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1. 发明申请

US20150154486A1 PROTECTION OF AN NFC OR RFID RADIO IN THE PRESENCE OF STRONG ELECTROMAGNETIC FIELDS 有权
标题翻译：在强大的电磁场存在的情况下保护NFC或RFID无线电
公开(公告)号：US20150154486A1
公开(公告)日：2015-06-04
申请号：US14093895
申请日：2013-12-02
申请人： CAMBRIDGE SILICON RADIO, LTD.
发明人： Anthony Lawrence MCFARTHING , Rainer HERBERHOLZ , Peter Andrew Rees WILLIAMS
IPC分类号： G06K19/07 , H02H9/04 , H02J7/00 , H02J5/00 , H02J7/02
CPC分类号： G06K19/0712 , G06K19/0707 , G06K19/0715 , G06K19/073 , H02H3/025 , H02H9/04 , H02J5/005 , H02J7/0029 , H02J7/025 , H02J50/10 , H02J50/12 , H02J50/80
摘要： Methods and devices are described, including a near-field communications (NFC) or radio frequency identification (RFID) device comprising an NFC or RFID circuit, an antenna having at least a first terminal, a first rectifier connected to the first terminal of the antenna, a switch between the first rectifier and the NFC or RFID circuit, a voltage detector for detecting a voltage in the device caused by a signal received at the antenna, and a control module for controlling the switch, wherein when the voltage exceeds a threshold magnitude, the control module controls the switch to be in an open state and, after a predetermined time period, determines whether the voltage still exceeds the threshold magnitude and, if the voltage still exceeds the predetermined magnitude, controls the switch to be in the open state.
摘要翻译：描述了包括NFC或RFID电路的近场通信（NFC）或射频识别（RFID）设备的方法和设备，具有至少第一终端的天线，连接到天线的第一终端的第一整流器在第一整流器和NFC或RFID电路之间的开关，用于检测由在天线处接收的信号引起的装置中的电压的电压检测器和用于控制开关的控制模块，其中当电压超过阈值幅度控制模块控制开关处于打开状态，并且在预定时间段之后，确定电压是否仍然超过阈值幅度，并且如果电压仍然超过预定幅度，则控制开关处于打开状态。

2. 发明授权

US08976506B2 Metal-on-metal capacitor with diagonal feedline 有权
标题翻译：金属对金属电容器与对角线
公开(公告)号：US08976506B2
公开(公告)日：2015-03-10
申请号：US13123676
申请日：2009-09-14
申请人： Rainer Herberholz
发明人： Rainer Herberholz
IPC分类号： H01G4/06 , H01G4/005 , H01G4/228 , H01G4/236 , H01G2/20 , H01L49/02 , H01L23/522 , H01L27/08 , H01L27/02
CPC分类号： H01L28/91 , H01L23/5223 , H01L27/0207 , H01L27/0805 , H01L28/87 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A design for an improved metal-on-metal capacitor design is described. The design includes a substantially diagonal feedline (411, 412, 413) in each metal layer. Each metal layer (21, 22, 23) comprises two sets of metal fingers which are interleaved. Each set of fingers comprises two subsets of fingers and the subsets of fingers are arranged at right angles to each other. Fingers in a first of the two sets are all connected to the diagonal feedline, while fingers in the other set are connected together via fingers at the periphery of the device. The design is repeated in adjacent layers, where the design may be identical or rotated (e.g by 180°) between adjacent metal layers.
摘要翻译：描述了一种改进的金属 - 金属电容器设计的设计。该设计包括在每个金属层中的基本对角线的馈线（411,412,413）。每个金属层（21,22,23）包括交错的两组金属指。每组手指包括两个手指子组，并且手指的子集彼此成直角布置。两组中的第一组中的手指都连接到对角线，而另一组中的手指通过手指连接在装置的周边。该设计在相邻层中重复，其中设计可以在相邻的金属层之间相同或旋转（例如180°）。

3. 发明授权

US08710616B2 Die seal ring 有权
标题翻译：模具密封圈
公开(公告)号：US08710616B2
公开(公告)日：2014-04-29
申请号：US13133791
申请日：2009-11-10
申请人： Rainer Herberholz , Howard Godfrey
发明人： Rainer Herberholz , Howard Godfrey
IPC分类号： H01L29/02
CPC分类号： H01L23/585 , H01L23/564 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An improved die seal ring is described which includes at least one break. In the region of the break in the die seal ring, the doping is modified so that the impedance of the electrical path across the break through the substrate is increased. Offsets in the break may also be used and the offset may be within a break in a track and/or between breaks in different tracks, where the die seal ring includes more than one track.
摘要翻译：描述了一种改进的密封环，其包括至少一个断裂。在模具密封环断裂的区域中，掺杂被修改，使得越过穿过衬底的穿过电路的阻抗增加。也可以使用断裂中的偏移，并且偏移可能在轨道中的断裂和/或不同轨迹的断裂之间，其中模具密封环包括多于一个轨道。

