专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5144457A Integrated imaging assembly 失效
标题翻译：集成成像组件
公开(公告)号：US5144457A
公开(公告)日：1992-09-01
申请号：US737949
申请日：1991-08-29
申请人： Gary Copenhaver , Johan Bakker , John Vala
发明人： Gary Copenhaver , Johan Bakker , John Vala
IPC分类号： F21V8/00 , G02B6/06 , G06K7/10 , G06K17/00
CPC分类号： G02B6/06 , G02B6/0005 , G06K17/00 , G06K7/10722 , G06K2017/0038
摘要： Packaging of "image-lift" components wherein a unitary mount is used for integrating optical/thermal components, mounting them under a working platform of an operating structure to be simply, removably coupled to this platform, and arranged to thereby thermally-optically isolate these components from interference with, or by, this operating structure.
摘要翻译： “图像提升”部件的包装，其中一体式安装件用于集成光学/热部件，将它们安装在操作结构的工作平台下，简单地可移除地联接到该平台，并且布置成热隔离这些部件不受干扰或由此操作结构造成。

2. 外观设计

USD290702S Display terminal 失效
公开(公告)号：USD290702S
公开(公告)日：1987-07-07
申请号：US683683
申请日：1984-12-19
申请人： Timothy R. Stern , Vladimir Selepouchin
设计人： Timothy R. Stern , Vladimir Selepouchin

3. 发明授权

US4665536A Programmable automatic power-off system for a digital terminal 失效
标题翻译：数字终端的可编程自动关机系统
公开(公告)号：US4665536A
公开(公告)日：1987-05-12
申请号：US837991
申请日：1986-03-10
申请人： Dongsung R. Kim
发明人： Dongsung R. Kim
IPC分类号： G06F1/32 , G06F15/02 , G06M3/02
CPC分类号： G06F1/3228
摘要： A programmable unit for attachment to a work-station whereby power to the work-station will be shut off after a pre-set time-period, unless work-station activity occurs before the outset of the time-period, when the pre-set time-period will initiate again.
摘要翻译：一个用于连接到工作站的可编程单元，由此在预设时间段之后将切断到工作站的电力，除非在时间段开始之前发生工作站活动，否则当预设时间段将再次启动。

4. 发明授权

US4658353A System control network for multiple processor modules 失效
标题翻译：用于多个处理器模块的系统控制网络
公开(公告)号：US4658353A
公开(公告)日：1987-04-14
申请号：US673256
申请日：1984-11-20
申请人： Bruce E. Whittaker , James H. Jeppesen, III , Andrew W. Beale
发明人： Bruce E. Whittaker , James H. Jeppesen, III , Andrew W. Beale
IPC分类号： G06F13/00 , G06F9/52 , G06F13/376 , G06F13/42 , G06F15/16 , G06F15/177
CPC分类号： G06F13/376 , G06F13/4213
摘要： A system for controlling communication in a network of digital modules where each digital module has a maintenance processor which connects the digital module through a network bus to every other digital module's maintenance processor. Each transmitting module can lock up the network bus temporarily for data transmission operations to a specifically addressed receiver module. This system basically permits free communication access of any digital module to any other digital module.
摘要翻译：一种用于控制数字模块网络中的通信的系统，其中每个数字模块具有通过网络总线将数字模块连接到每个其他数字模块的维护处理器的维护处理器。每个发送模块可以临时锁定网络总线以进行数据传输操作到专门寻址的接收器模块。该系统基本上允许任何数字模块到任何其他数字模块的免费通信访问。

