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1. 发明申请

US20150110588A1 FEEDER, FEEDER CONTROL METHOD AND ELECTRONIC COMPONENT MOUNTING DEVICE 有权
标题翻译：进料器，进料器控制方法和电子部件安装装置
公开(公告)号：US20150110588A1
公开(公告)日：2015-04-23
申请号：US14582892
申请日：2014-12-24
申请人： HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
发明人： Kazuyoshi OHYAMA , Tsutomu YANAGIDA , Yoshinori KANO , Yuuki TOMITA , Yutaka CHIDA
IPC分类号： H05K13/04
CPC分类号： H05K13/0417 , H05K13/0419
摘要： A feeder and a feeder control method, as well as an electronic component device, reliably engaging a supply tape in a loading operation even if there is an accumulated pitch error between sprocket holes. Third, second and first sprockets are arranged successively from an insertion port. The sprocket hole on a forward end portion of the inserted supply tape is fitted with a third tooth of the third sprocket in the loading operation. The supply tape is rotated by rotation of the third sprocket until fitting with a second tooth of the second sprocket, and the rotation of the third sprocket is stopped after the second tooth fits with the sprocket hole on the forward end portion.
摘要翻译：馈线和馈线控制方法以及电子部件装置，即使在链轮孔之间存在累积的间距误差，也可以在加载操作中可靠地接合供带。第三，第二和第一链轮从插入口连续布置。插入的供给带的前端部上的链轮孔在装载操作中与第三链轮的第三齿配合。供给带通过第三链轮的旋转而旋转，直到与第二链轮的第二齿配合，并且在第二齿与前端部上的链轮孔配合之后，第三链轮的旋转停止。

2. 发明申请

US20140265094A1 DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD 审中-公开
标题翻译： DIE BONDER和BONDING HEAD DEVICE OF THE SAME，AND THE COLLET POSITION ADJUSTING METHOD
公开(公告)号：US20140265094A1
公开(公告)日：2014-09-18
申请号：US14025612
申请日：2013-09-12
申请人： HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
发明人： Hideharu KOBASHI , Keisuke NADAMOTO , Yoshihisa NAKAJIMA
IPC分类号： B25B11/00 , B23Q3/18
CPC分类号： H01L24/75
摘要： For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.
摘要翻译：为了提供一种管芯接合器，一种接合头装置和夹头位置调节方法，用于在接合头装置中以简单的结构更换夹头时能够自动校正（调整）错误，包括其高度和倾斜度，具有用于引导其内部抽吸的真空的保持件41h，可拆卸地安装在保持器的末端的柄部41s和夹头41c，用于在更换夹头之后调节夹头的位置，反向侧面在夹具之前，通过设置在接合头装置下方的反面表面拍摄照相机42拍摄该夹头，并且在更换夹头之后，将该夹头的反面进行更换，然后进行校正是在夹头的位置上进行的，以便在交换之前/之后拍摄的照片与之相符。

3. 发明申请

US20140074280A1 Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder 审中-公开
标题翻译：水平轴驱动机构，双轴驱动机构和模具粘合机
公开(公告)号：US20140074280A1
公开(公告)日：2014-03-13
申请号：US13784241
申请日：2013-03-04
申请人： HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
发明人： Yoshihide ISHII , Masayuki MOCHIZUKI
IPC分类号： G05B19/18
CPC分类号： G05B19/18 , G05B2219/45033 , H02K7/06 , H02K11/21 , H02K16/00 , H02K41/031
摘要： A horizontal axis drive mechanism includes a first linear motor including a first fixed section and a first movable section fixing a load section and moving the load section in the horizontal direction, a support body supporting the first fixed section, a first linear guide arranged between the support body and the first fixed section and moving the first fixed section, a rotation conversion type counter including a rotating body rotatably supported by the support body and a converting means converting movement of the first fixed section in the horizontal direction into rotation of the rotating body, and a control section controlling the position of the first movable section in the horizontal direction.
摘要翻译：水平轴驱动机构包括：第一线性电动机，包括第一固定部分和固定负载部分并沿着水平方向移动负载部分的第一可动部分;支撑第一固定部分的支撑体;布置在支撑体和第一固定部分并移动第一固定部分，旋转转换型计数器包括由支撑体可旋转地支撑的旋转体，以及转换装置，其将第一固定部分在水平方向上的运动转换成旋转体的旋转以及控制部，其控制第一可动部在水平方向上的位置。