4. 发明授权

US08600335B2 Receiver comprising a plurality of selectable receive paths 有权
标题翻译：接收机包括多个可选接收路径
公开(公告)号：US08600335B2
公开(公告)日：2013-12-03
申请号：US13328633
申请日：2011-12-16
申请人： Konstantinos Manetakis
发明人： Konstantinos Manetakis
IPC分类号： H04B1/16
CPC分类号： H04B1/0053 , H04B1/18
摘要： A receiver comprising: an antenna for receiving signals in a plurality of frequency bands; an integrated circuit including a plurality of amplifiers, wherein each of the plurality of amplifiers is configured to amplify signals in one of the plurality of frequency bands; and a plurality of selectable receive paths, each of the plurality of selectable receive paths connecting an output of the antenna to an input of one of the plurality of amplifiers and including a resonant circuit.
摘要翻译：一种接收机，包括：用于接收多个频带中的信号的天线; 包括多个放大器的集成电路，其中所述多个放大器中的每一个被配置为放大所述多个频带之一中的信号; 以及多个可选择的接收路径，所述多个可选择的接收路径中的每一个将所述天线的输出连接到所述多个放大器之一的输入并且包括谐振电路。

5. 发明授权

US08332705B2 Device and method of data combining 有权
标题翻译：数据组合的设备和方法
公开(公告)号：US08332705B2
公开(公告)日：2012-12-11
申请号：US12483747
申请日：2009-06-12
申请人： Diego Giancola , David Frank Chappaz
发明人： Diego Giancola , David Frank Chappaz
IPC分类号： H04L1/18
CPC分类号： H04L1/1845 , H04L1/1819
摘要： A device and method of combining a first version of an information block and a second version of the information block is disclosed. The method comprises calculating, prior to combining the first and second versions of the information block, a scaling factor to be applied in combining the first and second versions of the information block to produce a scaled combined information block.
摘要翻译：公开了组合信息块的第一版本和信息块的第二版本的装置和方法。该方法包括在组合信息块的第一和第二版本之前，计算要在组合信息块的第一和第二版本时应用的缩放因子，以产生缩放的组合信息块。

6. 发明授权

US08331499B2 Receiver 有权
标题翻译：接收器
公开(公告)号：US08331499B2
公开(公告)日：2012-12-11
申请号：US12428020
申请日：2009-04-22
申请人： David Chappaz
发明人： David Chappaz
IPC分类号： H04L27/01
CPC分类号： H04L25/03038 , H04L1/0625 , H04L1/0643
摘要： A receiver for a telecommunications system in which a data signal is transmitted using a closed loop transmit diversity system and a pilot signal is transmitted using a space time transmit diversity system, the receiver comprising an equalizer for equalising a signal received by the receiver, wherein the equalizer is configured to produce an equalized signal in which effects caused by a propagation channel through which the data signal was transmitted are alleviated, the receiver further comprising a processor for processing the equalized received signal to recover the pilot signal.
摘要翻译：使用空时发射分集系统发送用于使用闭环发射分集系统和导频信号发送数据信号的电信系统的接收机，所述接收机包括用于均衡由接收机接收的信号的均衡器，其中，均衡器被配置为产生均衡信号，其中减轻了由发送数据信号的传播信道造成的影响，接收机还包括处理器，用于处理均衡的接收信号以恢复导频信号。

7. 发明授权

US08110903B2 QFN package 有权
标题翻译： QFN封装
公开(公告)号：US08110903B2
公开(公告)日：2012-02-07
申请号：US12544468
申请日：2009-08-20
申请人： Peter John Robinson
发明人： Peter John Robinson
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L21/565 , H01L23/49517 , H01L23/49541 , H01L23/49548 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4943 , H01L2224/73265 , H01L2224/85 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An improved Quad Flat No-Lead package is described. The package is formed by encapsulating a die mounted on a leadframe with a moulding compound using a mould chase. The mould chase comprises a number of internal projections which form openings in the mould compound to expose regions of the leadframe. These exposed regions of the leadframe may then be used for soldering the package to a substrate. The arrangement of the openings may be designed such that each aperture is the same shape and size and/or that the apertures are arranged in multiple rows on the underside of the package.
摘要翻译：描述了改进的Quad Flat No-Lead封装。该包装通过使用模具追逐使用模制化合物封装安装在引线框架上的模具而形成。模具包括多个内部突起，其在模具化合物中形成开口以暴露引线框架的区域。然后可以将引线框架的这些暴露区域用于将封装焊接到衬底。开口的布置可以被设计成使得每个孔具有相同的形状和尺寸和/或孔被布置成在包装的下侧上的多排。

