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1. 发明授权

US11538703B2 Substrate housing container 有权
公开(公告)号：US11538703B2
公开(公告)日：2022-12-27
申请号：US16483589
申请日：2017-02-06
申请人： Achilles Corporation
发明人： Masayuki Nishijima
IPC分类号： G11C15/04 , H01L21/673 , H01L21/677 , H01L21/687 , G11C5/04
摘要： A substrate housing container (1) includes (i) a container body (10) having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which substrates (W) are stacked, the mount element 12 facing the opening (11), and (ii) a cover (20) to cover the opening (11), wherein the cover (20) includes a lid portion (21) to cover the opening (11) and at least two holding members (22) disposed on the lid portion (21), the holding members (22) being configured to swing in a central direction of the lid portion (21) and to press outer sides of the substrates (W) accommodated in the container body (10) with the substrates (W) stacked, the container body (10) has guide grooves (13) to make tips (22a) of the holding members (22) move from an outer side of the mount element (12) to an inner sides of the mount element (12) to guide the tips (22a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guide grooves (13) are formed as a dent on surfaces of the mount element (12).

2. 发明授权

US11335615B2 Wafer accommodation container 有权
公开(公告)号：US11335615B2
公开(公告)日：2022-05-17
申请号：US16498262
申请日：2018-03-19
申请人： Achilles Corporation
发明人： Masayuki Nishijima , Kenichi Hirose
IPC分类号： H01L23/13 , H01L23/051
摘要： Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).

3. 发明授权

US11121013B2 Semiconductor wafer container 有权
公开(公告)号：US11121013B2
公开(公告)日：2021-09-14
申请号：US16498450
申请日：2018-02-06
申请人： Achilles Corporation
发明人： Masayuki Nishijima , Kenichi Hirose , James Christie
IPC分类号： H01L21/673
摘要： A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

4. 发明授权

US06960618B2 Preparation method for rigid polyurethane foam 有权
标题翻译：硬质聚氨酯泡沫的制备方法
公开(公告)号：US06960618B2
公开(公告)日：2005-11-01
申请号：US10646829
申请日：2003-08-25
申请人： Yoshiyuki Ohnuma , Junichiro Mori , Hideki Tosaki
发明人： Yoshiyuki Ohnuma , Junichiro Mori , Hideki Tosaki
IPC分类号： C08G18/00 , C08G18/40 , C08G101/00 , C08J9/12 , C08J9/04
CPC分类号： C08J9/122 , C08G18/4018 , C08G2101/0025 , C08G2101/005 , C08J2203/08 , C08J2205/052 , C08J2205/10 , C08J2375/04
摘要： The present invention relates to a preparation method for low-density polyurethane foam excelling in the flame retardance and the dimensional stability, wherein rigid polyurethane foam having the average value for the ratio of lengthwise direction diameter/cross direction diameter of cells being 1.0 to 1.4 and the density of 20 to 40 kg/m3 is prepared by combining, as blowing agent, carbon dioxide generated in the reaction between water and polyisocyanate and carbon dioxide under supercritical state, subcritical state or liquid state, and by adding said water and said carbon dioxide under liquid state into said polyol component prior to mixing the polyisocyanate component and the polyol component, and to rigid polyurethane foam obtained by said method.
摘要翻译：本发明涉及一种阻燃性和尺寸稳定性优异的低密度聚氨酯泡沫塑料的制造方法，其中硬质聚氨酯泡沫体的长度方向直径/横截面直径比的平均值为1.0〜1.4，通过在超临界状态，亚临界状态或液态下将作为发泡剂的水与多异氰酸酯和二氧化碳之间的反应中产生的二氧化碳组合，制备20〜40kg / m 3的密度，在混合多异氰酸酯组分和多元醇组分之前，将所述水和所述二氧化碳在液态下加入到所述多元醇组分中，以及通过所述方法获得的硬质聚氨酯泡沫。

