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81. 发明申请

US20090293268A1 PATTERNS OF CONDUCTIVE OBJECTS ON A SUBSTRATE AND METHOD OF PRODUCING THEREOF 有权
标题翻译：基体上的导电物体的形态及其生产方法
公开(公告)号：US20090293268A1
公开(公告)日：2009-12-03
申请号：US12538300
申请日：2009-08-10
申请人： Yoash CARMI
发明人： Yoash CARMI
IPC分类号： H05K3/00 , H05K3/06 , H05K3/22
CPC分类号： H01P11/003 , H01Q1/38 , H05B3/84 , H05B2203/017 , H05K1/0393 , H05K3/061 , H05K3/24 , H05K3/243 , H05K9/0096 , H05K2201/0108 , H05K2201/0326 , H05K2201/0329 , H05K2203/0315 , H05K2203/0571 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes applying a coating layer of electrically conductive transparent compounds onto a substrate; depositing in a vacuum deposition chamber an electrically conductive material onto the coating layer to form an electrically conductive layer; applying an etch-resist material on selective areas of the electrically conductive layer, wherein the selective areas are substantially areas pre-designed to carry the conductive objects; and chemically etching the electrically conductive material from exposed areas of the electrically conductive layer that are not covered by the etch-resist material.
摘要翻译：根据本发明的实施例，提供了一种用于在基板上制造导电元件图案的方法。该方法包括将导电透明化合物的涂层施加到基底上; 在真空沉积室中将导电材料沉积到涂层上以形成导电层; 在所述导电层的选择区域上施加抗蚀剂材料，其中所述选择区域是预先设计成承载导电物体的基本区域; 以及从未被抗蚀剂材料覆盖的导电层的暴露区域化学蚀刻导电材料。

82. 发明授权

US07569333B2 Wiring line structure and method for forming the same 有权
标题翻译：接线结构及其形成方法
公开(公告)号：US07569333B2
公开(公告)日：2009-08-04
申请号：US11852365
申请日：2007-09-10
申请人： Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
发明人： Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
IPC分类号： G03F7/00 , G03C5/00 , C23C28/00
CPC分类号： H01L21/76885 , G02F2001/136295 , H01L21/76834 , H05K3/0023 , H05K3/064 , H05K3/108 , H05K3/388 , H05K2201/0108 , H05K2203/0571 , H05K2203/0585 , H05K2203/0597
摘要： The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.
摘要翻译：布线线结构包括透明基板，阻挡层，金属层和光敏保护层。阻挡层和金属层依次设置在透明基板上。感光保护层形成在阻挡层和金属层的两侧。还公开了一种用于制造布线结构的方法。

83. 发明申请

US20090084598A1 CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：无害基板及其制造方法
公开(公告)号：US20090084598A1
公开(公告)日：2009-04-02
申请号：US11865261
申请日：2007-10-01
申请人： Houssam Jomaa
发明人： Houssam Jomaa
IPC分类号： H05K3/10 , H05K1/11
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/205 , H05K3/243 , H05K3/28 , H05K2201/09563 , H05K2201/096 , H05K2203/0376 , H05K2203/0384 , H05K2203/0571 , H05K2203/0733
摘要： Disclosed are a coreless substrate and a method of manufacturing the same. The coreless substrate includes a solder resist layer capable of being formed on each of on a first side and a second side of a metal panel. The solder resist layer includes at least one opening. A copper layer may be plated in the at least one opening such that a height of the copper layer exceeds a height of the solder resist layer. Further, at least one dielectric layer is deposited above the copper layer, and at least one microvia drilled in the dielectric layer. The at least one microvia enables an electrical connection between at least one of the first side and the second side of the metal panel and a lower surface of the coreless substrate.
摘要翻译：公开了一种无芯基板及其制造方法。无芯基板包括能够形成在金属板的第一侧和第二侧上的阻焊层。阻焊层包括至少一个开口。铜层可以镀在至少一个开口中，使得铜层的高度超过阻焊层的高度。此外，至少一个电介质层沉积在铜层之上，并且在介电层中钻出至少一个微孔。所述至少一个微孔使得能够在金属板的第一侧和第二侧中的至少一个与无芯基板的下表面之间形成电连接。

84. 发明申请

US20090019693A1 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20090019693A1
公开(公告)日：2009-01-22
申请号：US12237955
申请日：2008-09-25
申请人： Masaru Takada , Hiroyuki Kobayashi , Kenji Chihara , Hisashi Minoura , Kiyotaka Tsukada , Mitsuhiro Kondo
发明人： Masaru Takada , Hiroyuki Kobayashi , Kenji Chihara , Hisashi Minoura , Kiyotaka Tsukada , Mitsuhiro Kondo
IPC分类号： H05K3/10
CPC分类号： H01L24/32 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H05K1/112 , H05K1/116 , H05K3/0008 , H05K3/0035 , H05K3/027 , H05K3/242 , H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3457 , H05K3/4038 , H05K3/421 , H05K3/428 , H05K3/4602 , H05K3/4611 , H05K2201/0305 , H05K2201/0394 , H05K2201/09381 , H05K2201/09509 , H05K2201/09527 , H05K2201/0959 , H05K2201/09781 , H05K2203/0554 , H05K2203/0571 , H05K2203/107 , H05K2203/175 , Y10S428/901 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.
摘要翻译：在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。优选地，形成外部连接垫以覆盖开口。通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

