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    • 81. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE AND SOLAR CELL HAVING THE SAME
    • 光电转换装置和具有该光电转换装置的太阳能电池
    • US20130269779A1
    • 2013-10-17
    • US13912075
    • 2013-06-06
    • FUJIFILM CORPORATION
    • Tetsuo KAWANOHiroshi KAGA
    • H01L31/0328
    • H01L31/0328H01L31/03923H01L31/0749Y02E10/541
    • The photoelectric conversion device of the present invention is a photoelectric conversion device which includes a substrate on which the following are layered in the order listed below: a lower electrode layer; a photoelectric conversion semiconductor layer which includes, as a major component, at least one kind of compound semiconductor having a chalcopyrite structure formed of a group Ib element, a group IIIb element, and a group VIb element; a buffer layer; and a transparent conductive layer, in which a carbonyl ion is provided on a surface of the buffer layer on the side of the transparent conductive layer and the buffer layer is a thin film layer having an average film thickness of 10 nm to 70 nm and includes a ternary compound of a cadmium-free metal, oxygen, and sulfur.
    • 本发明的光电转换装置是一种光电转换装置,其包括以下列顺序层叠以下的基板:下电极层; 作为主要成分的至少一种具有由Ib族元素,IIIb族元素和VIb族元素形成的黄铜矿结构的化合物半导体的光电转换半导体层, 缓冲层; 以及透明导电层,其中在透明导电层一侧的缓冲层的表面上设置羰基离子,缓冲层是平均膜厚为10nm〜70nm的薄膜层,并且包括 无镉金属,氧和硫的三元化合物。
    • 88. 发明授权
    • Monolithically integrated silicon and III-V electronics
    • 单片集成硅和III-V电子元件
    • US08120060B2
    • 2012-02-21
    • US11591383
    • 2006-11-01
    • Eugene A. Fitzgerald
    • Eugene A. Fitzgerald
    • H01L29/66
    • H01L27/14601H01L21/0245H01L21/0251H01L21/76254H01L21/8258H01L27/0605H01L27/144H01L27/1446H01L27/14683H01L27/15H01L27/156H01L31/0328H01L31/143H01L31/162H01L2924/0002Y10S438/933H01L2924/00
    • Methods and structures for monolithically integrating monocrystalline silicon and monocrystalline non-silicon materials and devices are provided. In one structure, a monolithically integrated semiconductor device structure comprises a silicon substrate and a first monocrystalline semiconductor layer disposed over the silicon substrate, wherein the first monocrystalline semiconductor layer has a lattice constant different from a lattice constant of relaxed silicon. The structure also includes an insulating layer disposed over the first monocrystalline semiconductor layer in a first region and a monocrystalline silicon layer disposed over the insulating layer in the first region. The structure includes at least one silicon-based electronic device comprising an element including at least a portion of the monocrystalline silicon layer. The structure includes a second monocrystalline semiconductor layer disposed over at least a portion of the first monocrystalline semiconductor layer in a second region and absent from the first region, wherein the second monocrystalline semiconductor layer has a lattice constant different from the lattice constant of relaxed silicon. The structure also includes at least one III-V electronic device comprising an element including at least a portion of the second monocrystalline semiconductor layer.
    • 提供了单晶硅和单晶非硅材料和器件单片集成的方法和结构。 在一种结构中,单片集成半导体器件结构包括硅衬底和设置在硅衬底上的第一单晶半导体层,其中第一单晶半导体层具有与松弛硅的晶格常数不同的晶格常数。 该结构还包括设置在第一区域中的第一单晶半导体层上的绝缘层和设置在第一区域中的绝缘层上的单晶硅层。 该结构包括至少一个硅基电子器件,其包含至少部分单晶硅层的元件。 该结构包括第二单晶半导体层,其设置在第二区域中的第一单晶半导体层的至少一部分上且不存在于第一区域中,其中第二单晶半导体层具有与松弛硅的晶格常数不同的晶格常数。 该结构还包括至少一个III-V电子器件,其包括包含第二单晶半导体层的至少一部分的元件。
    • 90. 发明授权
    • Monolithically integrated photodetectors
    • 单片式光电探测器
    • US07705370B2
    • 2010-04-27
    • US11591658
    • 2006-11-01
    • Eugene A. Fitzgerald
    • Eugene A. Fitzgerald
    • H01L31/0328
    • H01L27/14601H01L21/0245H01L21/0251H01L21/76254H01L21/8258H01L27/0605H01L27/144H01L27/1446H01L27/14683H01L27/15H01L27/156H01L31/0328H01L31/143H01L31/162H01L2924/0002Y10S438/933H01L2924/00
    • Methods and structures for monolithically integrating monocrystalline silicon and monocrystalline non-silicon materials and devices are provided. In one structure, a monolithically integrated semiconductor device structure comprises a silicon substrate and a first monocrystalline semiconductor layer disposed over the silicon substrate, wherein the first monocrystalline semiconductor layer has a lattice constant different from a lattice constant of relaxed silicon. The structure further includes an insulating layer disposed over the first monocrystalline semiconductor layer in a first region and a monocrystalline silicon layer disposed over the insulating layer in the first region. The structure includes at least one silicon-based photodetector comprising an active region including at least a portion of the monocrystalline silicon layer. The structure also includes a second monocrystalline semiconductor layer disposed over at least a portion of the first monocrystalline semiconductor layer in a second region and absent from the first region, wherein the second monocrystalline semiconductor layer has a lattice constant different from the lattice constant of relaxed silicon. The structure includes at least one non-silicon photodetector comprising an active region including at least a portion of the second monocrystalline semiconductor layer.
    • 提供了单晶硅和单晶非硅材料和器件单片集成的方法和结构。 在一种结构中,单片集成半导体器件结构包括硅衬底和设置在硅衬底上的第一单晶半导体层,其中第一单晶半导体层具有与松弛硅的晶格常数不同的晶格常数。 该结构还包括设置在第一区域中的第一单晶半导体层上的绝缘层和设置在第一区域中的绝缘层上的单晶硅层。 该结构包括至少一个硅基光电检测器,其包括至少部分单晶硅层的有源区。 该结构还包括第二单晶半导体层,其设置在第二区域中的第一单晶半导体层的至少一部分上且不存在于第一区域中,其中第二单晶半导体层具有与松弛硅的晶格常数不同的晶格常数 。 该结构包括至少一个非硅光电检测器,其包括包括第二单晶半导体层的至少一部分的有源区。