专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明授权

US09437352B2 Resistor and structure for mounting same 有权
标题翻译：电阻和结构用于安装相同
公开(公告)号：US09437352B2
公开(公告)日：2016-09-06
申请号：US14383961
申请日：2013-03-25
申请人： KOA CORPORATION
发明人： Kenji Kameko , Koichi Hirasawa
IPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C17/28
CPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C17/283
摘要： Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
摘要翻译：提供了一种用于电流检测的电阻器，其中防止在电阻器安装在安装板上的状态下由于电迁移而导致的连接故障等。电阻器具有电阻体（11）和电极（12）。电极（12）包括连接到电阻体（11）的第一电极部分（12a）和形成在第一电极部分（12a）上的第二电极部分（12b）。第二电极部分（12b）由电阻率高于第一电极部分（12a）的电阻和用于将电阻器安装在安装板上的焊料构成。

82. 发明申请

US20160240291A1 CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：芯片电阻及其制造方法
公开(公告)号：US20160240291A1
公开(公告)日：2016-08-18
申请号：US15006642
申请日：2016-01-26
申请人： ROHM CO., LTD.
发明人： Kosaku TANAKA , Takashi NOZAKA
IPC分类号： H01C7/20 , H01C17/00
CPC分类号： H01C7/20 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/242
摘要： A chip resistor includes: a resistor body having a front surface and a mounting surface which face in opposite directions; a pair of electrodes which are disposed on both sides of the resistor body with the resistor body sandwiched therebetween and are in electrical conduction with the resistor body; and a protective film covering a portion of the resistor body, wherein a plurality of grooves, which does not penetrate through the resistor body, is formed in the front surface of the resistor body.
摘要翻译：芯片电阻器包括：具有前表面和面向相反方向的安装表面的电阻体; 一对电极，其设置在电阻体的两侧，电阻体夹在其间并与电阻体导通; 以及覆盖电阻体的一部分的保护膜，其中在电阻体的前表面形成有不贯穿电阻体的多个槽。

83. 发明申请

US20160211058A1 Method For Manufacturing Anticorrosive Thin Film Resistor And Structure Thereof 审中-公开
标题翻译：制造防腐薄膜电阻及其结构的方法
公开(公告)号：US20160211058A1
公开(公告)日：2016-07-21
申请号：US14597234
申请日：2015-01-15
申请人： Shih-Long Wei
发明人： Shih-Long Wei
IPC分类号： H01C7/00 , H01C1/142 , C23C14/00 , H01C17/12
CPC分类号： H01C7/006 , C23C14/0036 , C23C14/0652 , C23C14/083 , C23C14/10 , H01C1/028 , H01C1/142 , H01C17/12
摘要： Disclosed are a method for manufacturing an anticorrosive thin film resistor and a structure thereof, which includes a thin film resistor and a protection layer formed on the thin film resistor. The method uses one of silicon (Si) or tantalum (Ta) to serve as a film coating target and, during a process of reactive sputtering, mixes reactive oxygen or nitrogen with a discharge gas so as to coat a thin film on the thin film resistor with the operation temperature of the reactive sputtering process controlled between 100° C.-500° C. As such, the film coating target is passivated to form an anticorrosive protection layer having a thickness of at least 1 μm to prevent change of electrical property of the resistor resulting from electrolytic corrosion.
摘要翻译：公开了一种用于制造防腐薄膜电阻器的方法及其结构，其包括薄膜电阻器和形成在薄膜电阻器上的保护层。该方法使用硅（Si）或钽（Ta）中的一种作为膜包被靶，并且在反应溅射过程中，将活性氧或氮与放电气体混合以便在薄膜上涂覆薄膜电阻器的反应溅射过程的操作温度控制在100℃-500℃之间。因此，将薄膜包覆靶钝化以形成厚度至少为1μm的防腐保护层，以防止电性能的变化的电阻产生的电解腐蚀。

