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81. 发明授权

US4902732A Epoxy resin-based curable compositions 失效
标题翻译：环氧树脂基可固化组合物
公开(公告)号：US4902732A
公开(公告)日：1990-02-20
申请号：US928654
申请日：1986-11-05
申请人： Kunio Itoh , Sumiko Komiya , Toshio Shiobara , Kazutoshi Tomiyoshi , Yoshio Fujimura
发明人： Kunio Itoh , Sumiko Komiya , Toshio Shiobara , Kazutoshi Tomiyoshi , Yoshio Fujimura
IPC分类号： C08G77/42 , C08L63/00 , C08L83/10 , H01B3/36 , H01B3/40 , H01B3/46
CPC分类号： H01B3/46 , C08G77/42 , C08L63/00 , C08L83/10 , H01B3/36 , H01B3/40
摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.
摘要翻译：本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度。本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料，优选为不超过1000重量份的二氧化硅填料，例如石英粉末。

82. 发明授权

US08237189B2 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same 有权
标题翻译：可热固化的有机硅树脂 - 环氧树脂组合物，以及由其模制的预成型包装
公开(公告)号：US08237189B2
公开(公告)日：2012-08-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译：作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D）固化促进剂。该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

83. 发明授权

US08048969B2 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US08048969B2
公开(公告)日：2011-11-01
申请号：US11408955
申请日：2006-04-24
申请人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
发明人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
IPC分类号： C08F283/00 , B32B27/38 , C08G59/50
CPC分类号： C08G59/245 , C08G59/3218 , C08L63/00 , Y10T428/31511 , C08L2666/16 , C08L2666/22
摘要： An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
摘要翻译：一种环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双（2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D）磷氮烯化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

84. 发明申请

US20100104794A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：热固性环氧树脂组合物和半导体器件
公开(公告)号：US20100104794A1
公开(公告)日：2010-04-29
申请号：US11997831
申请日：2006-07-28
申请人： Takayuki Aoki , Toshio Shiobara
发明人： Takayuki Aoki , Toshio Shiobara
IPC分类号： B32B1/06 , C08L63/10 , C08G69/00 , C08G59/20
CPC分类号： C08G59/42 , C08G59/3245 , C08L63/00 , H01L23/293 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , Y10T428/239 , H01L2924/00014 , H01L2924/00
摘要： A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.
摘要翻译：一种热固性环氧树脂组合物，其特征在于，作为树脂成分含有将三嗪衍生物/环氧树脂与酸酐反应得到的固体成分与环氧基的量为0.6〜2.0当量的比例相对于酸酐基团。

85. 发明授权

US07244495B2 Dicing/die bonding adhesion tape 失效
标题翻译：切割/芯片粘合胶带
公开(公告)号：US07244495B2
公开(公告)日：2007-07-17
申请号：US10829150
申请日：2004-04-22
申请人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C09J7/02 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/31663 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
摘要翻译：切割/贴合粘合带包括基底，硅氧烷粘合剂层和粘合层。在硅胶粘合剂层和粘合层之间产生0.2-2.0N / 25mm的粘着强度。接合层由包含（A）聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂的粘合组合物形成。

86. 发明申请

US20060241250A1 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US20060241250A1
公开(公告)日：2006-10-26
申请号：US11408955
申请日：2006-04-24
申请人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
发明人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
IPC分类号： C08L63/00
CPC分类号： C08G59/245 , C08G59/3218 , C08L63/00 , Y10T428/31511 , C08L2666/16 , C08L2666/22
摘要： An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
摘要翻译：一种环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双（2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D）磷氮烯化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

87. 发明申请

US20060241215A1 Semiconductor encapsulating epoxy resin composition and semiconductor device 审中-公开
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US20060241215A1
公开(公告)日：2006-10-26
申请号：US11409099
申请日：2006-04-24
申请人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
发明人： Shoichi Osada , Yasuo Kimura , Eiichi Asano , Toshio Shiobara
IPC分类号： C08L63/00
CPC分类号： C08G59/245 , C08G59/621 , C08K3/22 , C08K3/26 , H01L23/293 , H01L23/295 , H01L2924/0002 , C08L63/00 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
摘要翻译：环氧树脂组合物，其包含（A）萘型环氧树脂，其中35-85重量份的1,1-双（2-缩水甘油氧基-1-萘基）烷烃和1-35重量份的1,1-双（2,7-二缩水甘油氧基-1-萘基）烷烃包括每100重量份的树脂，（B）萘型酚醛树脂形式的固化剂，（C）无机填料，（D）稀土氧化物或水滑石化合物最适合于半导体封装，因为它具有良好的流动性，低的线膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂性。

88. 发明申请

US20060216519A1 Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
标题翻译：半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US20060216519A1
公开(公告)日：2006-09-28
申请号：US11386667
申请日：2006-03-23
申请人： Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
发明人： Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
IPC分类号： B32B27/38 , H01L21/56 , C08L63/00 , C08G59/00
CPC分类号： H01L23/293 , C08G59/245 , C08G59/3218 , C08G59/621 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
摘要： An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
摘要翻译：一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B）在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

89. 发明申请

US20050261456A1 Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer 有权
标题翻译：部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物
公开(公告)号：US20050261456A1
公开(公告)日：2005-11-24
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08L63/00 , C08G59/62 , C08G73/10 , C08G77/04 , C08G77/455 , C08L79/08
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译：提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y 1是二胺残基 Y 2是二氨基硅氧烷残基，共聚物中的Y 1 Y 2和Y 2 2的含量为99-20摩尔％，1- 80mol％，L和m分别为2-50的整数。共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

90. 发明授权

US06949619B2 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition 有权
标题翻译：含酚羟基的聚酰亚胺树脂，制作方法和聚酰亚胺树脂组合物
公开(公告)号：US06949619B2
公开(公告)日：2005-09-27
申请号：US10621527
申请日：2003-07-18
申请人： Nobuhiro Ichiroku , Masachika Yoshino , Hideki Akiba , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Masachika Yoshino , Hideki Akiba , Toshio Shiobara
IPC分类号： C08G59/62 , C08G73/10 , C08G77/455 , C08L63/00 , C08L79/08 , B32B27/28 , C08L77/00
CPC分类号： C08G77/455 , C08G73/10 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08L63/00 , C08L79/08 , H05K2201/0154 , H05K2203/065 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , C08L2666/22
摘要： A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
摘要翻译：在其骨架中具有酚羟基自由基的聚酰亚胺树脂使用具有与其连接的氨基的芳香族的芳族二胺和具有酚羟基的另一芳香环来制备。聚酰亚胺树脂和包含聚酰亚胺树脂，环氧树脂和固化剂的组合物适合用作需要粘合和耐热性的清漆，粘合剂和粘合剂膜。

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