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1. 发明授权

US07759791B2 High density IC module 有权
标题翻译：高密度IC模块
公开(公告)号：US07759791B2
公开(公告)日：2010-07-20
申请号：US11738330
申请日：2007-04-20
申请人： Julian Partridge , Leland Szewerenko , James Douglas Wehrly, Jr.
发明人： Julian Partridge , Leland Szewerenko , James Douglas Wehrly, Jr.
IPC分类号： H01L23/34
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/81 , H01L24/90 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/90 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06582 , H01L2225/06589 , H01L2924/01327 , H01L2924/09701 , H01L2924/14 , H01L2924/00
摘要： A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die to a substrate opposite a first die bonded to the substrate. The second die is bonded using heat conducted through the first die to the substrate, and optionally through an underfill material. The first and second die are connected such that bumps are connected to common bonding pads on the substrate. Bumps on one of the die extend through openings in the substrate to connect to the common bonding pads. The bonding pads are within the perimeter of the first die.
摘要翻译：一种用于使用热压接或热超声结合来组装双模集成电路封装的系统和方法，用于将第二裸片结合到与衬底相连的第一裸片相对的衬底上。第二模具使用通过第一模具传导的热量粘合到基底上，并且任选地通过底部填充材料粘合。连接第一和第二裸片，使得凸块连接到基板上的公共接合焊盘。其中一个模具上的凸起延伸穿过基板中的开口以连接到公共接合焊盘。接合焊盘位于第一管芯的周边内。

2. 发明授权

US07737549B2 Circuit module with thermal casing systems 失效
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07737549B2
公开(公告)日：2010-06-15
申请号：US12263060
申请日：2008-10-31
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H05K7/20 , H01L21/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

3. 发明授权

US07626259B2 Heat sink for a high capacity thin module system 有权
标题翻译：散热器用于高容量薄模块系统
公开(公告)号：US07626259B2
公开(公告)日：2009-12-01
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

4. 发明授权

US07608920B2 Memory card and method for devising 有权
标题翻译：存储卡和设计方法
公开(公告)号：US07608920B2
公开(公告)日：2009-10-27
申请号：US11434964
申请日：2006-05-16
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： H01L23/02 , H01L21/48 , H01L23/04 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/105 , G06K19/07732 , H01L23/5387 , H01L23/5388 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/189 , H05K2201/10159 , H05K2201/10545 , H05K2201/10689 , H05K2201/2018 , H01L2924/00
摘要： The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure to create an IC-populated structure. In a preferred embodiment, leads of constituent leaded IC packages are configured to allow the lower surface of the leaded IC packages to contact respective surfaces of the flex circuitry structure. Contacts for typical embodiments are supported by a rigid portion of the flex circuitry structure and the IC-populated structure is disposed in a casing to provide card structure for the module.
摘要翻译：本发明提供一种在存储卡中采用引线封装的存储器件的系统和方法。引线封装IC布置在柔性电路结构的一侧或两侧以产生IC填充结构。在优选实施例中，构成引线IC封装的引线被配置为允许引线IC封装的下表面接触柔性电路结构的相应表面。用于典型实施例的触头由柔性电路结构的刚性部分支撑，并且IC填充结构设置在壳体中以为模块提供卡结构。

