专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明申请

US20030103737A1 Packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring 失效
公开(公告)号：US20030103737A1
公开(公告)日：2003-06-05
申请号：US10006839
申请日：2001-11-05
申请人： International Business Machines Corporation
发明人： Johnny R. Brezina , Brian M. Kerrigan , Gerald D. Malagrino JR. , James R. Moon
IPC分类号： G02B006/36
CPC分类号： G02B6/4246 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283
摘要： The packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring of the present invention provides a 90-degree transition between an optical signal input/output at a communication chassis bulkhead, and provides an attachment to a heat spreader for use in wiring electrical components to the flexible cable. The packaging architecture system comprises a forward vertical carrier having an optical converter, a rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier, a heat spreader, and a flexible cable attached to the sides of the heat spreader. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink that is attached to the heat spreader which concurrently mounts and locates the transceiver to a common host board.

82. 发明授权

US06547452B1 Alignment systems for subassemblies of overmolded optoelectronic modules 有权
标题翻译：包覆成型光电子模块子组件对准系统
公开(公告)号：US06547452B1
公开(公告)日：2003-04-15
申请号：US09568978
申请日：2000-05-11
申请人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
发明人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
IPC分类号： G02B636
CPC分类号： B29C45/14655 , B29C45/14065 , G02B6/4201 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4239 , G02B6/4255 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.
摘要翻译：用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征在基板上。柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

83. 发明申请

US20030027440A1 Module apparatus and method of assembly 有权
标题翻译：模块装置及组装方法
公开(公告)号：US20030027440A1
公开(公告)日：2003-02-06
申请号：US09920597
申请日：2001-08-01
发明人： Kevin Michael Birch , Peter Charles Gibson
IPC分类号： H05K003/36 , H05K001/00 , H01R012/00 , H05K003/30 , H01R043/20
CPC分类号： G02B6/4246 , G02B6/4257 , G02B6/426 , G02B6/4277 , G02B6/4281 , G02B6/4283 , Y10T29/49126 , Y10T29/49139 , Y10T29/49208
摘要： Existing optical transceiver modules employ flex circuits in order to achieve a predetermined between an optical centreline and a centreline of pins of the transceiver module. The present invention employs a lead frame to attach pins to a lower edge of circuit boards forming the transceiver module so that the circuit boards can be inserted vertically with respect to a surface upon which the transceiver module is to be mounted when in use.
摘要翻译：现有的光收发器模块采用柔性电路，以便在光学中心线和收发器模块的引脚的中心线之间实现预定。本发明采用引线框架将引脚连接到形成收发器模块的电路板的下边缘，使得电路板可以在使用时相对于要安装收发器模块的表面垂直插入。

84. 发明申请

US20020122636A1 Optoelectronic mounting structure 有权
标题翻译：光电安装结构
公开(公告)号：US20020122636A1
公开(公告)日：2002-09-05
申请号：US09749283
申请日：2000-12-26
发明人： Gene R. Anderson , Marcelino G. Armendariz , Johnny R.F. Baca , Robert P. Bryan , Richard F. Carson , Dahwey Chu , Edwin B. Duckett III , Frederick B. McCormick , David W. Peterson , Gary D. Peterson , Cathleen A. Reber , Bill H. Reysen
IPC分类号： G02B006/42
CPC分类号： G02B6/4239 , G02B6/266 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4221 , G02B6/4224 , G02B6/4227 , G02B6/4253 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292 , H01L2224/48091 , H01L2224/48137 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.
摘要翻译：提供了可以与光发射器，接收器或收发器模块结合使用的光电安装结构。该装置包括：（1）安装结构; （2）适于安装结构的光电子器件的阵列，所述光电器件具有至少第一端; （3）光学元件阵列，所述光学元件阵列至少具有第一端; （4）以一个或多个光学元件与一个或多个光电子器件光学对准的方式靠近光电子器件阵列的第一端的光学元件阵列的第一端; 和（5）沿安装结构的头部区域的表面通过的散热器。安装结构可以是柔性印刷电路板。头部区域中的热通孔或热管可以将热量从安装结构传递到散热器。散热器可以为热区域提供机械刚度或刚度。在另一个实施例中，电触点和接地平面可以沿着头部区域的表面通过，以便提供到光电子器件的电接触路径并限制电磁干扰。在另一个实施例中，可以在安装结构的头部区域中形成窗口，以便提供对散热器的通路。光电子器件可以以这样的方式适应于散热器，使得器件可通过安装结构中的窗口接近。

