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81. 发明授权

US09287190B2 Devices employing semiconductor die having hydrophobic coatings, and related cooling methods 有权
公开(公告)号：US09287190B2
公开(公告)日：2016-03-15
申请号：US14337977
申请日：2014-07-22
申请人： International Business Machines Corporation
发明人： Daniel J. Buvid , Eric J. Campbell , Tyler Jandt , Joseph Kuczynski
IPC分类号： H01L23/36 , H01L23/29 , H01L23/31 , H01L23/367
CPC分类号： H01L23/3107 , H01L23/29 , H01L23/3114 , H01L23/3121 , H01L23/315 , H01L23/3171 , H01L23/367 , H01L23/373 , H01L23/44 , H01L23/473 , H01L23/564 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/05009 , H01L2224/11821 , H01L2224/11823 , H01L2224/11826 , H01L2224/11827 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73257 , H01L2224/742 , H01L2224/8192 , H01L2224/8592 , H01L2224/94 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/16151 , H01L2924/16251 , H01L2924/181 , H05K1/0203 , H05K7/20236 , H05K2201/064 , H01L2924/014 , H01L2224/03 , H01L2924/00012 , H01L2924/01049 , H01L2924/01048 , H01L2224/85399 , H01L2224/05599
摘要： Devices employing semiconductor die having hydrophobic coatings, and related cooling methods are disclosed. A device may include at least one semiconductor die electrically coupled to a substrate by electrical contact elements. During operation the semiconductor die and the electrical contact elements generate heat. By applying hydrophobic coatings to the semiconductor die and the electrical contact elements, a cooling fluid may be used to directly cool the semiconductor die and the electrical contact elements to maintain these components within temperature limits and free from electrical shorting and corrosion. In this manner, the semiconductor die and associated electrical contact elements may be cooled to avoid the creation of damaging localized hot spots and temperature-sensitive semiconductor performance issues.

82. 发明授权

US09091421B2 LED array module and manufacturing method thereof 有权
标题翻译： LED阵列模块及其制造方法
公开(公告)号：US09091421B2
公开(公告)日：2015-07-28
申请号：US13882529
申请日：2011-08-25
申请人： Hyo Tae Kim , Gi Seok Song , Heung Soon Kim
发明人： Hyo Tae Kim , Gi Seok Song , Heung Soon Kim
IPC分类号： F21S4/00 , F21V21/00 , F21V29/00 , H05K1/02 , H01L33/64 , H05K1/05
CPC分类号： H01L33/64 , H01L33/648 , H05K1/0203 , H05K1/053 , H05K2201/017 , H05K2201/064 , H05K2201/10106 , H05K2201/10969
摘要： The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.
摘要翻译：本发明提供一种具有改善的散热效果的LED阵列模块及其制造方法。为此，LED阵列模块包括一个或多个LED单元模块，该LED单元模块包括：LED; 连接到LED的下部的导热散热块; 以及分别连接到LED的阴极和阳极的引线，其中LED阵列模块包括：散热板; 散热板的上表面和散热块的下表面之间设置并结合的导热焊料层; 形成在散热板的上表面上的第一绝缘层; 以及阵列电极，其形成在绝缘层的上表面上并且电连接到引线以驱动LED。

83. 发明申请

US20150103489A1 INTEGRATED CIRCUIT CHIP COMPRISING ELECTRONIC DEVICE AND ELECTRONIC SYSTEM 有权
标题翻译：包含电子设备和电子系统的集成电路芯片
公开(公告)号：US20150103489A1
公开(公告)日：2015-04-16
申请号：US14512214
申请日：2014-10-10
申请人： STMICROELECTRONICS (GRENOBLE 2) SAS
发明人： David AUCHERE , Yvon IMBS
IPC分类号： H05K7/20 , H05K1/14 , H05K1/11
CPC分类号： H05K7/20 , H01L23/473 , H01L23/49816 , H01L25/105 , H01L2224/48091 , H01L2224/73204 , H05K1/0201 , H05K1/0203 , H05K1/111 , H05K1/14 , H05K1/181 , H05K2201/064 , H01L2924/00014
摘要： An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.
摘要翻译：电子设备包括由绝缘材料制成并具有电连接网络的衬底晶片。集成电路芯片安装在基板晶片的顶侧。衬底晶片包含内部管道。导管由位于基板晶片顶侧的覆盖沟槽形成。沟槽包含导热材料，例如是流体。偏离沟槽的衬底晶片顶部的开口允许在集成电路和电连接网络之间形成电连接。

