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81. 发明申请

US20100277835A1 PRINTED CIRCUIT BOARD AND MAGNETIC HEAD DRIVING DEVICE INCLUDING THE SAME 有权
标题翻译：印刷电路板和磁头驱动装置，包括它们
公开(公告)号：US20100277835A1
公开(公告)日：2010-11-04
申请号：US12771500
申请日：2010-04-30
申请人： Mitsuru Honjo , Daisuke Yamauchi , Kei Nakamura
发明人： Mitsuru Honjo , Daisuke Yamauchi , Kei Nakamura
IPC分类号： G11B5/55 , H05K1/18 , H05K1/02
CPC分类号： G11B5/4846 , G11B5/484 , H05K1/0245 , H05K1/189 , H05K3/0061 , H05K2201/09236 , H05K2201/09318 , H05K2201/10674 , H05K2201/2009
摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10Ω and not more than 50Ω.
摘要翻译：在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。两个相邻的布线迹线构成传输线对。布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个

82. 发明授权

US07813138B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US07813138B2
公开(公告)日：2010-10-12
申请号：US12484101
申请日：2009-06-12
申请人： Koichiro Takeguchi , Daisuke Maehara
发明人： Koichiro Takeguchi , Daisuke Maehara
IPC分类号： H05K1/00
CPC分类号： H05K1/189 , G06F1/1616 , G06F1/1658 , G06F1/182 , H05K1/0215 , H05K1/147 , H05K3/0058 , H05K3/281 , H05K3/325 , H05K3/427 , H05K2201/10189 , H05K2201/2009 , H05K2203/063
摘要： According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing.
摘要翻译：根据一个实施例，电子设备包括导电壳体，基底，柔性基底，加强元件和导体。衬底被配置为容纳在壳体中并且安装有电子部件。柔性基板包括堆叠在柔性绝缘基材上并电连接到基板的导电信号层，覆盖信号层的覆盖层，安装有基板的第一表面和位于第一表面的相反侧上的第二表面具有信号层部分露出的部分。加强元件设置在第二表面上以加强柔性基板并且具有对应于信号层部分暴露的部分的开口。导体从加强元件的开口插入并将信号层连接到壳体。

83. 发明授权

US07787097B2 Flexible base material and flexible image-displaying device resistant to plastic deformation 有权
标题翻译：柔性基材和抗塑性变形的柔性图像显示装置
公开(公告)号：US07787097B2
公开(公告)日：2010-08-31
申请号：US11791232
申请日：2005-02-22
申请人： Tasuku Satoh
发明人： Tasuku Satoh
IPC分类号： G02F1/1333 , G09G3/00
CPC分类号： G02F1/133305 , G09F9/30 , H01L51/0097 , H01L51/52 , H01L2251/5338 , H05K1/0281 , H05K2201/09909 , H05K2201/2009 , Y02E10/549 , Y10T428/24355
摘要： An anti-deformation structure is formed on the surface of a flexible plate-shaped part. The anti-deformation structure includes protrusions and depressions formed on the surface of the plate-shaped part. The protrusions and depressions has a shape in which adjacent protrusions become in contact with each other in the state when the plate-shaped part is deformed within a range of elastic deformation, restricting further greater deformation, and thus, preventing excessive deformation leading to permanent deformation and raising the resistance to the stress. The flexible base material can be applied to flexible image-displaying devices.
摘要翻译：在柔性板状部件的表面上形成抗变形结构。抗变形结构包括形成在板状部分的表面上的突起和凹陷。突起和凹陷具有在板状部在弹性变形的范围内变形的状态下相邻的突起彼此接触的形状，限制进一步的更大的变形，并且因此防止过度的变形导致永久变形并提高对压力的抵抗力。柔性基材可应用于柔性图像显示装置。

84. 发明申请

US20100212938A1 FLEXIBLE PRINTED BOARD 有权
标题翻译：柔性印刷板
公开(公告)号：US20100212938A1
公开(公告)日：2010-08-26
申请号：US12698635
申请日：2010-02-02
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/02
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译：柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘的第二导电焊盘。

85. 发明申请

US20100165579A1 CIRCUIT BOARD ASSEMBLY 失效
标题翻译：电路板总成
公开(公告)号：US20100165579A1
公开(公告)日：2010-07-01
申请号：US12464560
申请日：2009-05-12
申请人： QIN LI , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO
发明人： QIN LI , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO
IPC分类号： H05K7/20
CPC分类号： H05K1/0271 , H05K1/181 , H05K3/0064 , H05K7/205 , H05K2201/10409 , H05K2201/10734 , H05K2201/2009
摘要： A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.
摘要翻译：电路板组件包括其上安装有两个散热组件的电路板和附接到电路板的下侧的L形背板。每个散热组件在其相对的角部处包括至少一对固定构件。背板包括第一部分和第二部分，每个部分限定与散热组件的固定部件相对应的至少一对圆形突起。

