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    • 86. 发明授权
    • Reusable box blank
    • 可重复使用的盒子空白
    • US09290290B2
    • 2016-03-22
    • US14196388
    • 2014-03-04
    • INTEPLAST GROUP, LTD.
    • Gregory A. Carman
    • B65D5/30B65D5/02B65D5/10B31B1/60B65D5/00B65D5/42
    • B31B1/60B31B1/26B31B50/26B31B50/60B31B50/734B31B2201/26B31B2201/6095B65D5/003B65D5/0254B65D5/106B65D5/30B65D5/304B65D5/305B65D5/4295Y02W30/807
    • A blank for being repeatably assembled into a box configuration without the use of adhesives. The blank has a bottom panel, a side panel foldably attached to the bottom panel, an end panel foldably attached to the bottom panel, and a locking structure configured to secure the side panel and the end panel in respective orthogonal positions with respect to the bottom panel. The locking structure includes an overlay panel foldably attached to the end panel and foldable toward an overlying position in which it overlies a portion of the side panel. The locking structure also includes a slot in the bottom panel, a flap foldably attached to the bottom panel and extending into the slot, and a tab foldably attached to the overlay panel for being lockingly received in the slot to secure the overlay panel in the overlying position.
    • 一种用于可重复组装成盒结构而不使用粘合剂的坯料。 坯件具有底板,可折叠地附接到底板的侧板,可折叠地附接到底板的端板,以及锁定结构,其被构造成将侧板和端板相对于底板固定在相应的正交位置 面板。 锁定结构包括可折叠地附接到端板的覆盖板,并且能够朝着覆盖在侧板的一部分上方的上部位置折叠。 锁定结构还包括底板中的狭槽,可折叠地附接到底板并延伸到槽中的翼片以及可折叠地附接到覆盖板的突片,用于被锁定地容纳在槽中以将覆盖板固定在上覆 位置。
    • 87. 发明授权
    • Methods of joining device structures with adhesive
    • 用粘合剂连接器件结构的方法
    • US09266310B2
    • 2016-02-23
    • US13329010
    • 2011-12-16
    • James R. KrogdahlJames M. Cuseo
    • James R. KrogdahlJames M. Cuseo
    • B29C65/00B32B17/10B32B37/00B32B38/00B31B1/60B32B37/12
    • B32B37/003B32B37/1284B32B2305/34B32B2457/00Y10T156/1002
    • Structures such as layers of material associated with an electronic device may be assembled using adhesive. The adhesive may be dispensed onto the surface of an electronic device layer in liquid form. The liquid adhesive material may be a liquid pressure sensitive adhesive precursor material. Patterned structures such as touch sensor electrodes, black ink masking layers, and other structures may be formed on the electronic device layer. The use of liquid adhesive material may help the adhesive material flow over the edges of the patterned structures without forming bubbles or voids. Following application of the liquid pressure sensitive adhesive precursor material, the liquid pressure sensitive adhesive precursor material may be cured to form a solid layer of pressure sensitive adhesive. The layer of material on which the solid layer of pressure sensitive adhesive has been formed may then be vacuum laminated to an additional electronic device layer.
    • 可以使用粘合剂来组装诸如与电子设备相关联的材料层的结构。 粘合剂可以以液体形式分配到电子器件层的表面上。 液体粘合剂材料可以是液体压敏粘合剂前体材料。 可以在电子器件层上形成诸如触摸传感器电极,黑色墨水掩蔽层和其它结构的图案化结构。 使用液体粘合剂材料可以帮助粘合剂材料在图案化结构的边缘上流动,而不会形成气泡或空隙。 在施加液体压敏粘合剂前体材料之后,液体压敏粘合剂前体材料可以固化以形成压敏粘合剂的固体层。 已经形成了压敏粘合剂的固体层的材料层然后可以被真空层压到另外的电子器件层。