85. 发明申请

US20020041740A1 Transparent substrate and hinged optical assembly 有权
标题翻译：透明基板和铰链光学组件
公开(公告)号：US20020041740A1
公开(公告)日：2002-04-11
申请号：US09951646
申请日：2001-09-13
发明人： Gary O'Connor , Randy Wickman , John Greene , Daniel Mansur , Dave Barneson , Bryan Gregory
IPC分类号： G02B006/42
CPC分类号： G02B6/4249 , G02B6/4201 , G02B6/423 , G02B6/4259 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H05K1/0393 , H05K3/4691
摘要： A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optically transparent substrate having first and second planar elements with an abutting common edge, the planar elements lying at differing angles with respect to each other about the common edge and a plurality of alignment apertures formed in the substrate. A plurality of optical devices of an optical array are disposed on the first planar element of the substrate, with transmission paths of the optical devices passing directly through the substrate. A signal processor is also disposed on the first planar element of the substrate. An optical fiber holder comprising a plurality of respective optical fibers and guide pin apertures disposed on a first substrate of the optical fiber holder is aligned to the optical array using the guide pins and guide pin apertures. Optical signals of the optical devices of the optical array are coupled to respective optical fibers of the aligned optical fiber holder. A printed circuit board having a first surface is attached to a mating surface of the substrate's second planar element.
摘要翻译：提供了一种用于提供电光信号处理装置的方法和装置。该方法包括以下步骤：提供具有第一和第二平面元件的光学透明基板，该第一和第二平面元件具有邻接的共同边缘，所述平面元件围绕公共边缘相对于彼此以不同的角度和在基板中形成的多个对准孔。光学阵列的多个光学器件设置在衬底的第一平面元件上，光学器件的传输路径直接通过衬底。信号处理器也设置在基板的第一平面元件上。包括设置在光纤保持器的第一基板上的多个相应光纤和引导销孔的光纤保持器使用引导销和引导销孔与光学阵列对准。光学阵列的光学器件的光学信号耦合到对准的光纤保持器的相应光纤。具有第一表面的印刷电路板被附接到基板的第二平面元件的配合表面。

86. 发明授权

US06318909B1 Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers 有权
标题翻译：用于光纤通信设备的集成封装系统，提供与光纤的自动对准
公开(公告)号：US06318909B1
公开(公告)日：2001-11-20
申请号：US09248877
申请日：1999-02-11
申请人： Kirk S. Giboney , Paul K. Rosenberg , Albert T. Yuen
发明人： Kirk S. Giboney , Paul K. Rosenberg , Albert T. Yuen
IPC分类号： G02B636
CPC分类号： G02B6/4249 , G02B6/4201 , G02B6/4228 , G02B6/4269 , G02B6/428 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.
摘要翻译：一种集成的包装系统，包括一体的机械支撑件，印刷电路板和光通信装置。机械支撑件包括第一支撑元件和第二支撑元件。第一支撑元件与第二支撑元件成非零角度延伸。印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。在这种情况下，第一支撑元件包括装置对准特征。设备对准特征和光通信设备相对于彼此具有限定的位置关系。或者，系统可以另外包括盖组件，其包括包括装置对准特征的盖。所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。

