子浓度在0.2和0.3之间的方式,并且根据衬底温度和总沉积选择铅的沉积速率足够低 对于111取向铅锆钛酸铅的X射线衍射仪图,在33〜35.5°的衍射角范围内具有显着的峰值(19)的铅,锆和钛的比率; 并完成薄膜。
    • 7. 发明授权
    • Apparatus having a screened structure for detecting thermal radiation
    • 具有用于检测热辐射的屏蔽结构的装置
    • US08575550B2
    • 2013-11-05
    • US12808745
    • 2008-07-30
    • Jeffrey Wright
    • Jeffrey Wright
    • H01L31/0203
    • G01J5/04G01J5/0285G01J5/045H01L27/14618H01L2924/0002H01L2924/00
    • An apparatus for detecting radiation has a substrate, a protective housing fitting on the substrate, which has an electrically conductive material and a top facing away from the substrate, and that has an aperture therein. A stack is fitted on the substrate inside the protective housing and includes at least one detector substrate having at least one thermal detector element thereon that converts incoming thermal radiation into an electrical signal, at least one circuit carrier having at least one read circuit for reading out the electrical signal, and at least one cover that covers the detector element. The detector substrate is located between the circuit substrate and the cover. The detector substrate and the cover are arranged on each other such that the detector element of the detector substrate and the cover have at least one first stack cavity of the stack therebetween, the stack cavity being defined by the detector support and the cover. The circuit substrate and the detector substrate are arranged on each other such that the detector substrate and the circuit substrate have at least one second stack cavity therebetween, the second stack cavity being defined by the circuit substrate and the detector substrate. At least one of the first stack cavity and the second stack cavity is evacuated. The stack top that faces the substrate is accessible from outside of the protective housing.
    • 用于检测辐射的装置具有衬底,衬底上的保护壳体配件,其具有导电材料和背离衬底的顶部,并且其中具有孔。 堆叠被安装在保护壳体内的衬底上,并且包括至少一个检测器衬底,其上具有至少一个热检测器元件,其将进入的热辐射转换成电信号,至少一个电路载体具有至少一个用于读出的读取电路 电信号和覆盖检测器元件的至少一个盖。 检测器基板位于电路基板和盖子之间。 检测器基板和盖彼此布置,使得检测器基板和盖的检测器元件具有其间的堆叠的至少一个第一堆叠空腔,堆叠腔由检测器支撑件和盖限定。 电路基板和检测器基板彼此布置,使得检测器基板和电路基板之间具有至少一个第二堆叠空腔,第二堆叠腔由电路基板和检测器基板限定。 将第一堆叠腔和第二堆叠腔中的至少一个排空。 面向基板的堆叠顶部可从保护外壳的外部进入。