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81. 发明申请

US20140043489A1 NIGHT VISION SYSTEM AND METHOD 有权
标题翻译：夜视系统和方法
公开(公告)号：US20140043489A1
公开(公告)日：2014-02-13
申请号：US14112399
申请日：2012-04-17
申请人： Gil Tidhar
发明人： Gil Tidhar
IPC分类号： H04N5/33
CPC分类号： H04N5/33 , H01L27/1465 , H01L27/14652 , H04N5/332
摘要： A night vision system and method for imaging an object at or near room temperature and in the wavelength region up to 2.5 microns is described. The includes a photodetector having a cut-off wavelength of 2.5 microns under the room temperature, an optical system configured for collecting light and focusing the collected light onto the photodetector, and a spectral filter located in an optical path of light propagating toward the photodetector. The spectral filter is configured and operable to selectively filter out light of wavelength shorter than a predetermined value, thereby gradually shifting operation of the night vision system from mostly reflection mode to a combined reflection and thermal mode, to allow the night vision system to detect light reflected from and emitted by the object being imaged.
摘要翻译：描述了一种用于在室温或室温附近和在高达2.5微米的波长范围内成像物体的夜视系统和方法。该光检测器包括在室温下截止波长为2.5微米的光电检测器，配置用于收集光并将收集的光聚焦到光电探测器上的光学系统，以及位于向光检测器传播的光的光路中的光谱滤光器。频谱滤波器被配置和可操作以选择性地滤出波长比预定值短的光，从而将夜视系统的操作从大多数反射模式逐渐移动到组合反射和热模式，以允许夜视系统检测光由正在成像的物体反射并发射。

82. 发明申请

US20130207214A1 Integrated Visible and Infrared Imager Devices and Associated Methods 有权
标题翻译：集成可见和红外成像仪器及相关方法
公开(公告)号：US20130207214A1
公开(公告)日：2013-08-15
申请号：US13712865
申请日：2012-12-12
申请人： SIONYX, INC.
发明人： Homayoon Haddad , Leonard Forbes
IPC分类号： H01L31/0236 , H01L27/146
CPC分类号： H01L31/0236 , G01J5/20 , H01L27/146 , H01L27/1465 , H01L31/02363 , H01L31/186 , Y02E10/50
摘要： Semiconductor devices having three dimensional (3D) architectures and methods form making such devices are provided. In one aspect, for example, a method for making a semiconductor device can include forming a device layer on a front side of a semiconductor layer that is substantially defect free, bonding a carrier substrate to the device layer, processing the semiconductor layer on a back side opposite the device layer to form a processed surface, and bonding a smart substrate to the processed surface. In some aspects, the method can also include removing the carrier substrate from the semiconductor layer to expose the device layer.
摘要翻译：提供具有三维（3D）架构和形成这种装置的方法的半导体器件。一方面，例如，制造半导体器件的方法可以包括在基本上无缺陷的半导体层的正面上形成器件层，将载体衬底结合到器件层，在后面处理半导体层侧，以形成处理后的表面，以及将智能衬底粘合到经处理的表面上。在一些方面，该方法还可以包括从半导体层移除载体衬底以暴露器件层。

83. 发明授权

US08440543B2 Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same 有权
标题翻译：混合电路结构和部分回填方法提高热循环的可靠性
公开(公告)号：US08440543B2
公开(公告)日：2013-05-14
申请号：US13236421
申请日：2011-09-19
申请人： Donald E. Cooper , William E. Tennant
发明人： Donald E. Cooper , William E. Tennant
IPC分类号： H01L21/46 , H01L23/34 , H01L23/04 , B32B37/00
CPC分类号： H01L27/1465 , H01L21/563 , H01L27/14683 , H01L2924/0002 , H01L2924/351 , H01L2924/00
摘要： A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.
摘要翻译：一种提高混合电路结构的热循环可靠性的方法需要提供至少两个电路层，使两个电路层垂直排列，使得它们各自的电路元件具有精确和明确定义的空间关系，并且提供芯片的粘合剂材料进入对准的层之间的空间的一部分，以便减轻由于层之间的热收缩失配而可能发生的结构和/或互连的损坏。粘合剂材料需要具有相关联的粘度，使得当在预定条件下提供时，粘合剂在到达之前停止芯吸，并且可能降低电路元件的性能。

