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    • 1. 发明申请
    • LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS
    • 低成本车载电气和电子元件和系统由导电负载树脂材料制造
    • US20140272117A1
    • 2014-09-18
    • US14293315
    • 2014-06-02
    • INTEGRAL TECHNOLOGIES, INC.
    • THOMAS AISENBREY
    • H01B13/00
    • H01B13/0026B60R16/02H01B1/22
    • Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
    • 车载电气和电子部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末,导电纤维或导电粉末和导电纤维的组合。 导电粉末,导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20%至50%。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外,金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中,超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。
    • 8. 发明授权
    • Low cost key actuators and other switching device actuators manufactured from conductive loaded resin-based materials
    • 由导电负载的树脂基材料制造的低成本钥匙致动器和其他开关装置致动器
    • US07829807B2
    • 2010-11-09
    • US11541187
    • 2006-09-29
    • Thomas Aisenbrey
    • Thomas Aisenbrey
    • H01H1/02
    • H01H13/702H01H13/785H01H19/58H01H23/12H01H2011/0081H01H2201/032H01H2203/0085H01H2203/01H01H2209/078H01H2215/006H01H2215/008H01H2221/01H01H2221/012H01H2221/018H01H2239/006Y10T428/249958Y10T428/31681
    • Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based key actuators and other switching devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the key actuators and other switching devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.
    • 主要致动器和其他开关装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末,导电纤维或导电粉末和导电纤维的组合。 导电粉末,导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20和0.40之间。 微米导电粉末由非金属形成,例如碳,石墨,也可以是金属电镀等,或由金属,如不锈钢,镍,铜,银,也可以是金属镀,或 或者由非金属,电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维,不锈钢纤维,铜纤维,银纤维等。 可以使用诸如注射成型压缩成型或挤出的方法来形成导电负载的树脂基键致动器和其他开关装置。 用于形成关键致动器和其它开关装置的导电负载树脂基材料也可以是易于切割成所需形状的薄柔性机织织物的形式。
    • 10. 发明授权
    • Low cost electronic probe devices manufactured from conductive loaded resin-based materials
    • 由导电负载的树脂基材料制造的低成本电子探针装置
    • US07372422B2
    • 2008-05-13
    • US11343019
    • 2006-01-30
    • Thomas Aisenbrey
    • Thomas Aisenbrey
    • H01Q7/08H01Q1/42
    • G01R1/06788G01R1/067G01R3/00
    • Electronic probe devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
    • 电子探针装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末,导电纤维或导电粉末和导电纤维的组合。 导电粉末,导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成,例如碳,石墨,也可以是金属电镀等,或由金属,如不锈钢,镍,铜,银,也可以是金属镀,或 或者由非金属,电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维,不锈钢纤维,铜纤维,银纤维等。