87. 发明授权

US06242274B1 Method of mounting a chip on a flexible foil substrate for positioning on a capsule 有权
标题翻译：将芯片安装在柔性箔基底上用于定位在胶囊上的方法
公开(公告)号：US06242274B1
公开(公告)日：2001-06-05
申请号：US09077369
申请日：1998-12-03
申请人： Leif Ingmar Nyholm
发明人： Leif Ingmar Nyholm
IPC分类号： H01L2100
CPC分类号： H01L23/49855 , G02B6/4224 , G02B6/4245 , G02B6/4249 , G02B6/4261 , G02B6/4281 , H01L23/13 , H01L2224/73204
摘要： With the intention of simplifying an arrangement of a chip having at least one optical active surface and positioning the chip in a correct position in relation to an optical miniature capsule for optimum light transmission between an optical fiber and the optically active surface, the chip (1) is fastened on a foil substrate (9) which has at least one conductor (4) and which is provided with alignment marks and/or guide means (8) for correct positioning of the chip on the foil substrate and for correct positioning of the foil substrate/chip assembly on the capsule. After having fastened the chip on the foil substrate, the foil with the chip can be readily fastened to the capsule and by that means the chip will be fastened to the capsule. By using guide means, for instance contact element guide pins on the capsule, the foil substrate/chip assembly can be positioned correctly in relation to the capsule, such that the ends of the optical fibers in the contact element will lie opposite to and in contact with the optically active surfaces of the chip and therewith provide optimum light transmission.
摘要翻译：为了简化具有至少一个光学有效表面的芯片的布置，并且将芯片相对于光学微型胶囊定位在适当的位置，以在光纤和光学活性表面之间实现最佳的光传输，芯片（1 ）紧固在具有至少一个导体（4）的箔基板（9）上，并且设置有对准标记和/或引导装置（8），用于将芯片正确地定位在箔基板上，并且正确地定位箔片衬底/芯片组件在胶囊上。在将芯片固定在箔基片上之后，具有芯片的箔片可以容易地紧固到胶囊，并且通过这种方式芯片将被固定到胶囊上。通过使用引导装置，例如胶囊上的接触元件引导销，箔片基板/芯片组件可以相对于胶囊正确定位，使得接触元件中的光纤的端部将相对于并且接触与芯片的光学活性表面一起提供最佳的光透射。

88. 发明授权

US5763854A Machine for laser reflow soldering 失效
标题翻译：激光回流焊机
公开(公告)号：US5763854A
公开(公告)日：1998-06-09
申请号：US660665
申请日：1996-05-30
申请人： Eberhard Siegfried Dittman , Mukund Kantilal Saraiya
发明人： Eberhard Siegfried Dittman , Mukund Kantilal Saraiya
IPC分类号： B23K1/005 , B23K35/26 , G02B6/42 , H01R43/02 , H01S3/00 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , B23K26/08 , B23K26/12
CPC分类号： B23K35/268 , B23K1/0056 , G02B6/4201 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4292 , H05K3/326 , H05K3/3421 , H05K3/3447 , H05K3/3463 , H05K3/363 , B23K2201/40 , G02B6/4263 , G02B6/4269 , G02B6/4274 , G02B6/4281 , H05K1/0393 , H05K1/118 , H05K2201/0397 , H05K2201/10121 , H05K2201/1059 , H05K2203/0195 , H05K2203/107 , H05K3/306 , H05K3/3457 , H05K3/3468 , H05K3/3494 , H05K3/366 , H05K3/4092 , Y02P70/613
摘要： A machine for connecting leads of a substrate to solder pads, the machine including a motor moving a conveyor for automatically positioning the substrate in the machine so that a bottom side of the substrate has a lead placed in contact with a solder pad without flux for reflow soldering. Additionally, a laser is present to heat the solder pad in an atmosphere of an inert gas mixed with formic acid for reflow soldering of the lead to the reflowed solder pad. A probe can be used to press the lead against the solder pad which may be made of Molybdenum to prevent solder adhesion. The solder pad can be made of 20% tin and 80% lead.
摘要翻译：一种用于将基板的引线连接到焊盘的机器，该机器包括马达，其移动用于将基板自动定位在机器中的输送机，使得基板的底侧具有与焊料接触的引线，而没有用于回流的焊剂焊接。此外，存在激光以在与甲酸混合的惰性气体的气氛中加热焊盘，以将引线回流焊接到回流的焊盘。可以使用探头将引线压在可由钼制成的焊盘上，以防止焊料粘附。焊盘可由20％锡和80％铅制成。

