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81. 发明授权

US07066704B2 Component feeder exchange cart, and mechanism and method for positioning component feeder 失效
标题翻译：部件进料器更换车，以及定位部件进料器的机构和方法
公开(公告)号：US07066704B2
公开(公告)日：2006-06-27
申请号：US10149064
申请日：2000-12-07
申请人： Tadashi Endo , Takao Kashiwazaki , Akira Kabeshita
发明人： Tadashi Endo , Takao Kashiwazaki , Akira Kabeshita
IPC分类号： B65G67/00
CPC分类号： H05K13/0417 , Y10T74/2057
摘要： A cart comprises a base frame, driver for extending an operational stroke of a hydraulic jack and transferring this movement into an up and down motion, a pair of elevating rods simultaneously lifted of lowered by movement of the driver, a pair of supporting frames for operably supporting the elevating rods by virtue of guide rollers, and a holder fixed to the elevating rods for lifting and lowering the component supply unit, wherein a multi purpose space is formed surrounded by the driver, the elevating rods, and the holder. By using a positioning mechanism containing a structure where a positioning pin of a fixing device fits into a V-shaped slot formed on a component supply unit side, a component supply unit may be positioned in two different directions by pushing the component supply unit in a single direction.
摘要翻译：推车包括底架，用于延伸液压千斤顶的操作行程并将该运动转换成上下运动的驱动器，一对升降杆，其通过驱动器的运动而同时升降;一对支撑框架，用于可操作地通过导辊支撑升降杆，固定在升降杆上的用于升降部件供给单元的保持架，其特征在于，由驾驶员，升降杆和保持架构成的多用途空间形成。通过使用包含定影装置的定位销配合到形成在部件供给单元侧的V形槽的结构的定位机构，通过将部件供给单元推入到组件供给单元中，可以将部件供给单元定位在两个不同的方向单向

82. 发明授权

US07065866B2 Component mounting method 失效
公开(公告)号：US07065866B2
公开(公告)日：2006-06-27
申请号：US09956793
申请日：2001-09-21
申请人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
发明人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

83. 发明授权

US07017261B2 Component suction device, component mounting apparatus and component mounting method 失效
标题翻译：部件抽吸装置，部件安装装置和部件安装方法
公开(公告)号：US07017261B2
公开(公告)日：2006-03-28
申请号：US10130118
申请日：2001-09-18
申请人： Kenji Okamoto , Akira Kabeshita , Hideo Sakon , Yoichi Makino , Ken Takano
发明人： Kenji Okamoto , Akira Kabeshita , Hideo Sakon , Yoichi Makino , Ken Takano
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0413 , H05K13/041 , H05K13/0452 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.
摘要翻译：一种部件吸引装置，包括用于吸附和保持部件的吸嘴，用于保持吸嘴并转动吸嘴的喷嘴旋转装置，以及位于喷嘴旋转装置上方的喷嘴上下装置，连接到吸嘴，用于沿着吸嘴的轴向上下移动吸嘴。

84. 发明授权

US06345728B1 Component feeding method and apparatus 有权
标题翻译：部件供给方法和装置
公开(公告)号：US06345728B1
公开(公告)日：2002-02-12
申请号：US09559279
申请日：2000-04-27
申请人： Satoshi Kawaguchi , Akira Kabeshita , Masato Tanino , Takao Kashiwazaki , Shuichi Kubota , Koji Okawa , Tadashi Endo
发明人： Satoshi Kawaguchi , Akira Kabeshita , Masato Tanino , Takao Kashiwazaki , Shuichi Kubota , Koji Okawa , Tadashi Endo
IPC分类号： B23Q700
CPC分类号： H05K13/043
摘要： A rotary device has thereinside a driving device as a driving source for rotating a rotary block and opening and closing a shutter, and also includes a rod for transmitting a driving force to the rotary block and the shutter, a lever and a shaft for directly transmitting the driving force to the shutter, a spring for delaying a timing to open the shutter after the rotary block rises, a spring receiver for receiving the spring, and a joint for connecting the rod with the rotary block.
摘要翻译：旋转装置具有驱动装置作为用于旋转旋转块的旋转驱动源和打开和关闭活门的驱动装置，还包括用于将驱动力传递到旋转块和活门的杆，用于直接传递的杆和杆向闸门的驱动力，用于在旋转块升高之后延迟打开闸门的定时的弹簧，用于接收弹簧的弹簧座，以及用于将杆与旋转块连接的接头。