4. 发明申请

US20130014904A1 Biaxial Drive Mechanism and Die Bonder 审中-公开
标题翻译：双轴驱动机构和模具粘合机
公开(公告)号：US20130014904A1
公开(公告)日：2013-01-17
申请号：US13226128
申请日：2011-09-06
申请人： Koji HOSAKA , Shingo Fukasawa
发明人： Koji HOSAKA , Shingo Fukasawa
IPC分类号： B29C65/52 , B65G47/74 , B29C65/48
CPC分类号： H01L24/75 , H01L24/83 , H01L2224/32245 , H01L2224/7565 , H01L2224/75824 , H01L2224/83192 , Y10T156/17 , Y10T156/1798 , H01L2924/00
摘要： A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
摘要翻译：公开了一种双轴驱动机构，其包括能够实现高速仰角的Z轴，而不使用水平驱动轴上的扭矩增加，并且使用双轴驱动机构的芯片接合机。双轴驱动机构包括处理部; 第一线性电动机，具有使操作部上下移动的第一可动部和第一静止部; 第二线性电动机，具有第二可动部和第二静止部; 连接部，其经由所述第一线性引导件将所述第一可动部直接或间接地连接到所述第二可动部; 使所述第一可动部移动的第二线性引导件; 以及支撑体，其在水平方向上以预定长度彼此平行地固定第一固定部分和第二固定部分。

5. 发明申请

US20130014881A1 Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method 审中-公开
标题翻译：双轴驱动机构，模具接合器和模具接合器操作方法
公开(公告)号：US20130014881A1
公开(公告)日：2013-01-17
申请号：US13226138
申请日：2011-09-06
申请人： Shingo FUKASAWA , Koji Hosaka
发明人： Shingo FUKASAWA , Koji Hosaka
IPC分类号： B32B37/00 , G05B9/02 , B32B37/12
CPC分类号： H01L21/67144 , H01L24/75 , H01L24/83 , H01L2224/27312 , H01L2224/75611 , H01L2224/75745 , H01L2224/83192 , Y10T156/10 , Y10T156/17
摘要： A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source.
摘要翻译：公开了一种高可靠性的双轴驱动机构和能够防止线性电动机在功率损失时的仰角的下降的管芯接合机操作方法。双轴驱动机构包括处理部; 具有第一线性电动机单元的双轴驱动轴，所述第一线性电动机单元具有沿着第一直线引导件和第一静止部分上下移动所述操作部的第一可动部，以及具有第二可动部的第二直线电动机单元，垂直于上下方向的水平方向的一部分和第二静止部分; 主电源，用于向双轴驱动轴提供电源; 以及升降轴下降防止单元，其防止在主电源处的功率损失时操作部件的掉落。

6. 发明申请

US20120244647A1 Pick-Up Method of Die Bonder and Die Bonder 有权
标题翻译：芯片焊接机和芯片焊接机的拾取方法
公开(公告)号：US20120244647A1
公开(公告)日：2012-09-27
申请号：US13224366
申请日：2011-09-02
申请人： Naoki OKAMOTO , Keita Yamamoto
发明人： Naoki OKAMOTO , Keita Yamamoto
IPC分类号： H01L21/66 , B32B38/10 , B32B37/00
CPC分类号： H01L21/67132 , H01L21/67271 , H01L2221/68322 , H01L2221/68336 , H01L2221/68354 , H01L2221/68381 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： The present invention provides a die bonder capable of stripping a die without fail, or a highly reliable die bonder or pick-up method using the die bonder.When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points and then, the dicing film corresponding to portions other than the above predetermined positions is tossed to strip the die from the dicing film.
摘要翻译：本发明提供一种能够不经故障地剥离模具的芯片焊接机，或使用该芯片焊接机的高可靠性的芯片焊接机或拾取方法。当与切割膜结合的多个模具（半导体芯片）被剥离的模具被从切割膜上抛出并剥离时，将与模具的周边部分相对应的预定位置的切割薄膜折腾以形成剥离起始点，然后将与上述预定位置以外的部分相对应的切割膜被抛出，从切割膜剥离模具。

7. 发明申请

US20120241096A1 Foreign Substance Removing Device and Die Bonder Equipped with the Same 有权
标题翻译：异物去除装置及其配套的贴片机
公开(公告)号：US20120241096A1
公开(公告)日：2012-09-27
申请号：US13224536
申请日：2011-09-02
申请人： Takashi YAMAGAMI , Ryuichi Takano , Hiroshi Maki , Masayuki Mochizuki
发明人： Takashi YAMAGAMI , Ryuichi Takano , Hiroshi Maki , Masayuki Mochizuki
IPC分类号： B32B38/00 , B08B5/04 , B08B5/02
CPC分类号： H01L21/67028 , H01L21/67144 , H01L24/75 , H01L2924/10253 , Y10T156/14 , H01L2924/00
摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.
摘要翻译：本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