5. 发明授权

US4657602A Integrated complementary transistor circuit at an intermediate stage of manufacturing 失效
标题翻译：集成互补晶体管电路在制造的中间阶段
公开(公告)号：US4657602A
公开(公告)日：1987-04-14
申请号：US698657
申请日：1983-06-10
申请人： Donald L. Henderson, Sr.
发明人： Donald L. Henderson, Sr.
IPC分类号： H01L21/762 , H01L21/8238 , H01L21/263
CPC分类号： H01L21/76218 , H01L21/823892 , Y10S438/965
摘要： An integrated complementary transistor circuit at an intermediate stage of manufacturing comprises a semiconductor substrate having dopant atoms of a first conductivity type and having a substantially flat major surface; a patterned layer of material that is essentially impervious to oxygen diffusion covering first and second spaced apart areas on the surface and having openings which expose the surface between the areas; a channel stop region having dopant atoms of the first conductivity type with a larger doping concentration than the substrate throughout that portion of the surface which is exposed by the openings; and a well region having dopant atoms of a second conductivity type opposite to the first type in the substrate under all of the second area and extending under an adjacent portion of the channel stop region but terminating before reaching the first area; the well region also having a depth and doping concentration at the center of the second area which is substantially smaller than the depth and doping concentration below the channel stop region and adjacent portion of the second area.
摘要翻译：在制造的中间阶段的集成互补晶体管电路包括具有第一导电类型的掺杂剂原子并且具有基本平坦的主表面的半导体衬底; 基本上不渗透氧扩散的图案化材料层，覆盖表面上的第一和第二间隔开的区域，并且具有露出该区域之间的表面的开口; 具有第一导电类型的掺杂剂原子的沟道停止区，在由开口暴露的表面的该部分处具有比衬底更大的掺杂浓度; 以及在所有第二区域内在衬底中具有与第一类型相反的第二导电类型的掺杂剂原子的阱区，并且在通道停止区域的相邻部分下方延伸，但在到达第一区域之前终止; 所述阱区域在第二区域的中心处也具有深度和掺杂浓度，该深度和掺杂浓度基本上小于沟道停止区域和第二区域的相邻部分之下的深度和掺杂浓度。

6. 发明授权

US4654892A Electro-optical system using light modulation 失效
标题翻译：电光系统采用光调制
公开(公告)号：US4654892A
公开(公告)日：1987-03-31
申请号：US723281
申请日：1985-04-15
申请人： Richard I. Ely
发明人： Richard I. Ely
IPC分类号： H03F3/08 , H04B10/158 , H04B9/00
CPC分类号： H04B10/6911 , H03F3/08
摘要： An electro-optical system includes a phototransistor having collector and emitter electrodes and adapted to receive modulated light representing data and generating current in a current flow path representative of the received light. A load is placed in the current flow path and generates a voltage due to the current flow, and means are provided for sensing the generated voltage and using that voltage in a feedback circuit to the phototransistor to maintain the collector base junction voltage of the phototransistor constant.
摘要翻译：电光学系统包括具有集电极和发射极的光电晶体管，并且适于接收表示数据的调制光并在表示所接收的光的电流流路中产生电流。负载被放置在电流流动路径中并且由于电流而产生电压，并且提供用于感测所产生的电压并且在反馈电路中使用该电压到光电晶体管的装置来维持光电晶体管的集电极基极电压恒定。

7. 发明授权

US4654780A Parallel register transfer mechanism for a reduction processor evaluating programs stored as binary directed graphs employing variable-free applicative language codes 失效
标题翻译：用于还原处理器的并行寄存器传送机制，评估使用无变量应用语言代码存储为二进制定向图的程序
公开(公告)号：US4654780A
公开(公告)日：1987-03-31
申请号：US617531
申请日：1984-06-05
申请人： Gary L. Logsdon , Mark R. Scheevel , Brent C. Bolton
发明人： Gary L. Logsdon , Mark R. Scheevel , Brent C. Bolton
IPC分类号： G06F9/30 , G06F9/315 , G06F9/38 , G06F9/44 , G06F13/00
CPC分类号： G06F9/30032 , G06F9/30072 , G06F9/30141 , G06F9/4436
摘要： A parallel register-transfer mechanism has been disclosed above for use in the evaluation of expressions of a variable-free applicative language stored as binary directed graphs. The expression is reduced through a series of transformations until a result is obtained. A register file is provided with several crossbar networks interconnecting the various registers in the file for simultaneous transfer of their contents.
摘要翻译：以上已经公开了一种并行寄存器传送机制，用于评估存储为二进制有向图的无变量应用语言的表达式。通过一系列转换来减少表达，直到获得结果。寄存器文件提供有多个互连网络，将文件中的各种寄存器互连，以便同时传送其内容。