5. 发明授权

US06943302B2 Flexible printed circuit board 有权
标题翻译：柔性印刷电路板
公开(公告)号：US06943302B2
公开(公告)日：2005-09-13
申请号：US10329557
申请日：2002-12-27
申请人： Teruyoshi Kageyama , Shinya Okino , Mamoru Ito
发明人： Teruyoshi Kageyama , Shinya Okino , Mamoru Ito
IPC分类号： G11B5/48 , H05K1/00 , H05K1/02 , H05K1/05 , H05K3/28 , H05K3/32
CPC分类号： G11B5/4853 , G11B5/40 , H05K1/0259 , H05K1/0393 , H05K1/056 , H05K3/28 , H05K3/328 , H05K2201/0329 , H05K2201/10234 , H05K2203/0285
摘要： A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side. More preferably, in the magnetic head connecting portion, the cover layer is not formed, and on the base layer in the magnetic head connecting portion, a conductive polymer layer is formed, whereas on the plurality of conductive circuits in the magnetic head connecting portion, the conductive polymer layer is not present or is substantially absent, if any, to such a degree as to allow the magnetic head to be electrically connected to the conductive circuits.
摘要翻译：本发明的柔性印刷电路板将放置在悬架上的磁头的连接部分直接中继到磁盘装置的磁头悬挂组件中的托架臂的基端的连接部分。柔性印刷电路板包括由至少基底层，形成在基底层上的多个导电电路，覆盖导电电路的覆盖层和形成在绝缘材料部分中的导电聚合物层组成的叠层体层压板。柔性印刷电路板包括在基底层下方的不锈钢层或基底层侧上的导电聚合物层的下侧。更优选地，在磁头连接部分中，没有形成覆盖层，并且在磁头连接部分的基底层上形成导电聚合物层，而在磁头连接部分的多个导电电路上，导电聚合物层不存在或基本上不存在（如果有的话）到允许磁头电连接到导电电路的程度。

6. 发明授权

US5374377A Phosphorescent polyvinyl chloride films 失效
标题翻译：磷光聚氯乙烯膜
公开(公告)号：US5374377A
公开(公告)日：1994-12-20
申请号：US6312
申请日：1993-01-19
申请人： Bach T. Nguyen , Toshihiro Katagiri
发明人： Bach T. Nguyen , Toshihiro Katagiri
IPC分类号： C08J5/18 , C08K3/30 , C08K5/09 , C08K5/098 , C08K5/10 , C08K5/52 , C08K13/02 , C08L27/06 , C09K11/02 , F21K2/00 , C09K11/56
CPC分类号： F21K2/00 , C08K13/02 , C08K3/30 , C09K11/02 , C09K11/025 , C09K11/565
摘要： There is disclosed a phosphorescent polyvinyl chloride ("PVC") film which exhibits an intense and long-lived afterglow. The phosphorescent PVC film contains a polymerized PVC-based resin, a primary and secondary plasticizer, a primary and secondary stabilizer, and a phosphorescent pigment. Within the practice of this invention, the primary stabilizer is solely a zinc-based stabilizer (non-zinc metal stabilizers are not employed); the secondary stabilizer is a tertiary organic phosphite; the primary plasticizer is a epoxidized soybean oil; the secondary plasticizer is selected from phthalates, adipates, trimellitates, azelates and phosphates; and the phosphorescent pigment is preferably a zinc sulfide phosphor. In addition to the phosphorescent PVC film, compositions and related methods are also disclosed.
摘要翻译：公开了一种具有强烈且长寿命的余辉的磷光聚氯乙烯（“PVC”）膜。磷光PVC膜包含聚合的PVC基树脂，一级和二级增塑剂，一级和二级稳定剂和磷光颜料。在本发明的实践中，主要稳定剂仅为锌基稳定剂（不使用非锌金属稳定剂）; 次级稳定剂是叔有机亚磷酸酯; 主要增塑剂是环氧化大豆油; 次级增塑剂选自邻苯二甲酸酯，己二酸酯，偏苯三酸酯，壬二酸酯和磷酸酯; 磷光颜料优选为硫化锌荧光体。除了磷光PVC膜之外，还公开了组合物和相关方法。

