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81. 发明申请

US20190247974A1 METHOD FOR POLISHING WAFER 审中-公开
公开(公告)号：US20190247974A1
公开(公告)日：2019-08-15
申请号：US16391119
申请日：2019-04-22
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
发明人： Yu-Yi TSAI , Wen-Pin HO , Chieh-Han LEE , Yu-Hsiang CHAO
IPC分类号： B24B37/20 , B24B37/32 , B24B53/02 , B24B53/12
CPC分类号： B24B37/20 , B24B37/32 , B24B53/02 , B24B53/12
摘要： A method for performing a chemical mechanical polishing (CMP) is disclosed. The method includes supplying a slurry onto a polishing pad, holding a first wafer against the polishing pad by a first polishing head, holding a second wafer against the polishing pad by a second polishing head, and rotating the polishing pad.

82. 发明授权

US09802293B1 Method to shape the surface of chemical mechanical polishing pads 有权
公开(公告)号：US09802293B1
公开(公告)日：2017-10-31
申请号：US15279645
申请日：2016-09-29
申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.
发明人： Jeffrey James Hendron , Jeffrey Robert Stack
IPC分类号： B24B53/017 , B24B37/24 , B24D18/00 , B24B53/02 , B24B53/095
CPC分类号： B24B53/017 , B24B37/24 , B24B53/02 , B24B53/095 , B24D18/0009 , B24D18/0045
摘要： The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.

83. 发明授权

US09533395B2 Method and apparatus for conditioning a polishing pad 有权
标题翻译：调整抛光垫的方法和装置
公开(公告)号：US09533395B2
公开(公告)日：2017-01-03
申请号：US15041284
申请日：2016-02-11
申请人： EBARA CORPORATION
发明人： Mutsumi Tanikawa , Takahiro Shimano
IPC分类号： B24B49/00 , B24B53/017 , B24B49/18 , B24B53/02
CPC分类号： B24B53/017 , B24B49/006 , B24B49/18 , B24B53/02
摘要： A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.
摘要翻译：调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。

84. 发明授权

US09463552B2 Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods 有权
标题翻译： Superbrasvie工具包含均匀平整的超级磨料颗粒和相关方法
公开(公告)号：US09463552B2
公开(公告)日：2016-10-11
申请号：US13113779
申请日：2011-05-23
申请人： Chien-Min Sung
发明人： Chien-Min Sung
IPC分类号： B24B53/017 , B24D11/00 , B24B53/02 , B24D3/06 , B01J3/06
CPC分类号： B24B53/017 , B01J3/062 , B01J2203/061 , B01J2203/062 , B01J2203/0645 , B01J2203/0655 , B01J2203/066 , B01J2203/068 , B24B53/02 , B24D3/06 , B24D11/005 , Y10T428/24893
摘要： A superabrasive tools having uniformly leveled superabrasive particles and associated methods are provided. In one aspect, for example, a superabrasive can include a metal matrix configured for bonding superabrasive particles and a plurality of superabrasive particles held in the metal matrix at specific positions according to a predetermined pattern, wherein tips of each of the plurality of the superabrasive particles protrude from the metal matrix to a uniform height.
摘要翻译：提供了具有均匀平整的超研磨颗粒和相关方法的超级磨料工具。一方面，例如，超级磨料可以包括金属基体，其被配置为根据预定图案将超研磨颗粒和保持在特定位置处的金属基体中的多个超研磨颗粒结合，其中多个超级磨料颗粒中的每一个的尖端从金属基体突出到均匀的高度。

85. 发明申请

US20150165587A1 CARRIER HEAD HAVING ABRASIVE STRUCTURE ON RETAINER RING 有权
标题翻译：在保持环上具有磨耗结构的承载头
公开(公告)号：US20150165587A1
公开(公告)日：2015-06-18
申请号：US14105232
申请日：2013-12-13
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Chang-Sheng LIN
IPC分类号： B24B37/32 , B24B53/017
CPC分类号： B24B53/017 , B24B37/10 , B24B37/32 , B24B53/02 , H01L21/30625 , H01L21/67253
摘要： A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.
摘要翻译：承载头包括构造成包围晶片的壳体和附接到壳体的保持环。保持环包括主体和研磨结构。本体包括构造成包围晶片的内周边，外周边和连接内周和外周的表面。研磨结构附着在身体的表面上。