86. 发明授权

US07710740B2 Assembly structure of flexible board and rigid board 有权
标题翻译：柔性板和刚性板的装配结构
公开(公告)号：US07710740B2
公开(公告)日：2010-05-04
申请号：US11875886
申请日：2007-10-20
申请人： Chien-Liang Liu
发明人： Chien-Liang Liu
IPC分类号： H05K1/11
CPC分类号： H05K1/147 , H05K1/141 , H05K1/189 , H05K3/0058 , H05K3/363 , H05K3/366 , H05K2201/048 , H05K2201/10446 , H05K2201/2009
摘要： An assembly structure of flexible board and rigid board includes a rigid board, a sub-board and a flexible board. The rigid board defines a locking gap having two side surfaces projecting toward each other to form two resisting portions. The sub-board has a standing portion inserted in the locking gap. Bilateral sides of the standing portion extend outward to form two preventing arms against a bottom surface of the rigid board. The flexible board has a base portion inserted in the locking gap of the rigid board. The base portion has a front surface and a back surface located to a front surface of the sub-board. The front surface of the base portion is against the resisting portions.
摘要翻译：柔性板和刚性板的组装结构包括刚性板，子板和柔性板。刚性板限定了具有两个彼此突出的两个侧表面以形成两个阻力部分的锁定间隙。子板具有插入锁定间隙中的竖立部分。站立部分的双侧向外延伸以形成两个预防臂抵靠刚性板的底面。柔性板具有插入刚性板的锁定间隙中的基部。基部具有位于子板的前表面的前表面和后表面。基部的前表面抵靠抵抗部。

87. 发明授权

US07710737B2 Stiffening plate for circuit board and switch assembly 有权
标题翻译：电路板和开关组件的加强板
公开(公告)号：US07710737B2
公开(公告)日：2010-05-04
申请号：US12100670
申请日：2008-04-10
申请人： Stephen Brian Lynch , Dinesh Mathew
发明人： Stephen Brian Lynch , Dinesh Mathew
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H01H1/5805 , H01H13/14 , H01H2001/5888 , H05K1/0215 , H05K3/0061 , H05K2201/10053 , H05K2201/2009 , H05K2203/063
摘要： This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed.
摘要翻译：本发明涉及一种用于加强电路板的一部分的支撑板。支撑板可以耦合到经受力的电路板的一部分（例如，具有开关的电路板的部分）以防止板的挠曲。支撑板可以联接到电路板。本发明还涉及由按钮，标签板和背板构成的开关。标签板和支撑板可以包括可操作地接收从按钮延伸的突起的孔，其中突起焊接到支撑板。标签可以打印或附着到标签板的底部表面以保护标签。在一些实施例中，突起可以焊接到支撑板。该突起可操作以接合其中放置开关的电子设备的电开关。

88. 发明授权

US07704793B2 Electronic part and method for manufacturing the same 失效
标题翻译：电子零件及其制造方法
公开(公告)号：US07704793B2
公开(公告)日：2010-04-27
申请号：US12011918
申请日：2008-01-30
申请人： Munehide Saimen
发明人： Munehide Saimen
IPC分类号： H01L21/00
CPC分类号： H05K1/118 , H01L23/49572 , H01L2924/0002 , H05K3/0052 , H05K3/0058 , H05K2201/09236 , H05K2201/09727 , H05K2201/10681 , H05K2201/2009 , H05K2203/0228 , H01L2924/00
摘要： A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.
摘要翻译：一种电子部件的制造方法，其特征在于，包括：切断包含基底基板的布线基板，设置在所述基板的第一面上的布线图案，以及沿着所述基板的第二面设置的加强部件与所述加强构件的外周相交的线; 其特征在于，构成所述布线图案的多根配线最靠近所述加强部件的外周的交叉点布线的线最宽。

89. 发明申请

US20100061065A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20100061065A1
公开(公告)日：2010-03-11
申请号：US12413261
申请日：2009-03-27
申请人： Shinya HAYASHIYAMA
发明人： Shinya HAYASHIYAMA
IPC分类号： H05K5/00
CPC分类号： G06F1/1616 , G06F1/1658 , H05K1/0271 , H05K1/181 , H05K2201/10734 , H05K2201/2009 , H05K2201/2018
摘要： According to one embodiment, an electronic device includes a housing, a circuit board in the housing, a plurality of surface-mountable electronic components, and a reinforcing frame. The circuit board has a first surface and a second surface on a reverse side of the first surface. The surface-mountable electronic components, each having a surface on which bumps are arranged, are mounted on the first surface via the bumps. The reinforcing frame is arranged on the second surface such that it passes through portions corresponding to positions of bumps located at at least four corners of the bumps arranged on the surface of each of the surface-mountable electronic components mounted on the first surface.
摘要翻译：根据一个实施例，电子设备包括壳体，壳体中的电路板，多个可表面安装的电子部件和加强框架。电路板具有在第一表面的相反侧上的第一表面和第二表面。每个具有布置凸块的表面的可表面安装的电子部件通过凸块安装在第一表面上。加强框架布置在第二表面上，使得其穿过对应于位于安装在安装在第一表面上的每个可表面安装的电子部件的表面上的凸起的至少四个角的凸起位置的部分。

90. 发明申请

US20100038116A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100038116A1
公开(公告)日：2010-02-18
申请号：US12389521
申请日：2009-02-20
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H05K1/00 , H05K1/09 , H05K3/46 , C25D5/16
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译：印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。铜层在其给定部分包括多个电迹线。加强层的厚度在远离给定部分的方向上增加。在本公开中还提供了制造印刷电路板的方法。

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