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1. 发明授权

US5888036A Drill bit and step feeding method 失效
标题翻译：钻头和步进进给方式
公开(公告)号：US5888036A
公开(公告)日：1999-03-30
申请号：US899149
申请日：1997-07-23
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
IPC分类号： B23B51/02
CPC分类号： B23B51/02 , B23B2251/04 , B23B2251/14 , B23B2251/245 , B23B2251/426 , Y10S408/704 , Y10T408/9097
摘要： An improved drill bit for high speed, small diameter drilling of printed circuit boards uses flute/land ratio tapering in combination with the appropriate web thickness and point, cutting or flute angles to obtain high quality, accurately positioned holes. In one embodiment, the web thickness at the tip is 15% of the drill diameter, the flute/land ratio is 2.0, the tip angle is 130.degree., the second cutting angle is 20.degree., the third cutting angle is 30.degree., the flute angle is 32.degree., the relief groove depth is 0.001", body length is 0.256" and the distance between the body end and the flute end is 0.01". Such a bit is used in connection with an air jet cooling/cleaning system and a step feed drilling method wherein the first step is between four-six times drill diameter, the second step is between two-three times the drill diameter, and the third step and subsequent steps are between 1.5-2.5 times the drill diameter.
摘要翻译：用于高速，小直径钻孔的印刷电路板的改进钻头使用槽纹/土地比例锥形结合适当的腹板厚度和点，切割或凹槽角度以获得高质量，准确定位的孔。在一个实施例中，尖端的腹板厚度为钻头直径的15％，凹槽/底面比为2.0，尖角为130°，第二切割角为20°，第三切割角为30°，槽角为32°，缓冲槽深度为0.001“，体长0.256”，体端与槽槽端之间的距离为0.01“。这样的一个用途是与空气喷射冷却/清洁系统和步进进给钻孔方法结合使用，其中第一步骤是钻头直径的4-6倍之间，第二步骤是钻头直径的2-3倍，而第三步骤是钻头直径的2-3倍步骤和后续步骤在钻头直径的1.5-2.5倍之间。

2. 发明授权

US5756378A Method of and apparatus for laser processing 失效
标题翻译：激光加工方法和设备
公开(公告)号：US5756378A
公开(公告)日：1998-05-26
申请号：US604809
申请日：1996-02-23
申请人： Kunio Arai
发明人： Kunio Arai
IPC分类号： B23K26/00 , B23K26/02 , B23K26/06 , B23K26/073 , B23K26/38 , B23K101/42 , H01L21/48 , H05K3/00 , H05K3/46 , H01L21/60
CPC分类号： B23K26/0738 , B23K26/037 , B23K26/066 , H01L21/4803 , H01L21/4864 , H05K3/0035 , H05K2203/0228 , H05K2203/056 , H05K3/0044
摘要： The disclosure relates to spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a part thereof, to a position just above the inner-layer conductor. The part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, laser-beam processing is easy to control thermal influence on the portion to be processed of the circuit board, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.
摘要翻译：本公开涉及用于暴露嵌入在印刷电路板的绝缘体中的内层导体的点对面。点对面通过除了其一部分之外的机械切割器将整个绝缘体移除到刚好在内层导体上方的位置。绝缘体的部分厚度小于用机械切割器去除的绝缘体。然后，通过用激光束扫描该部分来去除绝缘体的剩余部分以暴露内层导体。激光束的形状几乎垂直于激光束的扫描方向，并且沿细长的形状具有几乎均匀的能量密度。切割机处理足以在内层导体之前进行，并且不用担心损坏内层导体。此外，由于激光束的能量密度几乎均匀，因此激光束处理容易控制对电路板的待处理部分的热影响。因此，根据加工的产品产量提高。