8. 发明授权

US08127435B2 Electronic component mounting apparatus 有权
标题翻译：电子元件安装装置
公开(公告)号：US08127435B2
公开(公告)日：2012-03-06
申请号：US12909607
申请日：2010-10-21
申请人： Yutaka Mitsumochi , Yoshihiro Onoguchi , Masami Iizuka , Hiroomi Kobayashi , Kazuyoshi Oyama , Hisayoshi Kashitani , Koichi Izuhara
发明人： Yutaka Mitsumochi , Yoshihiro Onoguchi , Masami Iizuka , Hiroomi Kobayashi , Kazuyoshi Oyama , Hisayoshi Kashitani , Koichi Izuhara
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要翻译：本发明涉及一种电子部件安装装置，其适用于分别由于电子部件的类型或设置空间的原因而不需要在承载装置的两侧设置部件供给装置的情况，并且提高了梁提高生产效率。电子部件安装装置具有承载印刷基板的搬运装置，供给电子部件的部件供给装置，可通过驱动源沿一个方向移动的一对梁，以及各自具有吸嘴的安装头，并可通过驱动源沿着梁移动。部件供给装置仅设置在承载装置的一侧，并且设置在每个安装头上的吸嘴从部件供给装置拾取电子部件，并通过移动所提供的安装头将电子部件安装在印刷电路板上通过分别驱动驱动源，在承载装置上的印刷电路板与元件供给装置之间的两个梁上。

9. 发明授权

US08099860B2 Electronic component mounting apparatus 有权
标题翻译：电子元件安装装置
公开(公告)号：US08099860B2
公开(公告)日：2012-01-24
申请号：US12036735
申请日：2008-02-25
申请人： Akio Watanabe , Takuya Imoto , Yoshiharu Fukushima
发明人： Akio Watanabe , Takuya Imoto , Yoshiharu Fukushima
IPC分类号： B23P19/00
CPC分类号： H05K13/0417 , H05K13/0812 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than α, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than β, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.
摘要翻译：本发明即使当使用中的存储带和新的存储带通过连接带彼此连接时，也能够防止拾取速率的降低。元件识别摄像机拍摄由吸嘴保持的电子部件的图像，识别处理装置进行识别处理。当基于识别处理结果的CPU计算的位置偏移量大于α时，板识别摄像机拍摄存储要拾取的下一个电子部件的存储带的存储部分的图像。当基于识别处理结果计算的存储部分的位置移动量大于＆bgr时，CPU能够进行接缝通过处理。基于通过板识别摄像机对存储部分的图像采集和每次存储带被馈送N次执行时由识别处理设备的识别处理，CPU控制拾取位置的校正。

10. 发明申请

US20110200049A1 INDUSTRIAL NETWORK SYSTEM 有权
标题翻译：工业网络系统
公开(公告)号：US20110200049A1
公开(公告)日：2011-08-18
申请号：US13022052
申请日：2011-02-07
申请人： Takashi SAEGUSA , Terunobu Funatsu , Manabu Okamoto , Ikuo Takemura , Masaharu Yoshida , Hideyuki Kamasuka
发明人： Takashi SAEGUSA , Terunobu Funatsu , Manabu Okamoto , Ikuo Takemura , Masaharu Yoshida , Hideyuki Kamasuka
IPC分类号： H04L12/56
CPC分类号： H04L12/40156 , H04L12/4035 , H04L41/0893 , H04L41/22 , H04L49/901
摘要： A central communication unit 110 and a terminal communication unit 120 are provided with a priority order number storing unit 115 and fifo type storing units, and perform communication according to the priority order of data communication stored in the priority order number storing unit 115. At this time the priority order and the layout of respective devices of control objects are optimized and set through a software processing in a host computer according to the communication cycle and response performance required for the devices of control objects, thereby, the plurality of devices of control objects requiring different communication cycles and response performances can be connected on one network.
摘要翻译：中央通信单元110和终端通信单元120设置有优先级序号存储单元115和fifo类型存储单元，并且根据存储在优先顺序号存储单元115中的数据通信的优先级顺序进行通信。在此根据控制对象的设备所需的通信周期和响应性能，通过主机中的软件处理来优化和设置控制对象的各个设备的优先顺序和布局，从而控制对象的多个设备需要不同的通信周期和响应性能可以连接在一个网络上。

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