84. 发明申请

US20160138455A1 HEATABLE MOTOR VEHICLE OPERATING LIQUID TANK AND METHOD OF PRODUCING THE HEATING DEVICE FOR IT 审中-公开
标题翻译：热电动车辆操作液体罐和生产加热装置的方法
公开(公告)号：US20160138455A1
公开(公告)日：2016-05-19
申请号：US14941091
申请日：2015-11-13
申请人： Röchling Automotive SE & Co. KG
发明人： Fabrizio Chini , Ivan De Metri , Luca Marini , Francesca Brunori
IPC分类号： F01N3/28 , B23P19/00 , H01C17/02 , F01N3/20
CPC分类号： H01C17/02 , F01N3/2066 , F01N2610/10 , F01N2610/1406 , H01C1/142 , H01C7/102 , H01C17/283 , H01C17/288 , Y02A50/2325 , Y02T10/24
摘要： A motor vehicle operating liquid tank, in particular for storing aqueous urea solution, with a tank shell surrounding a tank volume and with a tank opening extending through the tank shell, wherein a planar heating device in the tank volume is provided with an electrical resistance heating track arranged sandwiched between two plastic films that oppose one another in a planar manner and encase the resistance heating track, the plastic films opposing one another in a planar manner and each have a layer of compatible, thermoplastic plastics at least on their surfaces facing one another which are connected to one another locally at least along a seam track surrounding the electrical resistance heating track, wherein slot areas are provided inside this seam track in which plastic film sections lie opposite one another in an unconnected manner without the intermediate arrangement of a section of a resistance heating track between them.
摘要翻译：一种机动车辆操作液体罐，特别是用于储存尿素水溶液，其具有围绕罐体积的罐壳和延伸穿过罐壳的罐开口，其中罐体积中的平面加热装置设置有电阻加热磁道布置在夹在两个以平面方式彼此相对的塑料膜之间并且包围电阻加热轨道，塑料膜以平面方式彼此相对，并且每个塑料膜至少在彼此面对的表面上具有一层相容的热塑性塑料其至少沿着围绕电阻加热轨道的接缝轨道彼此局部连接，其中槽区域设置在该接缝轨道内部，其中塑料膜部分以不连接的方式彼此相对设置，而没有一部分它们之间的电阻加热轨迹。

85. 发明授权

US09251936B2 Resistor and method for making same 有权
标题翻译：电阻及其制作方法
公开(公告)号：US09251936B2
公开(公告)日：2016-02-02
申请号：US14228780
申请日：2014-03-28
申请人： Vishay Dale Electronics, LLC
发明人： Clark L. Smith , Thomas L. Bertsch , Todd L. Wyatt , Thomas L. Veik , Rodney Brune
IPC分类号： H01C1/02 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/00 , H01C17/28
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
摘要翻译：提供金属条电阻。金属带状电阻器包括形成电阻元件的金属条，并且在不使用单独基板的情况下为金属带状电阻器提供支撑。存在覆盖金属条的第一和第二相对端子。每个第一和第二相对端子上都有电镀。还有在第一和第二相对端子之间覆盖金属带的绝缘材料。提供一种用于形成金属带状电阻器的方法，其中金属带为不使用单独基板的金属带状电阻器提供支撑。该方法包括将绝缘材料涂覆到金属条上，施加光刻工艺以形成覆盖电阻材料的导电图案，其中导电图案包括第一和第二相对端子，电镀导电图案，以及调整金属带的电阻。

86. 发明授权

US09024204B2 Aresistive device with flexible substrate and method for manufacturing the same 有权
标题翻译：具有柔性基板的电阻装置及其制造方法
公开(公告)号：US09024204B2
公开(公告)日：2015-05-05
申请号：US13548015
申请日：2012-07-12
申请人： Yen-Ting Lin , Dar-Win Lo , Sung-Chan Yen , Hsing-Kai Cheng
发明人： Yen-Ting Lin , Dar-Win Lo , Sung-Chan Yen , Hsing-Kai Cheng
IPC分类号： H05K1/16 , B32B37/02 , H01C1/142 , H01C7/00 , H01C7/06 , B32B37/12
CPC分类号： B32B37/02 , B32B37/1207 , B32B2309/105 , B32B2363/00 , B32B2457/08 , H01C1/142 , H01C7/003 , H01C7/06 , Y10T156/10
摘要： A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.
摘要翻译：电阻器件包括电阻层，布置在电阻层上的柔性衬底和电极层。电极层包括布置在电阻层下方并彼此分离的两个电极部分。此外，还公开了一种用于制造具有柔性衬底的电阻器件的方法。

87. 发明授权

US08987864B2 Array type chip resistor and method of manufacturing thereof 有权
标题翻译：阵列型片式电阻器及其制造方法
公开(公告)号：US08987864B2
公开(公告)日：2015-03-24
申请号：US14018801
申请日：2013-09-05
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Jung Il Kim , Ha Sung Hwang , Hae In Kim , Ichiro Tanaka , Oh Sung Kwon
IPC分类号： H01L29/00 , H01L49/02
CPC分类号： H01L28/20 , H01C1/01 , H01C1/14 , H01C1/142 , H01C7/003 , H01C17/281 , H01L28/24
摘要： There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.
摘要翻译：提供了一种阵列式芯片电阻器，包括：芯片体，设置在芯片体的下表面的两侧的四对下电极，并且形成为延伸到芯片主体的边缘，形成为使得下部电极延伸到芯片主体的侧面，并且电阻器插入在芯片主体的下表面上的下部电极之间，并通过接触部分电连接到下部电极，其中当限定侧面电极的宽度时作为d1，将相邻的侧面电极之间的距离定义为d2，将侧面电极的高度定义为h，在d1 / d2为0.5〜1.5的情况下，h的值为4300 /d1μm以上为0.24d2 +87.26μm以下。