84. 发明申请

US20130069192A1 HYBRID CIRCUIT STRUCTURE AND PARTIAL BACKFILL METHOD FOR IMPROVING THERMAL CYCLING RELIABILITY OF SAME 有权
标题翻译：混合电路结构和部分回填方法提高其循环可靠性
公开(公告)号：US20130069192A1
公开(公告)日：2013-03-21
申请号：US13236421
申请日：2011-09-19
申请人： DONALD E. COOPER , William E. Tennant
发明人： DONALD E. COOPER , William E. Tennant
IPC分类号： H01L31/02 , B29C65/48
CPC分类号： H01L27/1465 , H01L21/563 , H01L27/14683 , H01L2924/0002 , H01L2924/351 , H01L2924/00
摘要： A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.
摘要翻译：一种提高混合电路结构的热循环可靠性的方法需要提供至少两个电路层，使两个电路层垂直排列，使得它们各自的电路元件具有精确和明确定义的空间关系，并且提供芯片的粘合剂材料进入对准的层之间的空间的一部分，以便减轻由于层之间的热收缩失配而可能发生的结构和/或互连的损坏。粘合剂材料需要具有相关联的粘度，使得当在预定条件下提供时，粘合剂在到达之前停止芯吸，并且可能降低电路元件的性能。

85. 发明授权

US08399820B2 Multicolor detectors and applications thereof 有权
标题翻译：多色检测器及其应用
公开(公告)号：US08399820B2
公开(公告)日：2013-03-19
申请号：US12489871
申请日：2009-06-23
申请人： John Trezza , Martin Ettenberg
发明人： John Trezza , Martin Ettenberg
IPC分类号： H01L31/00 , H01L27/00 , H01L29/66 , H01J40/14 , H04N9/04
CPC分类号： H01L31/02 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14647 , H01L27/1465 , H01L27/14652 , H01L27/1467 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： In one aspect, the present invention provides photodetectors and components thereof having multi-spectral sensing capabilities. In some embodiments, photodetectors of the present invention provide a first photosensitive element comprising at least one accessway extending through the element and an electrical connection at least partially disposed in the accessway, the electrical connection accessible for receiving a second photosensitive element.
摘要翻译：一方面，本发明提供具有多光谱感测能力的光电探测器及其部件。在一些实施例中，本发明的光电检测器提供第一光敏元件，该第一光敏元件包括延伸穿过该元件的至少一个入口通道和至少部分地设置在该入口中的电连接，该电连接可接近第二感光元件。

86. 发明申请

US20130020666A1 DIRECT READOUT FOCAL PLANE ARRAY 有权
标题翻译：直接读出正面平面阵列
公开(公告)号：US20130020666A1
公开(公告)日：2013-01-24
申请号：US13189109
申请日：2011-07-22
申请人： Edward Peter Gordon Smith
发明人： Edward Peter Gordon Smith
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L31/0248 , H01L27/14649 , H01L27/1465 , H01L27/14667 , H01L27/1467 , H01L31/02325
摘要： According to one embodiment, an image detector comprises a plurality of photosensitive detector unit cells interconnected to a plurality of integrated circuits by a plurality of direct bond interconnects. Each unit cell includes an absorber layer and a separation layer. The absorber layer absorbs incident photons such that the absorbed photons excite photocurrent comprising first charged carriers and second charged carriers having opposite polarities. The separation layer separates the first charged carriers for collection at one or more first contacts and the second charged carriers for collection at one or more second contacts. The first and second contacts include the direct bond interconnects to conduct the first charged carriers and the second charged carriers from the unit cells in order to facilitate image processing.
摘要翻译：根据一个实施例，图像检测器包括通过多个直接接合互连互连到多个集成电路的多个光敏检测器单元单元。每个单元电池包括吸收层和分离层。吸收层吸收入射的光子，使得所吸收的光子激发包含具有相反极性的第一带电载流子和第二带电载流子的光电流。分离层将第一带电载体分开以在一个或多个第一触点和第二带电载体上收集，以在一个或多个第二触点处收集。第一和第二触点包括直接接合互连以从单元电池传导第一带电载流子和第二带电载流子，以便于图像处理。

87. 发明授权

US07608823B2 Multimode focal plane array with electrically isolated commons for independent sub-array biasing 失效
标题翻译：具有电隔离公共端的多模焦平面阵列，用于独立的子阵列偏置
公开(公告)号：US07608823B2
公开(公告)日：2009-10-27
申请号：US11163022
申请日：2005-10-03
申请人： William E. Tennant
发明人： William E. Tennant
IPC分类号： G01J5/02
CPC分类号： H01L27/1465 , H01L27/14603 , H01L27/14609 , H01L27/14627 , H01L27/1469 , H01L27/14696
摘要： In a multimode FPA, all of the FPA's conducting layers including all of the absorbing layers are patterned to form electrically isolated commons for at least two, and in some instances all of the photodetector sub-arrays, to support independent mode biasing of the photodetectors. Because the commons are electrically isolated, the bias voltages are not constrained by the CMOS design rules. The commons can accommodate large bias amplitude differences and different temporal bias profiles to address a wide range of multimode sensing applications.
摘要翻译：在多模FPA中，包括所有吸收层的所有FPA导电层被图案化以形成用于至少两个的电隔离公共端，并且在一些情况下，所有的光电检测器子阵列都支持光电检测器的独立模式偏置。由于公共电气隔离，偏置电压不受CMOS设计规则约束。公共地可以容纳大的偏差幅度差异和不同的时间偏差分布，以解决广泛的多模感测应用。

