专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明申请

US20140097944A1 CONFORMAL ELECTRONICS INTEGRATED WITH APPAREL 有权
标题翻译：一体化电子与服装集成
公开(公告)号：US20140097944A1
公开(公告)日：2014-04-10
申请号：US13844399
申请日：2013-03-15
申请人： MC10, INC.
发明人： Steven Fastert , Kevin J. Dowling , Benjamin Schlatka , Conor Rafferty
IPC分类号： G06K7/10 , G06K19/073 , G06K19/07
CPC分类号： G06K19/025 , G01K1/022 , G06K7/10009 , G06K19/02 , G06K19/027 , G06K19/0708 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07779 , G06K19/0779
摘要： A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
摘要翻译：提供了一种将保形电子设备集成到服装中的系统。该系统包括柔性基板，柔性装置设置在柔性基板上。柔性装置可包括可用于接收和发射近场通信的可拉伸线圈。柔性装置还包括集成电路部件和存储器单元。在一些示例中，该装置还包括被配置为记录服装和/或周围环境的佩戴者的测量的传感器。

82. 发明申请

US20140079894A1 MULTILAYER ARTICLE HAVING COLD SEAL COATINGS 审中-公开
标题翻译：具有冷密封涂层的多层纸
公开(公告)号：US20140079894A1
公开(公告)日：2014-03-20
申请号：US14028973
申请日：2013-09-17
申请人： Sihl GmbH
发明人： Elisabeth Buchbinder , Axel Niemöller
IPC分类号： G09F3/02 , B32B33/00 , B32B7/12 , G09F3/10 , B32B38/00 , B32B7/02
CPC分类号： G09F3/02 , B32B7/02 , B32B7/12 , B32B33/00 , B32B38/0012 , B32B2307/75 , B32B2519/00 , B32B2519/02 , G06K19/025 , G06K19/07722 , G09F3/10 , Y10T156/1051 , Y10T428/13 , Y10T428/1476
摘要： The present invention relates to a multilayer article comprising a first substrate with a first backing layer and comprising at least one further (second) substrate with a second backing layer, where these have been provided on respectively one side at least to some extent with a cold-seal adhesive layer and have been bonded to one another specifically via the contact between their respective cold-seal adhesive layers, to a process for the production of an article of this type, and also to the use of a printer with at least two unwind systems and with at least one cutting device for the production of articles of this type.
摘要翻译：本发明涉及一种多层制品，其包括具有第一背衬层的第一基底，并且包括至少一个具有第二背衬层的另外（第二）基底，其中这些基底至少在一定程度上以冷的方式设置并且已经通过它们各自的冷封粘合剂层之间的接触而具体地彼此粘合到制造这种类型的制品的方法中，并且还涉及使用具有至少两个展开的打印机系统和至少一个用于生产这种类型物品的切割装置。

83. 发明申请

US20130207781A1 SECURITY SYSTEM FOR AT LEAST AN INTEGRATED CIRCUIT, SECURE INTEGRATED CIRCUIT CARD, AND METHOD OF SECURE WIRELESS COMMUNICATIONS 有权
标题翻译：用于至少集成电路的安全系统，安全集成电路卡和安全无线通信的方法
公开(公告)号：US20130207781A1
公开(公告)日：2013-08-15
申请号：US13763707
申请日：2013-02-10
申请人： STMicroelectronics Srl
发明人： ALBERTO PAGANI , Giovanni Girlando
IPC分类号： G06K7/00
CPC分类号： G06K7/00 , G06K7/10178 , G06K19/025 , G06K19/072 , G06K19/07327 , G06K19/07336 , G06K19/07735 , G06K19/07756 , G06K19/07771 , G06K19/07775 , G06K19/07779
摘要： A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit.
摘要翻译：安全系统包括集成电路和收发器/应答器电路。集成电路包括用于与收发器/应答器电路进行通信的天线。禁止元件与用于禁止与收发器/应答器电路的通信并用于保护集成电路中包含的数据的集成电路相关联。抑制元件是电磁抑制元件。安全系统还包括与集成电路的天线相关联的耦合元件，用于暂时停用电磁抑制元件以允许集成电路和收发器/应答器电路之间的通信。

84. 发明申请

US20130075478A1 COVER STRUCTURE WITH INTEGRATED CHIP AND ANTENNA 有权
标题翻译：具有集成芯片和天线的封装结构
公开(公告)号：US20130075478A1
公开(公告)日：2013-03-28
申请号：US13626932
申请日：2012-09-26
申请人： Infineon Technologies AG
发明人： Peter Scherl , Frank Pueschner , Juergen Hoegerl
IPC分类号： G06K19/067 , H05K13/00
CPC分类号： G06K19/025 , G06K19/07749
摘要： In various embodiments, a cover structure for a personal identification document is provided. The cover structure may include a cover formed as a single layer; a chip module; the cover having a recess for completely receiving the chip module; and an antenna that is connected to the chip module.
摘要翻译：在各种实施例中，提供了用于个人识别文件的盖结构。盖结构可以包括形成为单层的盖; 芯片模块; 所述盖具有用于完全接收所述芯片模块的凹部; 以及连接到芯片模块的天线。