3. 发明授权

US5315072A Printed wiring board having blind holes 失效
标题翻译：具有盲孔的印刷电路板
公开(公告)号：US5315072A
公开(公告)日：1994-05-24
申请号：US827708
申请日：1992-01-27
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
IPC分类号： H05K1/11 , H05K3/00 , H05K3/46 , H05K1/00
CPC分类号： H05K1/113 , H05K3/4623 , H05K2201/0394 , H05K2201/09472 , H05K2201/09509 , H05K2201/09527 , H05K2203/107 , H05K3/0017 , H05K3/4611
摘要： The present invention relates to a printed wiring board and a method of manufacturing a printed wiring board. A first printed wiring board and a second printed wiring board, each including an insulating layer and a copper foil layer, are superposed on one another with a middle insulating layer therebetween with blind holes formed in the insulating layers of the boards to oppose one another, through-holes are formed and provided with conductive plating to electrically connect the copper foil layers with each other, and reflow pads are formed by etching in the copper foil layers to seal the blind holes. The blind holes are formed through the insulating layers and reach the copper foil layers. Plated layers are plated on the surfaces of the printed wiring boards on the sides thereof where the blind holes are formed to electrically connect the blind holes and the copper foil layers, respectively.
摘要翻译：印刷电路板及印刷电路板的制造方法技术领域本发明涉及印刷电路板及其制造方法。将绝缘层和铜箔层的第一印刷电路板和第二印刷电路板彼此重叠，中间绝缘层之间形成有彼此相对的板的绝缘层中的盲孔，形成通孔并设置有导电电镀以将铜箔层彼此电连接，并且通过在铜箔层中蚀刻来形成回流焊盘以密封盲孔。盲孔通过绝缘层形成并到达铜箔层。在印刷电路板的形成有盲孔的侧面上的电镀层分别电镀盲孔和铜箔层。

4. 发明授权

US5225660A Consumable-electrode AC gas shield arc welding method and apparatus therefor 失效
标题翻译：消费电气AC气体电弧焊接方法及其设备
公开(公告)号：US5225660A
公开(公告)日：1993-07-06
申请号：US556096
申请日：1990-07-23
申请人： Tsuneo Mita , Tsuneo Shinada , Takayuki Kashima
发明人： Tsuneo Mita , Tsuneo Shinada , Takayuki Kashima
IPC分类号： B23K9/09 , B23K9/095 , G05F1/08
CPC分类号： B23K9/0953 , B23K9/091 , G05F1/08
摘要： In a consumable electrode gas shielded arc welding system, alternating current power is applied across the electrode and the base metal. The period during which the electrode is kept negative is varied to correspond to the electrode feeding rate. In addition, the levels of the output power during the negative and positive periods are individually set.
摘要翻译：在消耗电极气体保护电弧焊接系统中，跨越电极和母体金属施加交流电力。电极保持为负的期间根据电极进给速度而变化。另外，在负和正期间的输出功率的电平分别设定。

5. 发明授权

US5200906A Wire-cut electric discharge machining method 失效
标题翻译：线切割放电加工方法
公开(公告)号：US5200906A
公开(公告)日：1993-04-06
申请号：US616846
申请日：1990-11-21
申请人： Takahiko Yamashita , Akira Busujima , Toshiyuki Makino
发明人： Takahiko Yamashita , Akira Busujima , Toshiyuki Makino
IPC分类号： G05B19/4099
CPC分类号： G05B19/4099
摘要： Ratios between a distance between an upper wire guide and the upper surface of a workpiece to be machined, a thickness of the workpiece and a distance between a lower wire guide and the lower surface of the workpiece are given to the inlet and outlet positions of a wire electrode at the upper and lower surfaces of the workpiece which have been interpolated so as to directly obtain displacement positions of the upper and lower wire guides, along which the upper and lower wire guides are moved successively, thereby obtaining an articles which is accurately machined with a relatively simple machining procedure.
摘要翻译：在上部导线器和待加工的工件的上表面之间的距离，工件的厚度和下部电线引导件与工件的下表面之间的距离之间的比率被赋予一个在被插入的工件的上表面和下表面上的线电极，以便直接获得上，下导线器的位移位置，沿着上下导线引导件依次移动，从而获得准确加工的制品具有相对简单的加工程序。