86. 发明申请

US20130295820A1 GRINDING WHEEL DRESSING SYSTEM 有权
标题翻译：砂轮磨边系统
公开(公告)号：US20130295820A1
公开(公告)日：2013-11-07
申请号：US13909191
申请日：2013-06-04
申请人： White Drive Products, Inc.
发明人： Hollis N. White, JR.
IPC分类号： B24B53/02
CPC分类号： B24B53/02 , B24B7/17
摘要： A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.
摘要翻译：砂轮修整组件包括可围绕中心轴线旋转的驱动齿轮和与驱动齿轮啮合的修整环。驱动齿轮围绕中心轴的旋转导致修整环围绕偏离中心轴偏移的偏移轴线旋转。修整环包括大致垂直于偏移轴线的接触表面，并且适于从与接触表面接触的砂轮的基本平坦的研磨表面上去除钝的CBN颗粒。

87. 发明申请

US20130059503A1 METHOD OF AND APPARATUS FOR CMP PAD CONDITIONING 有权
标题翻译： CMP PAD调节的方法和装置
公开(公告)号：US20130059503A1
公开(公告)日：2013-03-07
申请号：US13227155
申请日：2011-09-07
申请人： Hsiu-Ming Yeh , Feng-Inn Wu
发明人： Hsiu-Ming Yeh , Feng-Inn Wu
IPC分类号： B24B1/00 , B24B53/00
CPC分类号： B24B53/017 , B24B53/003 , B24B53/02 , B24B53/053 , B24B53/12 , H01L21/30625
摘要： A chemical mechanical polishing (CMP) apparatus is provided that includes a conditioning disc for conditioning a polishing pad of the CMP apparatus. The conditioning disc includes a plurality of portions of subsystem discs. The portions may be regions of the disc that are concentric. Each portion of the disc is operable to rotate at a different angular velocity. In some embodiments, a different applied loading is provided to each of the portions of the disc in addition to or in lieu of the different angular velocities.
摘要翻译：提供了一种化学机械抛光（CMP）装置，其包括用于调节CMP设备的抛光垫的调节盘。调节盘包括多个子系统盘部分。这些部分可以是同心的盘的区域。盘的每个部分可操作以以不同的角速度旋转。在一些实施例中，除了不同的角速度之外或代替不同的角速度，将不同的施加的载荷提供给盘的每个部分。

88. 发明申请

US20110034112A1 POLISHING APPARATUS, POLISHING AUXILIARY APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光设备，抛光辅助设备和抛光方法
公开(公告)号：US20110034112A1
公开(公告)日：2011-02-10
申请号：US12936818
申请日：2009-04-10
申请人： Susumu Sugano
发明人： Susumu Sugano
IPC分类号： B24B53/02
CPC分类号： B24B53/02 , B24B7/04 , B24B53/12
摘要： A polishing apparatus, a polishing method and a polishing auxiliary apparatus which are able to suppress clogging of the rotating grindstone and polish the work while suppressing the damage thereof are provided. A polishing apparatus 1 according to the present invention includes: a rotating shaft section 5; a rotating table 6 which is arranged on the rotating shaft section 5 and holds a work 30 on an upper surface of the rotating table; a rotating grindstone 3 which is supported to be able to rotate in a direction opposite to the rotating direction of the rotating table 6 and to move up and down; a dress grindstone arranging section 10 arranged around the rotating shaft section 5; and a dress grindstone 11 which is fixed onto the dress grindstone arranging section 10 with a polishing surface thereof facing a polishing surface of the rotating grindstone 3, wherein the work is polished by bringing a surface of the rotating grindstone 3 into contact with a surface of the work 30 while rotating the rotating table 6 and the rotating grindstone 3 in directions opposite to each other, and the rotating grindstone 3 is dressed by bringing a polishing surface of the rotating grindstone 3 into contact with the polishing surface of the dress grindstone 11.
摘要翻译：提供能够抑制旋转磨石堵塞并抛光工件同时抑制其损伤的抛光装置，抛光方法和抛光辅助装置。根据本发明的抛光装置1包括：旋转轴部5; 旋转台6，其设置在旋转轴部5上并将工件30保持在旋转台的上表面上; 旋转砂轮3被支撑成能够沿与旋转台6的旋转方向相反的方向旋转并且上下移动; 布置在旋转轴部5周围的连接磨石配置部10; 以及将研磨面贴合在旋转砂轮3的研磨面上而固定在装饰磨石配置部10上的着装磨石11，其中通过使旋转砂轮3的表面与旋转砂轮3的表面接触来研磨工件同时使旋转台6和旋转砂轮3沿彼此相反的方向旋转，并且通过使旋转砂轮3的抛光表面与磨砂石11的抛光表面接触来修整旋转砂轮3。