85. 发明授权

US07338751B2 Process for producing printed wiring board and photosensitive resin composition used in the same 有权
标题翻译：用于制造印刷线路板的方法和用于其中的感光性树脂组合物
公开(公告)号：US07338751B2
公开(公告)日：2008-03-04
申请号：US10473466
申请日：2002-03-29
申请人： Toshihiko Akahori , Ken Sawabe , Michiko Natori , Tomoaki Aoki , Takuya Kajiwara
发明人： Toshihiko Akahori , Ken Sawabe , Michiko Natori , Tomoaki Aoki , Takuya Kajiwara
IPC分类号： G03F7/20 , G03F7/30 , G03F7/42 , G03F7/26 , G03F7/032
CPC分类号： H05K3/243 , H05K3/28 , H05K2203/0571 , H05K2203/0574 , H05K2203/0588 , H05K2203/072
摘要： An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.
摘要翻译：本发明的目的是提供一种制造印刷电路板的方法，其优点在于不仅能够实现电路板的尺寸减小和密度的增加，而且还简化了步骤，而且也在于安装部件的连接可靠性和产量提高，并且在该方法中使用感光性树脂组合物。本发明涉及印刷电路板的制造方法，其特征在于包括以下步骤：（i）在具有电路的布线板上形成阻焊剂; （ii）在阻焊剂上层叠感光性树脂组合物的预成型层; （iii）将感光性树脂组合物的层进行曝光和显影以形成感光性树脂组合物的抗蚀剂图案; （iv）使所得板的整个表面进行无电镀，和（v）剥离感光性树脂组合物层，其中依次进行所述步骤，以及光敏树脂组合物及其用于的过程。

86. 发明授权

US07325301B2 Method of manufacturing a wiring board 有权
标题翻译：制造布线板的方法
公开(公告)号：US07325301B2
公开(公告)日：2008-02-05
申请号：US10527169
申请日：2004-04-05
申请人： Yoichi Miura
发明人： Yoichi Miura
IPC分类号： H01K3/10
CPC分类号： H01L24/16 , H01L21/4857 , H01L2224/11902 , H01L2224/13099 , H01L2224/16 , H01L2224/81191 , H01L2224/814 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/3025 , H05K3/064 , H05K3/205 , H05K3/243 , H05K3/4007 , H05K3/423 , H05K3/4682 , H05K2201/0361 , H05K2201/0367 , H05K2201/096 , H05K2203/0384 , H05K2203/0571 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2224/0401
摘要： A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a second terminal area disposed on the other side of the wiring part. A resist having an opening for a first terminal area is formed on a surface of a composite made of a plurality of metal layers. A part of a first metal layer of the composite is etched through the opening for a first terminal area to form a hole. The hole is subjected to an electroless plating through the opening of the resist. Thus, the hole is filled with an electroplated layer to form a first terminal area. Then, the resist is removed from the composite, and a wiring layer is formed thereon. Subsequently, a solder resist having an opening for a second terminal area is disposed on the wiring layer. The opening of a second terminal area of the solder resist is subjected to an electroplating so as to form a second terminal area. Removing remaining parts of the composite, a wiring board is completed.
摘要翻译：根据本发明的布线板包括由一层或多层形成的布线部分，以布置方式布置在布线部分的一侧上的第一端子区域和布置在布线部分的另一侧上的第二端子区域。在由多个金属层制成的复合体的表面上形成具有用于第一端子区域的开口的抗蚀剂。复合材料的第一金属层的一部分通过开口蚀刻以形成第一端子区域以形成孔。通过抗蚀剂的开口对该孔进行化学镀。因此，孔填充有电镀层以形成第一末端区域。然后，将抗蚀剂从复合材料上除去，并在其上形成布线层。随后，在布线层上设置具有用于第二端子区的开口的阻焊剂。对阻焊剂的第二端子区域的开口进行电镀以形成第二端子区域。拆除复合材料的剩余部分，完成接线板。