89. 发明授权

US5742025A Laser reflow soldering process with lead-tin solder pads 失效
标题翻译：激光回流焊接工艺，带铅锡焊盘
公开(公告)号：US5742025A
公开(公告)日：1998-04-21
申请号：US794762
申请日：1996-05-30
申请人： Eberhard Siegfried Dittman , Mukund Kantilal Saraiya
发明人： Eberhard Siegfried Dittman , Mukund Kantilal Saraiya
IPC分类号： B23K1/005 , B23K35/26 , G02B6/42 , H01R43/02 , H01S3/00 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , B23K26/12
CPC分类号： B23K35/268 , B23K1/0056 , G02B6/4201 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4292 , H05K3/326 , H05K3/3421 , H05K3/3447 , H05K3/3463 , H05K3/363 , B23K2201/40 , G02B6/4263 , G02B6/4269 , G02B6/4274 , G02B6/4281 , H05K1/0393 , H05K1/118 , H05K2201/0397 , H05K2201/10121 , H05K2201/1059 , H05K2203/0195 , H05K2203/107 , H05K3/306 , H05K3/3457 , H05K3/3468 , H05K3/3494 , H05K3/366 , H05K3/4092 , Y02P70/613
摘要： An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend from the optical sub-assemblies. At the other end of the cable leads extend across interconnection pads on the surface of the rigid interconnect structure for soldered connection. The top surface of the interconnect pads is 10/90 (Sn/Pb) solder to provide a high temperature soldered joint. Solder flux can not be used because cleaning solvents would contaminate the interconnect structure. An atmosphere of formic acid mixed with nitrogen surrounds the lead and pad and a fluxless solder joint is formed by laser soldering.
摘要翻译：光学模块包含形成电缆的柔性电路板，其连接在光学模块内的光学子组件和刚性互连结构之间。电缆的一端包括靠近通孔的焊盘，用于焊接连接到从光学子组件延伸的销。在电缆引线的另一端延伸穿过用于焊接连接的刚性互连结构的表面上的互连焊盘。互连焊盘的顶面是10/90（Sn / Pb）焊料，以提供高温焊接接头。不能使用焊剂，因为清洁溶剂会污染互连结构。与氮气混合的甲酸气氛围绕铅和焊盘，通过激光焊接形成无助焊剂焊点。

90. 发明公开

US20240241541A1 OPTICAL COMPONENTS AND ASSEMBLY TECHNIQUES 审中-公开
公开(公告)号：US20240241541A1
公开(公告)日：2024-07-18
申请号：US18410866
申请日：2024-01-11
申请人： Oura Health Oy
发明人： Jukka Tapani Mäkinen
IPC分类号： G06F1/16 , G02B6/42
CPC分类号： G06F1/163 , G02B6/4214 , G02B6/4245 , G02B6/4281
摘要： Methods, systems, and devices for manufacturing a device are described. The manufacturing system may assemble a plurality of optical components onto an inner circumference of an inner housing member of a wearable ring device and align the plurality of optical components with a plurality of apertures of the inner housing member. In some cases, the manufacturing system may position a plurality of optoelectronic components affixed to a flexible printed circuit board onto the inner circumference after the plurality of optical components are assembled onto the inner circumference. The manufacturing system may adhere the plurality of optoelectronic components to the plurality of optical components such that the plurality of optical components are aligned with the plurality of optoelectronic components.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式