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    • 1. 发明授权
    • Polyimide copolymer and metal laminate using the same
    • 聚酰亚胺共聚物和使用其的金属层压体
    • US07763321B2
    • 2010-07-27
    • US12290518
    • 2008-10-31
    • Min ZuoJenq-Tain Lin
    • Min ZuoJenq-Tain Lin
    • B05D3/02
    • C08G73/1042B32B15/08B32B27/34C08G73/1085H05K1/0346Y10T428/31681Y10T428/31692Y10T428/31721
    • A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc. against temperature changes due to a low coefficient of linear thermal expansion of the polyimide copolymer, and also has satisfactory adhesiveness and thermal dimensional stability and a low water absorbability, and thus can be used as a suitable for a flexible, finely printed circuit board requiring a high dimensional stability.
    • 一种新型的聚酰亚胺共聚物,它是包含由(A)异亚丙基 - 双(4-亚苯基氧基-4-邻苯二甲酸)二酐组成的两种四羧酸二酐和(B)3,3',4,4'-联苯四羧酸 (C)6-氨基-2-(对氨基苯基)苯并咪唑组成的一种二胺或由组分(C)和(D)组成的二种或三种二胺,至少一种二胺 由双(4-氨基 - 苯基)醚(D1)和苯二胺(D2)组成的金属层压体,以及通过将所述聚酰亚胺共聚物层压到金属箔上制成的金属层压板。 由于聚酰亚胺共聚物的线性热膨胀系数低,所以包含作为金属箔上的层的新型聚酰亚胺共聚物的金属层叠体具有低卷曲敏感性,导致卷曲,扭曲,翘曲等导致温度变化,并且还具有 令人满意的粘合性和热尺寸稳定性和低吸水性,因此可以用作适合于需要高尺寸稳定性的柔性精细印刷电路板。