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81. 发明申请

US20090129786A1 COUPLING OF OPTICAL INTERCONNECT WITH ELECTRICAL DEVICE 有权
标题翻译：光电互连与电气设备的耦合
公开(公告)号：US20090129786A1
公开(公告)日：2009-05-21
申请号：US12345487
申请日：2008-12-29
申请人： Peter Deane
发明人： Peter Deane
IPC分类号： H04B10/00 , G02B6/12
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K1/0393
摘要： One embodiment of the present invention includes a flexible interconnect assembly that can convert between optical and electrical signals and that is configured to be easily secured to an electrical device, such as a printed circuit board or integrated circuit chip. The flexible interconnect assembly includes a flexible substrate and one or more optical waveguides that are mounted on the flexible interconnect and suitable for transmitting optical signals. One or more conversion devices for converting between electrical and optical signals are arranged on the flexible substrate. The flexible interconnect assembly optionally includes an attachment fixture that enables the flexible substrate to be reversibly coupled to an attachment apparatus. Particular embodiments of the present invention involve methods, devices and systems for using a flexible interconnect assembly with one or more electronic substrates configured with an attachment apparatus.
摘要翻译：本发明的一个实施例包括柔性互连组件，其可以在光学和电信号之间转换，并且被配置为容易地固定到诸如印刷电路板或集成电路芯片的电气装置。柔性互连组件包括柔性基板和安装在柔性互连上并适于传输光信号的一个或多个光波导。用于在电信号和光信号之间转换的一个或多个转换装置布置在柔性基板上。柔性互连组件可选地包括使得柔性基板能够可逆地耦合到附接装置的附接固定件。本发明的具体实施例涉及使用具有配置有附接装置的一个或多个电子基板的柔性互连组件的方法，装置和系统。

82. 发明授权

US06843606B2 Multi-format connector module incorporating chip mounted optical sub-assembly 有权
标题翻译：多格式连接器模块结合了芯片安装的光学子组件
公开(公告)号：US06843606B2
公开(公告)日：2005-01-18
申请号：US10392802
申请日：2003-03-19
申请人： Peter Deane , Euan P. Livingston
发明人： Peter Deane , Euan P. Livingston
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/4281 , G02B6/4284
摘要： Embodiments of the invention include an optical connector module (OCM) electrically and optically connecting an integrated opto-electric assembly to standard format electrical and optical connectors. The OCM includes a module body that houses an integrated opto-electric assembly and provides electrical and optical connection to existing formats. The integrated opto-electric assembly comprising an optical sub-assembly (OSA) and chip sub-assembly (CSA) that are electrically connected to each other and configured as a single opto-electric component. The OCM includes an optical interface suitable for receiving an optical ferrule and configured to enable optical communication between optical fibers of the ferrule and the OSA. Additionally, the OCM includes an electrical interface suitable for electrically connecting the CSA to a standard format electrical connector. The OCM is configured such that it is compatible with optical ferrule formats and electrically compatible with electrical formats. The embodiments of the invention further include methods for electrically and optically interconnecting an integrated opto-electric assembly with standard format optical and electrical connectors.
摘要翻译：本发明的实施例包括光学连接器模块（OCM），电学和光学连接集成光电组件到标准格式的电和光连接器。 OCM包括一个模块体，其中集成了一个集成的光电组件，并提供与现有格式的电气和光学连接。集成的光电组件包括彼此电连接并且被配置为单个光电部件的光学子组件（OSA）和芯片子组件（CSA）。 OCM包括适于接收光学套圈并被配置为使得能够使套圈的光纤与OSA之间的光纤通信的光学接口。此外，OCM包括适于将CSA电连接到标准格式电连接器的电接口。 OCM配置为与光学套圈格式兼容，并与电气格式电气兼容。本发明的实施例还包括用于将集成的光电组件与标准格式的光电连接器电连接和光学互连的方法。

83. 发明授权

US06802653B2 Method and apparatus for adapting a miniature form-factor connector to a standard format fiber optic connector plug 有权
标题翻译：用于将微型形状连接器适配成标准格式光纤连接器插头的方法和装置
公开(公告)号：US06802653B2
公开(公告)日：2004-10-12
申请号：US10041805
申请日：2002-01-07
申请人： Peter Deane
发明人： Peter Deane
IPC分类号： G02B636
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B2006/4297
摘要： Embodiments of the invention include a method and adaptor apparatus for optically connecting optical fibers of a standard ferrule based parallel multi-mode fiber format plug with photonic devices of a connector sleeve arranged in accordance with a miniature form factor format. The adaptor includes an adaptor jacket having a first end that is optically connected to a second end. The first end is configured to receive a connector plug having optical fibers arranged in a standard ferrule based parallel multi-mode fiber format. The second end is formatted for connection with a miniature form factor connector sleeve having an optical subassembly fitted thereon. Thus, the photonic devices of an optical subassembly arranged in the miniature form factor format can be optically coupled, via the adaptor jacket, to corresponding optical fibers of the connector plug arranged in a standard ferrule based parallel multi-mode fiber format.
摘要翻译：本发明的实施例包括一种用于光学地连接基于标准套圈的并行多模光纤格式插头的光纤的方法和适配器装置，其具有根据微型形状因子格式布置的连接器套筒的光子器件。适配器包括具有光学连接到第二端的第一端的适配器护套。第一端被配置为接收具有以基于标准套圈的并行多模光纤格式布置的光纤的连接器插头。第二端被格式化为与安装在其上的光学子组件的微型形状因子连接器套管连接。因此，以微型形状因子格式布置的光学子组件的光子器件可以经由适配器套管光学耦合到以标准基于套圈的并行多模光纤格式布置的连接器插头的相应光纤。

84. 发明授权

US06364542B1 Device and method for providing a true semiconductor die to external fiber optic cable connection 有权
标题翻译：用于向外部光纤电缆连接提供真正的半导体管芯的装置和方法
公开(公告)号：US06364542B1
公开(公告)日：2002-04-02
申请号：US09568094
申请日：2000-05-09
申请人： Peter Deane , Chen-Hui Tsay , Cade Murray , Luu Nguyen
发明人： Peter Deane , Chen-Hui Tsay , Cade Murray , Luu Nguyen
IPC分类号： G02B636
CPC分类号： G02B6/4201 , G02B6/4214 , G02B6/4246
摘要： A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.
摘要翻译：一种低成本的器件，为外部光纤连接提供真正的裸片。该器件包括具有第一表面的半导体管芯，在半导体管芯的第一表面上制造的集成电路和封装半导体管芯的封装。该装置还包括安装到包装上并被配置为接收外部光纤电缆的模块。当电缆插入模块时，容纳在模块中的光电装置光耦合到光纤电缆。为了将直接管芯提供到外部光纤连接，在通过封装和模块制造的半导体管芯的集成电路之间提供至少一个电导体，并直接连接到光电器件。

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