85. 发明授权

US08333320B2 Contactless electronic microcircuit document and proximity sensor 有权
标题翻译：非接触式电子微电路文档和接近传感器
公开(公告)号：US08333320B2
公开(公告)日：2012-12-18
申请号：US12092582
申请日：2006-10-31
申请人： Jean-Claude Huot , Francis Chamberot
发明人： Jean-Claude Huot , Francis Chamberot
IPC分类号： G06K5/00
CPC分类号： G06K19/07336 , G06K17/00 , G06K19/025 , G06K19/04 , G06K19/07749
摘要： The document includes a support (10) provided with at least one first (12) and second (14) parts that can move relative to one another, the support including an electronic microcircuit (3) and contactless coupling members (2) electrically connected to the electronic microcircuit (3), and capable of being coupled to an external reading station (5) for establishing a contactless communications with the latter (5). The support also includes detecting elements (20) capable of detecting the relative proximity of the first and second parts independent of the contactless coupling members (2), and securing elements (30) connected to the detecting elements (20) and capable of inhibiting and/or authorizing the activation of the contactless communication according to the relative proximity of the first and second parts thus detected.
摘要翻译：该文件包括具有能够相对于彼此移动的至少一个第一（12）和第二（14）部分的支撑件（10），所述支撑件包括电连接到电子微电路（3）和非接触耦合构件（2）电子微电路（3），并且能够耦合到外部读取站（5），用于与后者建立非接触式通信（5）。支撑件还包括能够独立于非接触式联接构件（2）检测第一和第二部件的相对接近度的检测元件（20）和连接到检测元件（20）的固定元件（30），并且能够抑制和 /或者根据如此检测的第一和第二部分的相对接近来授权非接触式通信的激活。

86. 发明授权

US08314706B2 Coupled radio frequency identification (RFID) and biometric device 失效
标题翻译：耦合射频识别（RFID）和生物识别装置
公开(公告)号：US08314706B2
公开(公告)日：2012-11-20
申请号：US12974883
申请日：2010-12-21
申请人： Robert R. Oberle
发明人： Robert R. Oberle
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/025 , G06K19/07318 , G06K19/07345 , H04Q2213/13095 , H04Q2213/13098 , H04Q2213/13103
摘要： A Radio Frequency Identification (RFID)-based identification device can comprise first and second RFID antennas. When first and second RFID antennas are in a first arrangement, the resonant frequencies of the antennas can be away from an interrogation frequency such that no identification information is transferred. When the first and second RFID antennas are in a second arrangement, the resonant frequency of the identification device shifts such that identification information, including biometric data, is transferred.
摘要翻译：基于射频识别（RFID）的识别装置可以包括第一和第二RFID天线。当第一和第二RFID天线处于第一布置时，天线的谐振频率可以远离询问频率，使得不传送识别信息。当第一和第二RFID天线处于第二布置时，识别装置的谐振频率移位，使得包括生物特征数据在内的识别信息被传送。

87. 发明授权

US08188867B2 Transponder inlay for a personal document and method for the production thereof 有权
标题翻译：用于个人文件的转发器嵌件及其生产方法
公开(公告)号：US08188867B2
公开(公告)日：2012-05-29
申请号：US13043718
申请日：2011-03-09
申请人： Manfred Rietzler
发明人： Manfred Rietzler
IPC分类号： G08B13/14 , H01L21/00
CPC分类号： G06K19/07749 , G06K19/025 , G06K19/07745 , H01L2924/0002 , Y10T29/49016 , H01L2924/00
摘要： The invention relates to a transponder inlay (11) for manufacturing a layered structure (40) for a personal document with a substrate layer (12) for arranging a transponder unit (15) that includes an antenna coil (13) and a chip module (14) and which is situated on a contact surface (17) of the substrate layer, wherein the chip module (14) is accommodated in a window opening (30) formed in the substrate layer (12) in such a way that a chip carrier (23) of the chip module rests with its circumferential edge on a compressed peripheral shoulder (24) of the window opening (30); the invention also relates to a method for manufacturing the transponder inlay. In addition, the present invention relates to a layered structure for a personal document, which is provided with such a transponder inlay, and an identification document having such a layered structure.
摘要翻译：本发明涉及一种用于制造用于个人文件的分层结构（40）的应答器嵌体（11），具有用于布置包括天线线圈（13）和芯片模块（15）的应答器单元（15）的基底层（12） 14），其位于衬底层的接触表面（17）上，其中芯片模块（14）容纳在形成在衬底层（12）中的窗口（30）中，使得芯片载体所述芯片模块（23）的周边边缘位于所述窗口（30）的压缩外围肩部（24）上。本发明还涉及一种制造应答器嵌体的方法。此外，本发明涉及一种具有这样的应答器嵌体的个人文件分层结构，以及具有这种分层结构的识别文档。