84. 发明申请

US20140362552A1 INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME 有权
标题翻译：包括它的插件和半导体器件
公开(公告)号：US20140362552A1
公开(公告)日：2014-12-11
申请号：US14291243
申请日：2014-05-30
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Kei Murayama , Mitsutoshi Higashi , Koji Nagai , Hideaki Sakaguchi
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H01L2224/16225 , H01L2924/15311 , H05K1/0272 , H05K2201/064 , H05K2201/10378
摘要： There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.
摘要翻译：提供了用于冷却电子部件的插入件。该内插件包括：其中具有中空冷却通道的基体，其中冷却介质流过冷却通道，所述冷却通道包括：沿一定方向延伸并彼此分离的多个主冷却通道; 与各个主冷却通道的一端连通的流入通道; 以及与各个主冷却通道的另一端连通的流出通道，以及多个通过电极组，每个贯通电极组包括排列成一行的多个贯通电极。每个贯通电极通过基板本体形成以到达基板主体的第一和第二表面。相应的通过电极组被至少相应的一个主冷却通道分隔开。

85. 发明授权

US08254422B2 Microheat exchanger for laser diode cooling 有权
标题翻译：用于激光二极管冷却的微热交换器
公开(公告)号：US08254422B2
公开(公告)日：2012-08-28
申请号：US12536361
申请日：2009-08-05
申请人： Madhav Datta , Brandon Leong , Mark McMaster
发明人： Madhav Datta , Brandon Leong , Mark McMaster
IPC分类号： H01S3/04
CPC分类号： F28F7/02 , C04B37/026 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/366 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/74 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/0207 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/38 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/064 , Y10T428/24612 , Y10T428/31678 , H01L2924/00
摘要： A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.
摘要翻译：微型交换组件被配置为冷却一个或多个发热装置，例如集成电路或激光二极管。微型交换组件包括热耦合到第一表面的第一陶瓷组件，以及在与第二表面热耦合的第二陶瓷组件的情况下。陶瓷组件包括一个或多个热导热焊盘，其被热耦合到发热器件，每个导电焊盘彼此电隔离。陶瓷组件包括提供该电隔离的陶瓷层。使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。接合层是接合材料，陶瓷层和导电层的复合物。

86. 发明授权

US08130493B2 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method 有权
标题翻译：布置用于最佳散热的电路板部件的方法和具有通过执行该方法而布置的部件的电路装置
公开(公告)号：US08130493B2
公开(公告)日：2012-03-06
申请号：US12389723
申请日：2009-02-20
申请人： Tae-kwon Na
发明人： Tae-kwon Na
IPC分类号： H05K7/20 , H05K3/30 , F28F7/00 , H01L23/34
CPC分类号： H05K1/0203 , H05K1/18 , H05K7/20145 , H05K7/20154 , H05K2201/064 , Y10T29/49133
摘要： A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.
摘要翻译：提供一种布置用于最佳散热的电路板的多个部件的方法和具有通过执行该方法而布置的多个部件的电路装置。该方法包括在连接进气单元和出气单元的虚拟直线上，以具有预定宽度的散热区域中的部件尺寸的大小顺序布置预定数量的多个部件。

87. 发明授权

US08044301B2 Printed circuit board provided with heat circulating medium and method for manufacturing the same 有权
标题翻译：配有热循环介质的印刷电路板及其制造方法
公开(公告)号：US08044301B2
公开(公告)日：2011-10-25
申请号：US11777029
申请日：2007-07-12
申请人： Jae Hyun Son
发明人： Jae Hyun Son
IPC分类号： H05K1/03 , H05K3/02
CPC分类号： B32B38/0012 , B32B2038/0016 , B32B2309/10 , B32B2457/08 , H05K1/0203 , H05K1/0272 , H05K3/4623 , H05K2201/043 , H05K2201/064 , H05K2203/061 , Y10T29/49156 , Y10T428/24612
摘要： A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.
摘要翻译：印刷电路板包括设置有内部电路布线并且在其表面具有凹部的下板和在凹部的下表面处的多个突起图案; 上板具有与下板相同的结构并且粘附到下板，使得形成有凹部的表面彼此相对; 注射到由下板和上板的凹部形成的内部空间中的热循环介质。

