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1. 发明授权

US07554184B2 Image sensor chip package 失效
标题翻译：图像传感器芯片封装
公开(公告)号：US07554184B2
公开(公告)日：2009-06-30
申请号：US11448570
申请日：2006-06-07
申请人： Steven Webster , Ying-Cheng Wu
发明人： Steven Webster , Ying-Cheng Wu
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L2224/32014 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/16195 , H01L2924/00014
摘要： A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
摘要翻译：芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。载体（20）包括基座（24）。芯片安装在基座上并具有有源区域（222）。第二导电装置将芯片与导电装置电连接。第一粘合装置被施加在芯片的有效区域周围。透明盖安装在托架的底座上。该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

2. 发明授权

US07460317B2 Digital camera module with improved image quality 有权
标题翻译：具有改善图像质量的数码相机模块
公开(公告)号：US07460317B2
公开(公告)日：2008-12-02
申请号：US11450649
申请日：2006-06-09
申请人： Steven Webster , Ying-Cheng Wu , Ching-Lung Jao
发明人： Steven Webster , Ying-Cheng Wu , Ching-Lung Jao
IPC分类号： G02B7/02
CPC分类号： G02B7/02
摘要： A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.
摘要翻译：数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。透镜架定义中心空心。透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。图像拾取模块被布置成接收来自透镜的光。保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

3. 发明申请

US20080019026A1 LENS MODULE WITH SHIELDING LAYER 失效
标题翻译：带屏蔽层的镜头模块
公开(公告)号：US20080019026A1
公开(公告)日：2008-01-24
申请号：US11617135
申请日：2006-12-28
申请人： CHEN FENG , MING LEE
发明人： CHEN FENG , MING LEE
IPC分类号： G02B7/02
CPC分类号： G02B7/02 , G02B7/023
摘要： A lens module (200) includes a barrel (20), a lens (30) and a shielding layer (51). The barrel includes a screening end (21) and a mounting end (22) positioned opposite to the screening end, and defines an aperture (23) in the screening end. A diameter of the aperture reduces in a direction from the screening end to the mounting end so that the aperture has a large diameter and a small diameter. The lens is received in the barrel. The shielding layer made of an opaque film is mounted on the screening end and defines a receiving hole (511) aligned with the aperture. The receiving hole has a diameter being in a range of the large diameter and the small diameter.
摘要翻译：透镜模块（200）包括镜筒（20），透镜（30）和屏蔽层（51）。枪管包括一个屏蔽端（21）和一个与屏蔽端相对定位的安装端（22），并在屏蔽端限定一个孔（23）。孔的直径在从遮蔽端到安装端的方向上减小，使得孔具有大直径和小直径。镜头接收在镜筒中。由不透明膜制成的屏蔽层安装在屏蔽端上，并且限定与孔对准的接收孔（511）。接收孔的直径在大直径和小直径的范围内。

4. 发明申请

US20070126916A1 Image sensor chip packaging method 有权
标题翻译：图像传感器芯片封装方法
公开(公告)号：US20070126916A1
公开(公告)日：2007-06-07
申请号：US11595331
申请日：2006-11-10
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H01L2224/48091 , H01L2224/48095 , H01L2924/01079 , H01L2924/16195 , H04N5/2253 , H01L2924/00014
摘要： An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.
摘要翻译：图像传感器芯片封装方法包括：首先提供载体（20）。载体包括基座（21）和引线框架（23）。底座具有限定在其中的腔室（214）。引线框架具有多个导电件（233）。引线框架的导电片嵌入基座并彼此间隔开。然后将图像传感器芯片（30）安装在腔室中。图像传感器具有感光区域（301）和多个芯片焊盘（302）。然后提供多个接合线（40）。每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。然后提供具有保持腔（54）的保持器（50）。最后，将载体安装在支架的保持腔中。

5. 发明申请

US20070008631A1 Digital camera module with improved image quality 有权
标题翻译：具有改善图像质量的数码相机模块
公开(公告)号：US20070008631A1
公开(公告)日：2007-01-11
申请号：US11450649
申请日：2006-06-09
申请人： Steven Webster , Ying-Cheng Wu , Ching-Lung Jao
发明人： Steven Webster , Ying-Cheng Wu , Ching-Lung Jao
IPC分类号： G02B7/02
CPC分类号： G02B7/02
摘要： A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.
摘要翻译：数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。透镜架定义中心空心。透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。图像拾取模块被布置成接收来自透镜的光。保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

6. 发明申请

US20060273249A1 Image sensor chip package and method of manufacturing the same 审中-公开
标题翻译：图像传感器芯片封装及其制造方法
公开(公告)号：US20060273249A1
公开(公告)日：2006-12-07
申请号：US11398023
申请日：2006-04-04
申请人： Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48992 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.
摘要翻译：图像传感器芯片封装（200）包括基座（20），图像传感器芯片（23），多个导线（24），粘合装置（26）和盖子（28）。底座具有顶表面（201）和布置在顶表面上的多个顶垫（204）。图像传感器芯片安装在基座的顶表面上，并且在感光区域周围包括感光区域（231）和多个芯片焊盘（232）。电线将图像传感器芯片的芯片焊盘与基座的顶部焊盘电连接。粘合剂装置应用于图像传感器芯片的周边边缘，覆盖与芯片焊盘连接的导线和覆盖区域。盖是透明的，并通过粘合装置安装到图像传感器芯片上。盖子密封图像传感器芯片的感光区域。