89. 发明申请

US20100190418A1 LAPPING PLATE-CONDITIONING GRINDSTONE SEGMENT, LAPPING PLATE-CONDITIONING LAPPING MACHINE, AND METHOD FOR CONDITIONING LAPPING PLATE 审中-公开
标题翻译：接缝板调节磨石分段，拉皮机调节机，以及调整拉板的方法
公开(公告)号：US20100190418A1
公开(公告)日：2010-07-29
申请号：US12693756
申请日：2010-01-26
申请人： Kai YASUOKA , Tsuyoshi Shimizu , Kenichi Kazama
发明人： Kai YASUOKA , Tsuyoshi Shimizu , Kenichi Kazama
IPC分类号： B24B37/04 , B24B7/04 , B24B41/06 , B24B53/00 , B24B53/12
CPC分类号： B24D7/06 , B24B53/013 , B24B53/02 , B24B53/12
摘要： In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate and the carrier and feeding loose abrasive grains to the lapping plate. The conditioning grindstone segment of a shape of arcuated trapezoid having an included angle of 180°-90° is fitted in the carrier bore.
摘要翻译：在包括研磨板和设置在其上的调理载体的研磨机中，载体设置有用于接收调节磨石段的孔，研磨板通过协同旋转研磨板和载体并将松散的磨粒供给到研磨盘具有角度为180°-90°的弧形梯形形状的调节磨石段安装在承载孔中。

90. 发明申请

US20080233842A1 DRESSER AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF DRESSING POLISHING PAD 失效
标题翻译：化学机械抛光用织物及装置及抛光垫方法
公开(公告)号：US20080233842A1
公开(公告)日：2008-09-25
申请号：US12051965
申请日：2008-03-20
申请人： Toshiya Saito
发明人： Toshiya Saito
IPC分类号： B24B53/12 , B24B53/02
CPC分类号： B24B53/017 , B24B53/02
摘要： A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least three polish retainers having band-like shapes are formed and elongated in radial directions from substantially the center of the support surface so as to form a plurality of sectorial regions. A plurality of parallel portions are formed in parallel with the polish retainer in each sectorial region. A plurality of band-shaped non-polish retainers are formed between the polish retainer and its parallel portion in each sectorial region. The dresser ensures adequate fuzziness of the polishing pad by way of dressing; hence, it is possible to maintain desired polishing performance of the polishing pad for a long time.
摘要翻译：适用于化学机械抛光装置的修整器用于在抛光垫上进行修整，以抛光半导体晶片，使得其圆形支撑表面与抛光垫的抛光表面相对并与其相接触。在修整器中，至少有三个具有带状形状的抛光保持器从径向方向形成并从支撑表面的大致中心延伸，以形成多个扇形区域。多个平行部分与每个扇形区域中的抛光保持器平行地形成。在每个扇形区域中的抛光保持器和其平行部分之间形成多个带状非抛光保持器。梳妆台通过敷料确保抛光垫的充分模糊性; 因此，可以长时间保持抛光垫的期望的抛光性能。

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