8. 发明申请

US20110241182A1 DIE SEAL RING 有权
标题翻译： DIE密封圈
公开(公告)号：US20110241182A1
公开(公告)日：2011-10-06
申请号：US13133791
申请日：2009-11-10
申请人： Rainer Herberholz , Howard Godfrey
发明人： Rainer Herberholz , Howard Godfrey
IPC分类号： H01L23/58 , H01L21/22
CPC分类号： H01L23/585 , H01L23/564 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An improved die seal ring is described which includes at least one break. In the region of the break in the die seal ring, the doping is modified so that the impedance of the electrical path across the break through the substrate is increased. Offsets in the break may also be used and the offset may be within a break in a track and/or between breaks in different tracks, where the die seal ring includes more than one track.
摘要翻译：描述了一种改进的密封环，其包括至少一个断裂。在模具密封环断裂的区域中，掺杂被修改，使得越过穿过衬底的穿过电路的阻抗增加。也可以使用断裂中的偏移，并且偏移可能在轨道中的断裂和/或不同轨迹的断裂之间，其中模具密封环包括多于一个轨道。

9. 发明申请

US20110235760A1 EFFICIENT OFDM PEAK REDUCTION ALGORITHM 有权
标题翻译：有效的OFDM峰值减少算法
公开(公告)号：US20110235760A1
公开(公告)日：2011-09-29
申请号：US13052502
申请日：2011-03-21
申请人： Chunyang Yu , Andrei Popescu
发明人： Chunyang Yu , Andrei Popescu
IPC分类号： H04B1/10
CPC分类号： H04B1/0475 , H04L27/2614
摘要： An efficient method of OFDM peak reduction is described. In an embodiment, a set of the most significant peaks in a symbol of an OFDM signal are identified and then, for each identified peak, a shifted and scaled version of a template cancellation signal is subtracted from the OFDM signal. The template cancellation signal is shifted such that its peak aligns with the identified peak and it is scaled such that it has the opposite phase to the identified peak. No iterative peak search and cancellation is involved in peak reduction, i.e. a cancellation step is not followed by another peak search for the same OFDM symbol. The process is repeated for each symbol in turn and in some embodiments the OFDM signal is up-sampled before it is analyzed to identify the most significant peaks.
摘要翻译：描述了OFDM峰值降低的有效方法。在一个实施例中，识别OFDM信号的符号中的一组最重要的峰值，然后，对于每个识别的峰值，从OFDM信号中减去模板消除信号的偏移和缩放版本。模板消除信号被移位，使得其峰值与识别的峰值对准，并且其被缩放使得其与所识别的峰值具有相反的相位。在峰值降低中不涉及迭代峰值搜索和消除，即消除步骤不跟随相同OFDM符号的另一峰值搜索。依次对每个符号重复该过程，并且在一些实施例中，OFDM信号在被分析之前被上采样以识别最高有效峰。

10. 发明申请

US20110198753A1 IMPROVED WAFER LEVEL CHIP SCALE PACKAGING 有权
标题翻译：改进的水平切片尺寸包装
公开(公告)号：US20110198753A1
公开(公告)日：2011-08-18
申请号：US13124712
申请日：2009-09-14
申请人： Andrew Holland
发明人： Andrew Holland
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/94 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/02 , H01L24/12 , H01L24/17 , H01L2224/02351 , H01L2224/0401 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014
摘要： An improved wafer level chip scale packaging technique is described which does not use an encapsulated via to connect between a redirection layer and a pad within the pad ring on the semiconductor die. In an embodiment, a first dielectric layer is formed such that it terminates on each die within the die's pad ring. Tracks are then formed in a conductive layer which contact one of the pads and run over the edge of an opening onto the surface of the first dielectric layer. These tracks may be used to form an electrical connection between the pad and a solder ball.
摘要翻译：描述了改进的晶片级芯片级封装技术，其不使用封装通孔来连接半导体管芯上的焊盘环中的重定向层和焊盘之间。在一个实施例中，形成第一介电层，使得其在模具的衬垫环内的每个管芯上终止。然后在导电层中形成轨道，该导电层接触一个焊盘之一并在开口的边缘上延伸到第一介电层的表面上。这些轨道可用于在焊盘和焊球之间形成电连接。

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