85. 发明授权

US06340132B1 Electronic component feeding device 失效
标题翻译：电子元件供料装置
公开(公告)号：US06340132B1
公开(公告)日：2002-01-22
申请号：US09452524
申请日：1999-12-01
申请人： Koji Okawa , Takao Kashiwazaki , Shuichi Kubota , Tadashi Endo , Masato Tanino , Akira Kabeshita
发明人： Koji Okawa , Takao Kashiwazaki , Shuichi Kubota , Tadashi Endo , Masato Tanino , Akira Kabeshita
IPC分类号： B65H2300
CPC分类号： B65H23/02 , B65H16/02 , B65H2301/415185 , B65H2701/1942 , H05K13/02
摘要： In an electronic component feeding device which comprises a component carrier tape wound around a reel, on which electronic components are accommodated in cavities formed on a support tape whose surface is covered by a removable top tape, a reel guide is pivotally mounted, which has a U-shaped cross section that resembles a hook, an open end of the hooked part being formed at a fixed angle &thgr;, and which holds the reel when engaged with an outer peripheral edge of the reel.
摘要翻译：在电子部件供给装置中，包括卷绕在卷轴上的分量载带，电子部件容纳在其表面被可移除的顶部带子覆盖的支撑带上形成的空腔中，枢转地安装有卷轴引导件，其具有类似于钩的U形横截面，钩形部分的开口端以固定角度θ形成，并且当与卷轴的外周边缘接合时保持卷轴。

86. 发明授权

US06289256B1 Method and apparatus for mounting parts 失效
标题翻译：安装零件的方法和装置
公开(公告)号：US06289256B1
公开(公告)日：2001-09-11
申请号：US09008611
申请日：1998-01-15
申请人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
发明人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
IPC分类号： G06F1900
CPC分类号： G05B19/416 , G05B2219/43155 , G05B2219/45029 , Y10T29/53178
摘要： A control device controls to move a chucking mechanism part to a first stop height 451 at a first speed, then at a second speed lower than the first speed before the chucking mechanism part comes in touch with a part from the first stop height, and stop when the chucking mechanism part touches the part, thereby to hold the part. So, a shock to the part when the part is held is reduced in the constitution, and the apparatus becomes light-weight because of the elimination of a shock-absorbing mechanism, hence realizing high-speed mounting.
摘要翻译：控制装置控制将夹紧机构部件以第一速度移动到第一停止高度451，然后以比第一速度低的第二速度移动到夹紧机构部分与第一停止高度部分接触之前，并且停止当夹紧机构部分接触该部分时，从而保持该部分。因此，当部件保持时对部件的冲击减小，并且由于消除了减震机构而使设备变得轻巧，从而实现了高速安装。

87. 发明授权

US5462626A Method of bonding an external lead and a tool therefor 失效
标题翻译：接合外部引线及其工具的方法
公开(公告)号：US5462626A
公开(公告)日：1995-10-31
申请号：US98813
申请日：1993-07-29
申请人： Shinji Kanayama , Akira Kabeshita , Kenichi Nishino , Satoshi Ohnakada , Takahiko Murata , Kazuhiro Kimura , Kazuto Nishida
发明人： Shinji Kanayama , Akira Kabeshita , Kenichi Nishino , Satoshi Ohnakada , Takahiko Murata , Kazuhiro Kimura , Kazuto Nishida
IPC分类号： H05K3/34 , H05K3/36 , H05K13/04 , B32B31/00
CPC分类号： H05K3/363 , H05K13/0465 , H05K2201/0394 , H05K2201/064 , H05K2201/10681 , H05K2203/0195 , H05K2203/107 , H05K3/3421 , H05K3/3494
摘要： A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.
摘要翻译：一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触电极。激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分的外部引线和电极。