88. 发明授权

US07592594B2 Method of construction of CTE matching structure with wafer processing and resulting structure 有权
标题翻译： CTE匹配结构与晶圆加工结构的结构方法
公开(公告)号：US07592594B2
公开(公告)日：2009-09-22
申请号：US11598492
申请日：2006-11-13
申请人： Robert P. Ginn , Kenneth A. Gerber
发明人： Robert P. Ginn , Kenneth A. Gerber
IPC分类号： H01L25/00
CPC分类号： H01L31/1032 , H01L27/14618 , H01L27/1465 , H01L27/1467 , H01L31/0203 , H01L31/02966 , H01L2924/0002 , H01L2924/351 , Y10T29/41 , H01L2924/00
摘要： A method includes bonding a first side of a metal shim to a silicon shim, removing metal from the metal shim to form a plurality of cleared metal lanes in accordance with a pattern, bonding a readout integrated circuit having a plurality of saw lanes in accordance with the pattern to a second side of the metal shim to form a wafer assembly wherein the plurality of saw lanes is aligned with the plurality of cleared metal lanes, and dicing the wafer assembly.
摘要翻译：一种方法包括将金属垫片的第一面接合到硅垫片上，从金属垫片上去除金属，以根据图案形成多个清除的金属通道，按照下述方式结合具有多个锯条的读出集成电路将金属垫片的第二侧的图案形成晶片组件，其中多个锯条与多个清除的金属通道对准，并切割晶片组件。

89. 发明授权

US07291858B2 QWIP with tunable spectral response 有权
标题翻译： QWIP具有可调光谱响应
公开(公告)号：US07291858B2
公开(公告)日：2007-11-06
申请号：US10829574
申请日：2004-04-22
申请人： Mani Sundaram , Axel R Reisinger
发明人： Mani Sundaram , Axel R Reisinger
IPC分类号： H01L31/0304
CPC分类号： G01J3/2803 , B82Y20/00 , H01L27/1465 , H01L27/14652 , H01L31/02161 , H01L31/02327 , H01L31/03046 , H01L31/035236 , H01L31/1013 , Y02E10/544
摘要： A tunable QWIP FPA device that is configured for spectral tunability for performing the likes of imaging and spectroscopy is disclosed. A selected bias voltage is applied across the contacts associated with a particular detector layer/channel of the device, where each applied bias corresponds to a particular target spectrum/color for detection. Each detector layer/channel can be coarse tuned for a bimodal or dual-band operation (e.g., MWIR/LWIR). Also, each detector layer/channel is configured for continuous or fine tuning within a particular mode (e.g., MWIR/MWIR). Thus, dynamic bias-controlled tuning is enabled. Asymmetric quantum well configurations enable this tunability.
摘要翻译：公开了一种可调QWIP FPA设备，其配置用于执行像成像和光谱学的光谱可调性。选择的偏置电压施加在与装置的特定检测器层/通道相关联的触点上，其中每个施加的偏置对应于用于检测的特定目标光谱/颜色。每个检测器层/通道可以被粗调以进行双峰或双频段操作（例如，MWIR / LWIR）。此外，每个检测器层/通道被配置为在特定模式（例如，MWIR / MWIR）内进行连续或微调。因此，启用动态偏置控制调谐。不对称量子阱配置可实现这种可调性。

90. 发明申请

US20070076481A1 MULTIMODE FOCAL PLANE ARRAY WITH ELECTRICALLY ISOLATED COMMONS FOR INDEPENDENT SUB-ARRAY BIASING 失效
标题翻译：具有电气隔离公共单元的多模式平面阵列可用于独立的子模块偏移
公开(公告)号：US20070076481A1
公开(公告)日：2007-04-05
申请号：US11163022
申请日：2005-10-03
申请人： William Tennant
发明人： William Tennant
IPC分类号： G11C16/04
CPC分类号： H01L27/1465 , H01L27/14603 , H01L27/14609 , H01L27/14627 , H01L27/1469 , H01L27/14696
摘要： In a multimode FPA, all of the FPA's conducting layers including all of the absorbing layers are patterned to form electrically isolated commons for at least two, and in some instances all of the photodetector sub-arrays, to support independent mode biasing of the photodetectors. Because the commons are electrically isolated, the bias voltages are not constrained by the CMOS design rules. The commons can accommodate large bias amplitude differences and different temporal bias profiles to address a wide range of multimode sensing applications.
摘要翻译：在多模FPA中，包括所有吸收层的所有FPA导电层被图案化以形成用于至少两个的电隔离公共端，并且在一些情况下，所有的光电检测器子阵列都支持光电检测器的独立模式偏置。由于公共电气隔离，偏置电压不受CMOS设计规则约束。公共地可以容纳大的偏差幅度差异和不同的时间偏差分布，以解决广泛的多模感测应用。

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