88. 发明授权

US07965340B2 Liquid crystal display apparatus 有权
标题翻译：液晶显示装置
公开(公告)号：US07965340B2
公开(公告)日：2011-06-21
申请号：US11518904
申请日：2006-09-12
申请人： Kazumasa Kurokawa , Yoshimi Kondo , Hirokazu Shibata
发明人： Kazumasa Kurokawa , Yoshimi Kondo , Hirokazu Shibata
IPC分类号： H04N9/74
CPC分类号： H05K1/144 , G02F1/13452 , H05K1/18 , H05K2201/042 , H05K2201/064
摘要： A LCD apparatus includes a liquid crystal panel, a circuit board having a mounting surface and circuit elements mounted on the mounting surface to constitute a drive circuit for driving the LCD apparatus, and a case for holding the liquid crystal panel and the circuit board. The circuit board is positioned approximately in a vertical direction during normal use of the LCD apparatus. The circuit elements include a first element having a first projecting length from the mounting surface and a second element having a second projecting length from the mounting surface. The first projecting length is greater than a projecting length of any other element of the circuit elements. The second projecting length is slightly smaller than the first projecting length. The first and the second elements are arranged on the mounting surface approximately in a line in the vertical direction.
摘要翻译： LCD装置包括液晶面板，具有安装面的电路板和安装在安装面上的电路元件，构成用于驱动LCD装置的驱动电路，以及用于保持液晶面板和电路板的壳体。在LCD装置的正常使用期间，电路板大致位于垂直方向。电路元件包括具有来自安装表面的第一突出长度的第一元件和具有来自安装表面的第二突出长度的第二元件。第一突出长度大于电路元件的任何其它元件的突出长度。第二突出长度略小于第一突出长度。第一和第二元件在垂直方向上大致以一条直线布置在安装表面上。

89. 发明授权

US07679916B2 Method and system for extracting heat from electrical components 有权
标题翻译：从电气部件提取热量的方法和系统
公开(公告)号：US07679916B2
公开(公告)日：2010-03-16
申请号：US11608384
申请日：2006-12-08
申请人： Chris Erwin Orr , David S. Slaton
发明人： Chris Erwin Orr , David S. Slaton
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , B82Y10/00 , F28D15/00 , F28D15/0266 , F28D2015/0225 , F28F3/12 , H01L23/467 , H01L2224/16 , H05K1/0272 , H05K1/112 , H05K2201/026 , H05K2201/064
摘要： A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
摘要翻译：提供了一种从电子设备提取热量的系统。该系统包括位于印刷电路板内的散热装置，以形成板内散热器结构和设置在散热装置中的流体传热介质。介质通过散热装置循环，从电子设备携带热量。

90. 发明申请

US20100046231A1 LED COOLING SYSTEM 审中-公开
标题翻译： LED冷却系统
公开(公告)号：US20100046231A1
公开(公告)日：2010-02-25
申请号：US12529486
申请日：2008-02-29
申请人： David M. Medinis
发明人： David M. Medinis
IPC分类号： F21V29/00
CPC分类号： F21V29/56 , F21V29/70 , F21Y2115/10 , H05K1/0204 , H05K1/0272 , H05K3/0061 , H05K2201/064 , H05K2201/10106 , H05K2201/10416
摘要： The invention relates to a LED cooling system that effects cooling of the LED's during use, and helps the LED's have a longer operating function, and uses less electricity for the LED's to operate. The use of cooling also provides a steadier light and has greater efficiency.
摘要翻译：本发明涉及一种在使用过程中实现LED的冷却的LED冷却系统，并且有助于LED具有更长的操作功能，并且为LED操作使用更少的电力。冷却的使用也提供了更稳定的光线并且具有更高的效率。

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