7. 发明授权

US11049748B2 Separator 有权
公开(公告)号：US11049748B2
公开(公告)日：2021-06-29
申请号：US15769318
申请日：2016-10-20
申请人： Achilles Corporation
发明人： Masayuki Nishijima , Kenichi Hirose
IPC分类号： H01L21/673 , B65D85/30
摘要： Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.

8. 发明申请

US20210118712A1 SEMICONDUCTOR WAFER CONTAINER 有权
公开(公告)号：US20210118712A1
公开(公告)日：2021-04-22
申请号：US16498450
申请日：2018-02-06
申请人： Achilles Corporation
发明人： Masayuki NISHIJIMA , Kenichi HIROSE , James CHRISTIE
IPC分类号： H01L21/673
摘要： [Problem to be Solved]
To provide a semiconductor wafer container
[Solution]
A semiconductor wafer container including two outer shells in a substantially flat and identical form, each outer shell vertically overlapping so as to accommodate a single semiconductor wafer therein, wherein the outer shell has a wafer retaining device and an external wall forming device in addition to a main body of the outer shell, wherein the wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells, the wafer retaining device including: an inclined surface formed on an upper surface of the outer shell and being in line contact with an outer peripheral edge of the wafer from below; a wafer contact surface formed on a bottom surface of the outer shell and being in surface contact with the outer peripheral edge of the wafer from above; and a shallow gap portion formed on each central region of both the upper and bottom surfaces of the outer shell so as to cover an upper part or a lower part of the wafer; and wherein the external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

9. 发明申请

US20040190143A1 Color sheet having light-shielding property 有权
标题翻译：具有遮光性的彩色片
公开(公告)号：US20040190143A1
公开(公告)日：2004-09-30
申请号：US10806151
申请日：2004-03-23
申请人： ACHILLES CORPORATION
发明人： Junichi Harasawa , Takuo Suzuki , Hiroki Ashizawa
IPC分类号： G02F001/1335 , G02B027/00
CPC分类号： G02B5/208 , Y10T428/31504
摘要： A color sheet having a light-shielding effect comprises at least a reflecting layer and a color layer overcoated on the side of the color sheet where the color sheet is exposed to light from the reflecting layer. The reflecting layer a solar-radiation reflectance of 60% or more in a wavelength range of 780 nm to 1350 nm, and the color layer has a light transmittance of 30% or more in a wavelength range of 780 nm to 1350 nm and a solar-radiation absorbance of 10 to 80% in a wavelength range of 380 nm to 780 nm.
摘要翻译：具有遮光效果的彩色片材至少包括反射层和在彩色片材的侧面上涂覆有着色片的着色层，其中彩色片材暴露于来自反射层的光。反射层在780nm〜1350nm的波长范围内的太阳辐射反射率为60％以上，彩色层在780nm〜1350nm的波长范围内的透光率为30％以上，太阳能在380nm至780nm的波长范围内的辐射吸光度为10至80％。

10. 发明申请

US20190032221A1 SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF 审中-公开
公开(公告)号：US20190032221A1
公开(公告)日：2019-01-31
申请号：US16046422
申请日：2018-07-26
申请人： TDK CORPORATION , ACHILLES CORPORATION
发明人： Makoto ORIKASA , Yuhei HORIKAWA , Yoshihiro KANBAYASHI , Hisayuki ABE , Hiroki ASHIZAWA , Miho MORI , Misaki TAMURA
IPC分类号： C23C18/31 , H05K3/18 , H05K3/06 , H05K1/03 , C23C18/16
摘要： A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

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