87. 发明申请

US20070134850A1 Method of manufacturing wiring board 审中-公开
标题翻译：制造布线板的方法
公开(公告)号：US20070134850A1
公开(公告)日：2007-06-14
申请号：US11607111
申请日：2006-11-30
申请人： Takahiro Imai
发明人： Takahiro Imai
IPC分类号： H01L21/00
CPC分类号： H05K3/243 , H01L23/49572 , H01L2924/0002 , H01L2924/09701 , H05K3/061 , H05K3/108 , H05K3/242 , H05K3/388 , H05K2203/0571 , H05K2203/0574 , H05K2203/058 , H01L2924/00
摘要： A method of manufacturing a wiring board including: providing a substrate including a base substrate, a conductive film formed on a surface of the base substrate, and a plurality of leads formed on the conductive film; forming a resist layer which partially covers the conductive film in a region between two adjacent leads of the plurality of leads so that the resist layer contacts the two leads; patterning the conductive film to form a conductive pattern which electrically connects the leads; electroplating the leads by causing an electric current to flow through the leads via the conductive pattern; and cutting the conductive pattern to electrically insulate the leads.
摘要翻译：一种制造布线板的方法，包括：提供包括基底基板，形成在基底基板的表面上的导电膜和形成在导电膜上的多个引线的基板; 形成在所述多个引线的两个相邻引线之间的区域中部分地覆盖所述导电膜的抗蚀剂层，使得所述抗蚀剂层接触所述两个引线; 图案化导电膜以形成电连接引线的导电图案; 通过使电流经由导电图案流过引线来对引线进行电镀; 并切割导电图案以使引线电绝缘。

88. 发明申请

US20060011382A1 Wiring board and process for producing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20060011382A1
公开(公告)日：2006-01-19
申请号：US10527169
申请日：2004-04-05
申请人： Yoichi Miura
发明人： Yoichi Miura
IPC分类号： H05K1/03
CPC分类号： H01L24/16 , H01L21/4857 , H01L2224/11902 , H01L2224/13099 , H01L2224/16 , H01L2224/81191 , H01L2224/814 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/3025 , H05K3/064 , H05K3/205 , H05K3/243 , H05K3/4007 , H05K3/423 , H05K3/4682 , H05K2201/0361 , H05K2201/0367 , H05K2201/096 , H05K2203/0384 , H05K2203/0571 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2224/0401
摘要： A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a second terminal area disposed on the other side of the wiring part. A resist having an opening for a first terminal area is formed on a surface of a composite made of a plurality of metal layers. A part of a first metal layer of the composite is etched through the opening for a first terminal area to form a hole. The hole is subjected to an electroless plating through the opening of the resist. Thus, the hole is filled with an electroplated layer to form a first terminal area. Then, the resist is removed from the composite, and a wiring layer is formed thereon. Subsequently, a solder resist having an opening for a second terminal area is disposed on the wiring layer. The opening of a second terminal area of the solder resist is subjected to an electroplating so as to form a second terminal area. Removing remaining parts of the composite, a wiring board is completed.
摘要翻译：根据本发明的布线板包括由一层或多层形成的布线部分，以布置方式布置在布线部分的一侧上的第一端子区域和布置在布线部分的另一侧上的第二端子区域。在由多个金属层制成的复合体的表面上形成具有用于第一端子区域的开口的抗蚀剂。复合材料的第一金属层的一部分通过开口蚀刻以形成第一端子区域以形成孔。通过抗蚀剂的开口对该孔进行化学镀。因此，孔填充有电镀层以形成第一末端区域。然后，将抗蚀剂从复合材料上除去，并在其上形成布线层。随后，在布线层上设置具有用于第二端子区的开口的阻焊剂。对阻焊剂的第二端子区域的开口进行电镀以形成第二端子区域。拆除复合材料的剩余部分，完成接线板。

89. 发明授权

US06740222B2 Method of manufacturing a printed wiring board having a discontinuous plating layer 有权
标题翻译：制造具有不连续镀层的印刷电路板的方法
公开(公告)号：US06740222B2
公开(公告)日：2004-05-25
申请号：US09876522
申请日：2001-06-07
申请人： Charles Cohn
发明人： Charles Cohn
IPC分类号： C25D502
CPC分类号： H05K3/243 , H05K3/062 , H05K3/108 , H05K3/242 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K2201/0352 , H05K2201/09509 , H05K2203/0571 , H05K2203/1572 , H05K2203/1581
摘要： The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may include forming electrically connected plating layers on first and second opposing sides of a substrate and electroplating a contact layer over each of the plating layers using the plating layers. The method further includes removing a portion of the plating layers from the first and second opposing sides while leaving the plating layers under the contact layer.
摘要翻译：本发明提供了一种在由芯的两侧具有电介质层的刚性双面或多层印刷线路板芯制造的集成电路（IC）基板上电镀电接触的方法。该方法可以包括在基板的第一和第二相对侧上形成电连接的镀层，并且使用镀层在每个镀层上电镀接触层。该方法还包括从第一和第二相对侧去除一部分镀层，同时将镀层留在接触层下方。

90. 发明授权

US06534192B1 Multi-purpose finish for printed wiring boards and method of manufacture of such boards 有权
公开(公告)号：US06534192B1
公开(公告)日：2003-03-18
申请号：US09405368
申请日：1999-09-24
申请人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
发明人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
IPC分类号： H05K109
CPC分类号： H05K3/244 , H01L24/81 , H01L24/85 , H01L2224/81444 , H01L2224/85444 , H01L2924/00014 , H05K3/062 , H05K3/108 , H05K3/28 , H05K3/384 , H05K2203/0571 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T428/12528 , Y10T428/1275 , Y10T428/12875 , Y10T428/12882 , Y10T428/1291 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

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