8. 发明授权

US4643935A Epoxy-glass integrated circuit package having bonding pads in a stepped cavity 失效
标题翻译：环氧玻璃集成电路封装，具有阶梯式空腔中的焊盘
公开(公告)号：US4643935A
公开(公告)日：1987-02-17
申请号：US819995
申请日：1986-01-21
申请人： Norman E. McNeal , Richard A. Nagy , Ronald A. Norell
发明人： Norman E. McNeal , Richard A. Nagy , Ronald A. Norell
IPC分类号： H01L21/48 , H01L23/14 , H01L23/498 , B32B3/10 , B32B27/38
CPC分类号： H01L23/145 , H01L21/4803 , H01L23/49822 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787
摘要： An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.
摘要翻译：一种集成电路封装包括多个薄平面环氧玻璃层，它们以堆叠方式布置并且通过位于环氧玻璃层之间的预浸料层层压在一起。该叠层具有阶梯状并从外部环氧玻璃层向内部环氧玻璃层延伸的空腔，沿着内部环氧玻璃层平行，然后穿过其中。图案化的电导体位于内部环氧玻璃层的平坦表面上，包括其暴露的平坦表面部分上的引线接合焊盘。

9. 发明授权

US4641176A Semiconductor package with contact springs 失效
标题翻译：带接触弹簧的半导体封装
公开(公告)号：US4641176A
公开(公告)日：1987-02-03
申请号：US885339
申请日：1986-07-11
申请人： Alain Keryhuel , Christian Meigne
发明人： Alain Keryhuel , Christian Meigne
IPC分类号： H01L21/48 , H01L23/057 , H01L23/495 , H01L23/02 , H01L23/50 , H01R13/02 , H05K7/12
CPC分类号： H01L23/49572 , H01L21/4839 , H01L23/057 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/85205 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181
摘要： An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process involving its assembly on a transport tape and its final cutting therefrom.
摘要翻译：用于高密度应用的集成电路封装包括在其一个表面上的弹簧触点，用于其可移除地安装到印刷电路板上，该安装通过框架组件实现，并且该封装可以以涉及其组件的连续流动过程自动制成运输胶带及其最终切割。

10. 发明授权

US4636275A Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity 失效
标题翻译：弹性囊法制造具有阶梯腔中的接合垫的集成电路封装
公开(公告)号：US4636275A
公开(公告)日：1987-01-13
申请号：US819994
申请日：1986-01-21
申请人： Ronald A. Norell
发明人： Ronald A. Norell
IPC分类号： H01L23/08 , H01L21/48 , H01L23/12 , H01L23/498 , B32B31/20
CPC分类号： H01L23/49822 , H01L21/4857 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787
摘要： An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along a portion of the flat surface of the internal epoxy-glass layer, and then penetrates through it. Conductors lie on the internal epoxy-glass layer including bonding pads on the flat surface portion. After the stack is assembled, the outer epoxy-glass layer and the cavity are covered with an elastic bladder. Subsequently, the stack is laminated by forcing a fluid into the bladder at a temperature and pressure which causes the bladder's membrane to stretch and push against all the surfaces of the cavity. This dams the adhesive from flowing onto the bonding pads.
摘要翻译：集成电路封装通过组装由多个薄平的环氧玻璃层，环氧玻璃层之间的粘合剂层和阶梯形空腔组成的堆叠来制造。该空腔从外部环氧玻璃层延伸到内部环氧玻璃层，沿着内部环氧玻璃层的平坦表面的一部分平行，然后穿过其中。导体位于包含平坦表面部分上的接合焊盘的内部环氧玻璃层上。在堆叠组装之后，外部环氧树脂玻璃层和空腔被弹性囊覆盖。随后，通过在使气囊的膜拉伸并推压空腔的所有表面的温度和压力下迫使流体进入膀胱中来层叠叠层。这阻止粘合剂流到接合垫上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式