88. 发明授权

US5084959A Chip mounting apparatus 失效
标题翻译：芯片安装装置
公开(公告)号：US5084959A
公开(公告)日：1992-02-04
申请号：US582613
申请日：1990-09-14
申请人： Tateo Ando , Akira Kabeshita
发明人： Tateo Ando , Akira Kabeshita
IPC分类号： H01L21/68 , H05K13/04
CPC分类号： H05K13/0413 , H01L21/681 , Y10T29/49131 , Y10T29/49155 , Y10T29/53087 , Y10T29/53178
摘要： A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting head is for holding a chip to be mounted. A substrate holding member is for holding a chip mounting substrate and is disposed below the robot. A chip position recognizing camera is also disposed below the robot. The positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to the positional relationship between a chip mounting position of the chip mounting substrate and the chip position recognizing camera.
摘要翻译：芯片安装装置包括具有芯片安装头和位于机器人装置的上臂中的基板位置识别照相机的X-Y机器人。芯片安装头用于保持要安装的芯片。基板保持构件用于保持芯片安装基板并且设置在机器人下方。芯片位置识别摄像机也设置在机器人下方。芯片安装头与基板位置识别相机之间的位置关系等同于芯片安装基板的芯片安装位置与芯片位置识别相机之间的位置关系。

89. 发明授权

US5080036A Thick film drawing apparatus 失效
标题翻译：厚膜拉伸装置
公开(公告)号：US5080036A
公开(公告)日：1992-01-14
申请号：US498452
申请日：1990-03-20
申请人： Akira Kabeshita , Kazuhiro Mori
发明人： Akira Kabeshita , Kazuhiro Mori
IPC分类号： B05C13/02 , H05K3/12
CPC分类号： H05K3/1241 , B05C13/02 , H05K2203/0126
摘要： A thick film drawing apparatus includes a substrate holding member (50) for holding a substrate (a), moving coils (60) for holding the substrate holding member (50), a drawing head (20) having a nozzle (30) and a stylus (33) for emitting pastes for drawing on a surface of the substrate (a) moving thereon and pushing the substrate (a) downward, respectively, wherein in the drawing process the drawing head (20) is locked of up/down motions and the substrate holding member (50) is raised/lowered at substantially constant weaker force by the moving coils (60), and thereby a relative-moving response of the up/down directions of the nozzle (30) is improved and a contact force of the stylus (33) on the substrate (a) is kept under a predetermined constant value, therefore a thickness of thick film line (c) is kept uniform and circuit patterns are prevented from being flawed.
摘要翻译：厚膜拉伸装置包括用于保持基板（a）的基板保持部件（50），用于保持基板保持部件（50）的移动线圈（60），具有喷嘴（30）和用于发射用于在其上移动的基板（a）的表面上的用于绘制的浆料的触针（33），并且分别向下推动基板（a），其中在拉伸处理中，拉拔头（20）被锁定上下运动，通过运动线圈（60）以基本恒定的弱力使基板保持部件（50）升降，从而提高喷嘴（30）的上下方向的相对移动响应，基板（a）上的触针（33）保持在预定的常数值，因此厚膜线（c）的厚度保持均匀，并且防止电路图案的缺陷。

90. 发明授权

US4440355A Electronic component supply apparatus 失效
标题翻译：电子元件供应装置
公开(公告)号：US4440355A
公开(公告)日：1984-04-03
申请号：US351466
申请日：1982-02-23
申请人： Kazuhiro Mori , Yoshihiko Misawa , Eiji Itemadani , Akira Kabeshita
发明人： Kazuhiro Mori , Yoshihiko Misawa , Eiji Itemadani , Akira Kabeshita
IPC分类号： H05K13/02 , H05K13/00 , H05K13/04 , B65H75/02
CPC分类号： H05K13/0417 , Y10S156/922 , Y10S242/918 , Y10T156/11 , Y10T156/19
摘要： The disclosure is directed to an electronic component supply apparatus for use in an electronic component mounting arrangement, which employs an electronic component carrier tape. The apparatus is arranged to separate a covering tape from a tape base of the carrier tape only at a position directly below a vacuum chuck for picking up the component, while the covering tape is separated from the tape base so as to be wound up at a winding speed lower than an intermittent feeding speed of the carrier tape by a predetermined pitch.
摘要翻译：本公开涉及一种用于电子部件安装装置的电子部件供应装置，其使用电子部件载带。该设备被布置成仅将覆盖带与载带的带基分开，仅在真空卡盘的正下方的位置处，用于拾取部件，同时覆盖带与带基部分离，以便在一个卷绕速度低于载带的间歇进给速度预定间距。

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