88. 发明申请

US20150055682A1 FILM-TYPE THERMISTOR SENSOR 审中-公开
标题翻译： FILM型热敏电阻传感器
公开(公告)号：US20150055682A1
公开(公告)日：2015-02-26
申请号：US14389271
申请日：2013-03-25
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Noriaki Nagatomo , Hiroshi Tanaka , Hitoshi Inaba , Kenji Kubota
IPC分类号： G01K7/22 , G01K1/14
CPC分类号： G01K7/226 , G01K1/143 , H01C1/142 , H01C7/008 , H01C17/06513
摘要： Provided is a film-type thermistor sensor which can be surface-mounted and can be directly deposited on a film or the like without baking. The film-type thermistor sensor includes an insulating film; a thin-film thermistor part formed on the front side of the insulating film; the pair of front side pattern electrodes in which a pair of counter electrode parts facing each other is disposed above or below the thin-film thermistor part and is formed on the front side of the insulating film; and a pair of back side pattern electrodes formed on the back side of the insulating film in such a manner as to face a part of the pair of front side pattern electrodes, wherein the front side pattern electrodes and the back side pattern electrodes are electrically connected via via-holes formed so as to penetrate the insulating film.
摘要翻译：提供一种膜型热敏电阻传感器，其可以被表面安装并且可以直接沉积在膜等上而不烘烤。膜型热敏电阻传感器包括绝缘膜; 形成在所述绝缘膜的前侧的薄膜热敏电阻部; 其中一对相对电极部分彼此面对的一对正面图案电极设置在薄膜热敏电阻部分的上方或下方，并形成在绝缘膜的正面上; 以及一对背面图案电极，其形成在所述绝缘膜的背面上，以与所述一对前侧图案电极的一部分相对的方式形成，其中所述前侧图案电极和所述背面图案电极被电连接通过形成为穿透绝缘膜的通孔。

89. 发明申请

US20150048923A1 RESISTOR AND STRUCTURE FOR MOUNTING SAME 有权
标题翻译：电阻和结构安装
公开(公告)号：US20150048923A1
公开(公告)日：2015-02-19
申请号：US14383961
申请日：2013-03-25
申请人： KOA CORPORATION
发明人： Kenji Kameko , Koichi Hirasawa
IPC分类号： H01C1/14
CPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C17/283
摘要： Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
摘要翻译：提供了一种用于电流检测的电阻器，其中防止在电阻器安装在安装板上的状态下由于电迁移而导致的连接故障等。电阻器具有电阻体（11）和电极（12）。电极（12）包括连接到电阻体（11）的第一电极部分（12a）和形成在第一电极部分（12a）上的第二电极部分（12b）。第二电极部分（12b）由电阻率高于第一电极部分（12a）的电阻和用于将电阻器安装在安装板上的焊料构成。

90. 发明申请

US20140361405A1 ARRAY TYPE CHIP RESISTOR AND METHOD OF MANUFACTURING THEREOF 有权
标题翻译：阵列型芯片电阻及其制造方法
公开(公告)号：US20140361405A1
公开(公告)日：2014-12-11
申请号：US14018801
申请日：2013-09-05
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jung Il KIM , Ha Sung HWANG , Hae In KIM , Ichiro TANAKA , Oh Sung KWON
IPC分类号： H01L49/02
CPC分类号： H01L28/20 , H01C1/01 , H01C1/14 , H01C1/142 , H01C7/003 , H01C17/281 , H01L28/24
摘要： There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.
摘要翻译：提供了一种阵列式芯片电阻器，包括：芯片体，设置在芯片体的下表面的两侧的四对下电极，并且形成为延伸到芯片主体的边缘，形成为使得下部电极延伸到芯片主体的侧面，并且电阻器插入在芯片主体的下表面上的下部电极之间，并通过接触部分电连接到下部电极，其中当限定侧面电极的宽度时作为d1，将相邻的侧面电极之间的距离定义为d2，将侧面电极的高度定义为h，在d1 / d2为0.5〜1.5的情况下，h的值为4300 /d1μm以上为0.24d2 +87.26μm以下。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式