6. 发明授权

US5099520A Figure retrieval method 失效
标题翻译：图检索方法
公开(公告)号：US5099520A
公开(公告)日：1992-03-24
申请号：US496181
申请日：1990-03-20
申请人： Kazuaki Iwamura , Shigeru Kakumoto , Yasunori Emura
发明人： Kazuaki Iwamura , Shigeru Kakumoto , Yasunori Emura
IPC分类号： G06F17/30 , G06T1/00
CPC分类号： G06F17/30259 , G06T1/0007
摘要： A figure retrieval method for storing memory addresses for figure data in an address data table which corresponds to positional coordinates of a multi-dimensional array. When retrieving end points, or node points, other points on a line and points on a surface, these points constituting the figure data, memory addresses for figure data for an object to be retrieved are stored in the address data table and then retrieved. Flags indicative of the kind of the constituent points are also stored in the address data table in combination with the memory addresses and are used for figure retrieval.
摘要翻译：一种图形检索方法，用于在对应于多维阵列的位置坐标的地址数据表中存储图形数据的存储器地址。当检索端点或节点，线上的其他点和表面上的点时，构成图形数据的这些点，将要检索的对象的图形数据的存储器地址存储在地址数据表中，然后被检索。表示构成点种类的标记也与存储器地址一起存储在地址数据表中，并用于图形检索。

7. 发明授权

US5086203A Wire electric discharge machining apparatus 失效
标题翻译：电线放电加工设备
公开(公告)号：US5086203A
公开(公告)日：1992-02-04
申请号：US360131
申请日：1989-06-01
申请人： Kazuo Kobayashi , Hitoshi Miyahara , Hidemaru Nishikizawa , Hironori Shimomoto , Osamu Maruyama
发明人： Kazuo Kobayashi , Hitoshi Miyahara , Hidemaru Nishikizawa , Hironori Shimomoto , Osamu Maruyama
IPC分类号： B23H7/02 , B23H7/06
CPC分类号： B23H7/06
摘要： A wire electric discharge machining apparatus wherein workpiece and a wire supported by a pair of guides are moved relative to each other in an X-axis direction and a Y-axis direction, one of the guides being moved relative to the other guide in two directions in a horizontal plane for performing a machining operation. The apparatus comprises the pair of guides, a frame, rails mounted on a column, a U-axis moving unit, and a V-axis moving unit. One of the guides is mounted on the frame. The V-axis moving unit on which the other guide is mounted is mounted movably on the U-axis moving unit in parallel with the Y-axis. The frame and the U-axis moving unit are arranged in alignment with the rails.
摘要翻译：一种电线放电加工装置，其中工件和由一对引导件支撑的线在X轴方向和Y轴方向上相对移动，其中一个引导件相对于另一个引导件在两个方向上移动在水平面中进行加工操作。该装置包括一对引导件，框架，安装在列上的轨道，U轴移动单元和V轴移动单元。其中一个导轨安装在框架上。安装另一个引导件的V轴移动单元与Y轴平行地可移动地安装在U轴移动单元上。框架和U轴移动单元布置成与轨道对准。