7. 发明授权

US07639303B2 Method and apparatus for lens auto-focusing in camera module test 有权
标题翻译：相机模块测试中镜头自动对焦的方法和装置
公开(公告)号：US07639303B2
公开(公告)日：2009-12-29
申请号：US11309916
申请日：2006-10-27
申请人： Yu Tai , Chien-I Chen , Hai-Hung Wen
发明人： Yu Tai , Chien-I Chen , Hai-Hung Wen
IPC分类号： H04N5/232
CPC分类号： G03B13/36 , G02B7/36
摘要： A lens auto-focusing method in camera module testing includes the following steps: providing testing equipment including a range finder, a signal processor and a driving member; providing an imaged object (20); providing an camera module including a lens module (10) and an image sensor, the view angle and the biggest value of the modulation transfer function of the lens module are both certain values, the image (30) of the imaged object is formed in the image sensor; the imaged object and the image formed thereby in the other side of the lens module are fixed; the imaged object and the image formed in the other side of the lens module are fixed; inputting an image distance tested by the range finder into the signal processor, the signal processor calculates a displacement for the driving member; the driving member drives the lens module to a focusing point.
摘要翻译：相机模块测试中的镜头自动对焦方法包括以下步骤：提供包括测距仪，信号处理器和驱动部件的测试设备; 提供成像对象（20）; 提供包括透镜模块（10）和图像传感器的相机模块，透镜模块的调制传递函数的视角和最大值都是一定值，成像对象的图像（30）形成在图像传感器; 成像对象和由此形成的在透镜模块的另一侧中形成的图像是固定的; 成像对象和形成在透镜模块的另一侧的图像是固定的; 将由测距仪测试的图像距离输入到信号处理器中，信号处理器计算驱动构件的位移; 驱动构件将透镜模块驱动到聚焦点。

8. 发明授权

US07538862B2 Testing system for digital camera modules 失效
标题翻译：数码相机模块测试系统
公开(公告)号：US07538862B2
公开(公告)日：2009-05-26
申请号：US11592768
申请日：2006-11-03
申请人： Steven Webster , Ying-Cheng Wu , Yuan-Po Wang
发明人： Steven Webster , Ying-Cheng Wu , Yuan-Po Wang
IPC分类号： G01N21/00
CPC分类号： H04N17/002
摘要： A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.
摘要翻译：一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70），以及主处理器（90）。携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

9. 发明授权

US07342215B2 Digital camera module package fabrication method 有权
标题翻译：数码相机模块封装制造方法
公开(公告)号：US07342215B2
公开(公告)日：2008-03-11
申请号：US11453454
申请日：2006-06-14
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H01L27/00 , H01J5/02
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/16195 , H01L2924/00014
摘要： A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
摘要翻译：数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

10. 发明申请

US20070211912A1 Method and apparatus for lens auto-focusing in camera module test 有权
标题翻译：相机模块测试中镜头自动对焦的方法和装置
公开(公告)号：US20070211912A1
公开(公告)日：2007-09-13
申请号：US11309916
申请日：2006-10-27
申请人： Yu Tai , Chien-I Chen , Hai-Hung Wen
发明人： Yu Tai , Chien-I Chen , Hai-Hung Wen
IPC分类号： G06T7/00
CPC分类号： G03B13/36 , G02B7/36
摘要： A lens auto-focusing method in camera module testing includes the following steps: providing testing equipment including a range finder, a signal processor and a driving member; providing an imaged object (20); providing an camera module including a lens module (10) and an image sensor, the view angle and the biggest value of the modulation transfer function of the lens module are both certain values, the image (30) of the imaged object is formed in the image sensor; the imaged object and the image formed thereby in the other side of the lens module are fixed; the imaged object and the image formed in the other side of the lens module are fixed; inputting an image distance tested by the range finder into the signal processor, the signal processor calculates a displacement for the driving member; the driving member drives the lens module to a focusing point.
摘要翻译：相机模块测试中的镜头自动对焦方法包括以下步骤：提供包括测距仪，信号处理器和驱动部件的测试设备; 提供成像对象（20）; 提供包括透镜模块（10）和图像传感器的相机模块，透镜模块的调制传递函数的视角和最大值都是一定值，成像对象的图像（30）形成在图像传感器; 成像对象和由此形成的在透镜模块的另一侧中形成的图像是固定的; 成像对象和形成在透镜模块的另一侧的图像是固定的; 将由测距仪测试的图像距离输入到信号处理器中，信号处理器计算驱动构件的位移; 驱动构件将透镜模块驱动到聚焦点。

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