5. 发明授权

US07586758B2 Integrated circuit stacking system 有权
标题翻译：集成电路堆叠系统
公开(公告)号：US07586758B2
公开(公告)日：2009-09-08
申请号：US10958924
申请日：2004-10-05
申请人： James W. Cady , James Wilder , David L. Roper , Russell Rapport , James Douglas Wehrly, Jr. , Jeffrey Alan Buchle
发明人： James W. Cady , James Wilder , David L. Roper , Russell Rapport , James Douglas Wehrly, Jr. , Jeffrey Alan Buchle
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H01L23/49816 , H01L23/3114 , H01L23/49827 , H01L23/4985 , H01L23/5387 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06541 , H01L2225/06579 , H01L2225/06586 , H01L2225/107 , H01L2225/1094 , H01L2924/19041 , H01L2924/3011 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/363 , H05K2201/056 , H05K2201/10689 , H05K2201/10734 , H01L2924/00012
摘要： The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to smaller packages such as, for example, die-sized packages such as DSBGA. In a preferred embodiment devised in accordance with the present invention, a base element CSP integrated circuit and a support element CSP integrated circuit are aggregated through a flex circuit having at least two conductive layers that are patterned to selectively connect the two CSP elements. A portion of the flex circuit connected to the support element is folded over the base element to dispose the support element above the base element while reducing the overall footprint. The flex circuit provides a thermal and electrical connection path between the module and an application environment such as a printed wiring board (PWB).
摘要翻译：本发明将封装的集成电路堆叠成节省PWB或其他板表面积的模块。本发明可以利用各种尺寸和配置的封装，其范围从具有许多触点的较大封装的基底元件到较小的封装，例如诸如DSBGA的裸片尺寸的封装。在根据本发明设计的优选实施例中，基体元件CSP集成电路和支撑元件CSP集成电路通过具有图案化以选择性地连接两个CSP元件的至少两个导电层的柔性电路聚集。连接到支撑元件的柔性电路的一部分折叠在基座元件上，以将支撑元件设置在基座元件上方，同时减小了总的占地面积。柔性电路在模块和诸如印刷电路板（PWB）的应用环境之间提供热和电连接路径。

6. 发明授权

US07495334B2 Stacking system and method 有权
标题翻译：堆叠系统和方法
公开(公告)号：US07495334B2
公开(公告)日：2009-02-24
申请号：US11197267
申请日：2005-08-04
申请人： Russell Rapport , James W. Cady , James Wilder , David L. Roper , James Douglas Wehrly, Jr. , Jeff Buchle , Julian Dowden
发明人： Russell Rapport , James W. Cady , James Wilder , David L. Roper , James Douglas Wehrly, Jr. , Jeff Buchle , Julian Dowden
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/50 , H01L23/5387 , H01L25/0657 , H01L25/105 , H01L2224/16237 , H01L2224/73253 , H01L2225/06517 , H01L2225/06541 , H01L2225/06579 , H01L2225/06586 , H01L2225/107 , H01L2924/00014 , H01L2924/01055 , H01L2924/15173 , H01L2924/15311 , H01L2924/19041 , H01L2924/3011 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/363 , H05K2201/056 , H05K2201/10689 , H05K2201/10734 , H01L2224/0401
摘要： The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.
摘要翻译：本发明将芯片级封装集成电路（CSP）堆叠成保存PWB或其他板表面积的模块。在根据本发明的优选实施例设计的两高CSP堆叠或模块中，堆叠两个CSP，其中一个CSP设置在另一个之上。两个CSP与柔性电路连接。在柔性电路和堆叠中的CSP之间设置一个形式标准。形式标准可以采用许多配置，并且可以在柔性电路用于在具有两个或更多个组成CSP的堆叠模块中将CSP彼此连接的位置中使用。例如，在包括四个CSP的堆叠模块中，在优选实施例中采用三个形式标准，尽管可以使用更少的标准。形式标准提供导热物理形式，允许在广泛的CSP封装系列中找到许多变化的封装尺寸，同时采用标准连接柔性电路设计。

7. 发明授权

US07446410B2 Circuit module with thermal casing systems 有权
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07446410B2
公开(公告)日：2008-11-04
申请号：US11283355
申请日：2005-11-18
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底形式优选地由导热材料设计，并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的扩大表面。