88. 发明申请

US20120104102A1 Sectional Documents Comprising a Structure Equipped with a Watermark or Pseudo-Watermark and Associated Process 审中-公开
标题翻译：包含水印或伪水印及相关过程的结构的剖面文件
公开(公告)号：US20120104102A1
公开(公告)日：2012-05-03
申请号：US13263680
申请日：2010-04-12
申请人： Sandrine Rancien , Thibault Le Loarer , Pascal Marlin
发明人： Sandrine Rancien , Thibault Le Loarer , Pascal Marlin
IPC分类号： G06K19/077 , G06K19/02 , B32B38/14 , B32B3/00
CPC分类号： B42D25/333 , B41M3/10 , B42D25/21 , B42D25/23 , B42D25/24 , B42D25/351 , B42D25/364 , B42D25/378 , B42D2033/30 , B42D2035/24 , G06K19/025 , G06K19/07722 , G06K19/07749 , Y10T428/24802
摘要： The present invention relates to a sectional document (100) comprising: —a support (101) that defines at least two sections (101a, 1010b) connected by at least one fold line (102), —a structure linked to the support (101), especially at the fold line (102), with a possibility of movement relative to the latter and extending at least partially between the two sections (101a, 101b) when the sectional document is folded, the structure comprising: —a fibrous layer (103a, 103b, 104a, 104b), —a substructure (120) comprising a translucent region, —a watermark or pseudo-watermark (10a) borne by the fibrous layer and being superposed at least partially at the translucent region of the substructure, so that the watermark or pseudo-watermark can be observed in light transmitted through the structure, at the translucent region of the substructure, only from the face of the structure situate on the side of the fibrous layer.
摘要翻译：本发明涉及一种分段文件（100），包括： - 一个支撑件（101），其限定由至少一个折叠线（102）连接的至少两个部分（101a，1010b）， - 连接到所述支撑件），特别是在折叠线（102）处，具有相对于后者移动的可能性，并且当部分文档被折叠时至少部分地在两个部分（101a，101b）之间延伸，该结构包括： - 纤维层 103a，103b，104a，104b）， - 包括半透明区域的子结构（120），由纤维层承载并至少部分地叠置在子结构的半透明区域的水印或伪水印（10a），因此可以在透射结构的光中观察到水印或伪水印，在子结构的半透明区域，只有结构的表面位于纤维层的侧面。

89. 发明申请

US20110215563A1 STRUCTURE COMPRISING A WATERMARK OR PSEUDO-WATERMARK, AND AN INTEGRATED MICROCIRCUIT DEVICE 审中-公开
标题翻译：包含水印或PSEUDO-WATERMARK的结构，以及集成的微型设备
公开(公告)号：US20110215563A1
公开(公告)日：2011-09-08
申请号：US13000898
申请日：2009-06-22
申请人： Sandrine Rancien , Thibaut Le Loarer , Gaetan Le Gouic
发明人： Sandrine Rancien , Thibaut Le Loarer , Gaetan Le Gouic
IPC分类号： B42D15/00
CPC分类号： B42D25/333 , B42D25/00 , B42D25/351 , B42D2033/06 , B42D2033/28 , B42D2033/30 , B42D2033/46 , B42D2035/36 , G06K19/025 , G06K19/07749 , G06K19/10 , G06K19/16
摘要： The invention provides a structure comprising: a fiber layer; a sub-structure including a translucent region; a watermark or pseudo-watermark carried by the fiber layer and superposed at least in part with the translucent region of the sub-structure, such that, in the translucent region of the sub-structure, the watermark or pseudo-watermark is observable in light transmitted through the structure only from the face of the structure that is adjacent to the fiber layer; and an integrated microcircuit device for communicating with or without contact.
摘要翻译：本发明提供一种结构，包括：纤维层; 包括半透明区域的子结构; 由纤维层承载的水印或伪水印，至少部分地与子结构的半透明区域重叠，使得在子结构的半透明区域中，水印或伪水印在光中是可观察的仅从与纤维层相邻的结构的表面透过结构; 以及用于与或不具有接触通信的集成微电路设备。

90. 发明授权

US07994617B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07994617B2
公开(公告)日：2011-08-09
申请号：US10587237
申请日：2005-02-01
申请人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
发明人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/025 , G06K19/07728 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2221/6835 , H01L2224/73204
摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
摘要翻译：本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。第一和第三绝缘膜是无机绝缘膜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式