会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 84. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20150327354A1
    • 2015-11-12
    • US14690704
    • 2015-04-20
    • DENSO CORPORATION
    • Masafumi UMENO
    • H05K1/02H05K1/11H05K7/20
    • H05K1/02H05K1/0204H05K1/0209H05K1/11H05K1/115H05K5/0047H05K7/20H05K7/205H05K7/20854H05K2201/09063H05K2201/10545
    • An electronic device includes a circuit board, first and second electronic components, a housing, and a heat conduction member. The first electronic component is mounted on a first surface of the circuit board, and the second electronic component is mounted on a second surface of the circuit board. The first electronic component and the second electronic component are arranged in an arrangement direction. The heat conduction member is disposed between the housing and a first component-opposite portion of the circuit board opposite to the first electronic component, and between the housing and a second component-opposite portion of the circuit board opposite to the second electronic component. The circuit board has a through hole in a formation area between the first electronic component and the second electronic component. The heat conduction member integrally covers each of the first component-opposite portion and the second component-opposite portion and the formation area of the circuit board.
    • 电子设备包括电路板,第一和第二电子部件,壳体和导热部件。 第一电子部件安装在电路板的第一表面上,第二电子部件安装在电路板的第二表面上。 第一电子部件和第二电子部件沿排列方向排列。 导热构件设置在壳体与电路板的与第一电子部件相对的第一部件相对部分之间,以及壳体与电路板的与第二电子部件相对的第二部件相对部分之间。 电路板在第一电子部件和第二电子部件之间的形成区域中具有通孔。 导热构件一体地覆盖电路板的第一部件相对部分和第二部件相对部分和形成区域中的每一个。
    • 86. 发明申请
    • ELECTRONIC CONTROL DEVICE
    • 电子控制装置
    • US20150289357A1
    • 2015-10-08
    • US14438970
    • 2013-10-25
    • HITACHI AUTOMOTIVE SYSTEMS, LTD.
    • Yoshinori WakanaTakeshi IgarashiYasuro KameshiroTakashi HattoriMasaru Kamoshida
    • H05K1/02H05K5/00H05K1/18
    • H05K1/0204H01L23/36H01L23/42H01L2924/0002H05K1/181H05K5/0034H05K5/006H05K7/142H05K7/2039H05K7/20854H05K2201/066H01L2924/00
    • The invention provides an electronic control. device having a high-grade heat sink that: does not require tight control at the time of manufacturing; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall lie a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall lie so that it is exposed inside the connector inserting section 18. When a convex-shaped metal part 15, used as a heat sink, having a flange 15a on the bottom side is attached from an opening provided. in the housing base 11, the top section of the metal part 15 comes into contact with mounting position of the electronic component 13 on the board 14 via a heat dissipating filler material 16, and the flange 15a and the wall section near the opening are brought into contact with each other via a sealing filler material 17.
    • 本发明提供一种电子控制。 具有高级散热器的装置:在制造时不需要严格的控制; 结构简单 可以以较高的生产率生产; 并且具有成本效益。 在该装置中,当其上具有电子部件13的电路板14放置在非金属(树脂)壳体中时,其具有通过分隔壁一体地包括的壳体基座11,用于与电气连接的连接器插入部18 外部配合连接器(未示出); 以及安装在壳体基座11上的壳体盖12,将板14的一部分插入设置在分隔壁11a中的插入孔中,使其暴露在连接器插入部18的内部。当凸形金属部15, 用作散热器,从设置的开口安装在底侧具有凸缘15a。 在壳体基座11中,金属部15的顶部通过散热填充材料16与基板14上的电子部件13的安装位置接触,并且使凸缘15a和开口附近的壁部分 通过密封填充材料17彼此接触。
    • 89. 发明授权
    • Cooling system for aerospace vehicle components
    • 航空航天部件冷却系统
    • US08950468B2
    • 2015-02-10
    • US11747467
    • 2007-05-11
    • David E. Blanding
    • David E. Blanding
    • F28F3/12F28F1/32B64D13/00B64D13/06
    • B64D47/00B64D13/006B64D2013/0614H05K7/20854Y02T50/44
    • A cooling system for removing heat generated by electrical components onboard aerospace vehicles flows coolant between an evaporator that removes heat from the component, and a condenser within the skin of the vehicle. The skin is formed from facesheets comprising multiple layers of polymer resin reinforced with meshes of single and double wall nanotubes. The nanotubes conduct the heat directionally so as to both distribute the heat over the skin and direct the heat to the outer surface of the skin where the heat can be carried away by air flowing over the skin. The skin may also include conductive carbon foam surrounding the condenser to reduce thermal resistance between the condenser and the facesheets.
    • 用于去除航空航天车辆上的电气部件产生的热量的冷却系统在从部件移除热量的蒸发器与车辆皮肤内的冷凝器之间流动冷却剂。 皮肤由包含多层聚合物树脂的面板形成,所述聚合物树脂用单壁和双壁纳米管的网格增强。 纳米管定向地引导热量,以便将热量分布在皮肤上并将热量引导到皮肤的外表面,在该外表面可以通过流过皮肤的空气带走热量。 皮肤还可以包括围绕冷凝器的导电碳泡沫,以减少冷凝器和面板之间的热阻。