8. 发明授权

US07375418B2 Interposer stacking system and method 有权
标题翻译：内插堆叠系统和方法
公开(公告)号：US07375418B2
公开(公告)日：2008-05-20
申请号：US11452532
申请日：2006-06-14
申请人： Julian Partridge
发明人： Julian Partridge
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K2201/049 , H05K2201/10378 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC element and the upper shoulder of leads of a lower IC element while traces that implement stacking-related intra-stack connections between the constituent ICs are implemented in interposers or carrier structures oriented along the leaded sides of the stack and which extend beyond the perimeter of the feet of the leads of the constituent ICs or beyond the connective pads of the interposer. This leaves open to air flow, most of the transit section of the lower lead for cooling, but provides a less complex board structure for implementation of intra-stack connections.
摘要翻译：本发明提供了一种系统和方法，用于选择性地堆叠和互连带有封装的集成电路器件，其上部IC元件的引线的脚与下部IC元件的引线的上部肩部之间的连接，组成IC之间的堆叠连接在沿着堆叠的引导侧定向的插入件或载体结构中实现，并且延伸超过构成IC的引线的脚的周边或超过插入器的连接焊盘。这使得空气流动，下部引线的大部分转接段用于冷却，但是提供了一种不太复杂的板结构，用于实现堆叠内连接。

9. 发明授权

US07804985B2 Circuit module having force resistant construction 有权
标题翻译：电路模块具有抗压结构
公开(公告)号：US07804985B2
公开(公告)日：2010-09-28
申请号：US12197674
申请日：2008-08-25
申请人： Leland Szewerenko , Julian Partridge , Ron Orris
发明人： Leland Szewerenko , Julian Partridge , Ron Orris
IPC分类号： H01L31/00
CPC分类号： H01L23/4985 , H01L23/3128 , H01L23/3135 , H01L23/315 , H01L2924/0002 , H01L2924/00
摘要： Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods.
摘要翻译：公开了用于封装具有传感器区域的模具的抗冲击电路模块。优选的模块包括柔性电路和与其耦合的管芯。柔性电路优选地折叠在可压缩材料上以帮助吸收施加的力。可以在模具的侧面和可压缩材料之间提供间隙以帮助防止剥离。金属加强层可以结合到模具的背面。可以使用包括在模具下面的图案化间隙的低模量材料来吸收力。可以将干膜粘合剂放置在模具的上表面的至少一部分和柔性电路之间，优选地提供进一步的点冲击强度和保护。高和低模量材料可以结合在加固结构中。还教授了采用这种电路模块的消费者设备，以及模块构造方法。

10. 发明授权

US07719098B2 Stacked modules and method 有权
标题翻译：堆叠模块和方法
公开(公告)号：US07719098B2
公开(公告)日：2010-05-18
申请号：US11873351
申请日：2007-10-16
申请人： James Douglas Wehrly, Jr.
发明人： James Douglas Wehrly, Jr.
IPC分类号： H01L23/538
CPC分类号： H01L25/105 , H01L21/4871 , H01L23/3114 , H01L23/49833 , H01L23/49838 , H01L23/4985 , H01L23/5385 , H01L23/5387 , H01L24/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06541 , H01L2225/06579 , H01L2225/06586 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/3511 , Y10T29/49169 , Y10T29/53209 , Y10T29/5327 , H01L2924/00012 , H01L2224/0401
摘要： The present invention stacks integrated circuits into modules that conserve board surface area. In a precursor assembly devised as a component for a stacked circuit module in accordance with a preferred embodiment of the present invention, one or more stiffeners are disposed at least partially between a flex circuit and an integrated circuit. In a two-high stacked circuit module devised in accordance with a preferred embodiment of the present invention, an integrated circuit is stacked above a precursor assembly. The two integrated circuits are connected with the flex circuit of the precursor assembly. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules.
摘要翻译：本发明将集成电路堆叠成节省电路板表面积的模块。在根据本发明的优选实施例设计为用于堆叠电路模块的部件的前驱体组件中，一个或多个加强件至少部分地设置在柔性电路和集成电路之间。在根据本发明的优选实施例设计的两层叠层电路模块中，集成电路堆叠在前体组件的上方。两个集成电路与前体组件的柔性电路连接。本发明可以有益于模块中集成电路的多种配置和组合。

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