8. 发明授权

US5010232A Method of and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US5010232A
公开(公告)日：1991-04-23
申请号：US468914
申请日：1990-01-23
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
IPC分类号： B23B41/00 , B23K26/00 , B23K26/38 , B23P23/00 , H05K1/03 , H05K3/00 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： B23K26/0093 , B23K26/386 , B23K26/40 , B23K26/402 , B23P23/00 , H05K3/0035 , H05K3/0047 , B23K2201/35 , B23K2201/42 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H05K1/0366 , H05K2201/0394 , H05K2201/09509 , H05K2201/09518 , H05K2203/0207 , H05K2203/0554 , H05K3/0044 , H05K3/4652
摘要： A method of perforating a printed circuit board having a copper foil layer on one side thereof, at least one intermediate resin layer and a layer on the other side thereof, so as to form a connection hole for providing an electrical connection between the copper foil layer and the layer on the other side of the printed circuit board. The method employs a printed circuit board perforation apparatus which has a laser processing head capable of processing the printed circuit board by means of a laser beam and a drill head capable of driling the printed circuit board. After the apparatus is suitably located with respect to the printed circuit board, the drilling head operates to conduct drilling into the resin layer through the copper foil layer by the drilling head so as to form a pilot hole. Then, the pilot hole is located with respect to the laser processing head and the laser processing head operates to irradiate a laser beam to the portion of the resin layer remaining at the bottom of the pilot hole so as to remove the resin, thereby forming the connection hole reaching the layer on the other side of the printed circuit board. An apparatus for carrying out this method is also disclosed.
摘要翻译：一种在其一面上具有铜箔层的印刷电路板穿孔的方法，至少一个中间树脂层和另一侧的层，以形成用于在铜箔层之间提供电连接的连接孔和印刷电路板另一侧的层。该方法采用印刷电路板穿孔装置，其具有能够通过激光束处理印刷电路板的激光加工头和能够打印印刷电路板的钻头。在装置相对于印刷电路板适当定位之后，钻头操作以通过钻头通过铜箔层进行树脂层的钻孔，从而形成引导孔。然后，引导孔相对于激光加工头定位，激光加工头操作以将激光束照射到残留在导孔的底部的树脂层的部分，以除去树脂，从而形成连接孔到达印刷电路板另一侧的层。还公开了一种用于执行该方法的装置。

9. 发明授权

US4667113A Tool failure detection apparatus 失效
标题翻译：工具故障检测装置
公开(公告)号：US4667113A
公开(公告)日：1987-05-19
申请号：US764071
申请日：1985-08-09
申请人： Kiyoharu Nakajima , Taisuke Ito , Yusui Nakamura
发明人： Kiyoharu Nakajima , Taisuke Ito , Yusui Nakamura
IPC分类号： B23B49/00 , G06T7/00 , H05K3/00 , G01N21/86
CPC分类号： B23Q17/2442 , B23B49/001 , G06T7/0006 , G06T2207/30164 , H05K3/0044 , Y10T408/21
摘要： In a tool failure detection apparatus for a working machine such as a drilling machine for circuit boards, light is irradiated onto a workable area of a workpiece, and reflection light from the workable area is picked up by an imaging unit to produce a video signal. A video signal indicative of at least either one of a tool image and a worked void image which is picked up within a predetermined region of a picture is sampled to calculate an image area. A comparator compares a calculated image area with a preset reference value indicative of normality of the tool to judge whether the tool is normal or broken.
摘要翻译：在用于电路板的钻孔机等作业机械的工具故障检测装置中，将光照射到工件的可工作区域，并且由成像单元拾取来自可加工区域的反射光，以产生视频信号。对表示在图像的预定区域内拾取的工具图像和加工空白图像中的至少一个的视频信号进行采样，以计算图像区域。比较器将计算的图像区域与指示工具的正常性的预设参考值进行比较，以判断工具是正常还是断开。

10. 发明授权

US4504722A Fully automated machining apparatus optimization for electric discharge machining apparatus 失效
标题翻译：放电加工设备全自动加工设备优化
公开(公告)号：US4504722A
公开(公告)日：1985-03-12
申请号：US352765
申请日：1982-02-26
申请人： Masakazu Kishi , Yasuo Suzuki
发明人： Masakazu Kishi , Yasuo Suzuki
IPC分类号： B23H1/02 , B23H7/16 , B23H7/20 , B23P1/08
CPC分类号： B23H7/20 , B23H1/02 , B23H7/16
摘要： An electric discharge machining apparatus capable of automatically optimizing the machining stabilizing condition including set voltage of machining pulse, duty factor of the pulse, electrode raising period and working fluid pressure, and hence capable of being full-automated. Each machining stabilizing condition is successively changed within a predetermined range and set when the maximum effective discharge generation rate is obtained. Spark machining is effected on the basis of the set value.
摘要翻译：一种放电加工装置，其能够自动优化包括加工脉冲的设定电压，脉冲占空因数，电极上升期间和工作流体压力的加工稳定条件，因此能够全自动化。每个加工稳定条件在预定范围内连续变化，并且在获得最大有效放电产生速率时设定。基于设定值进行火花加工。

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