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    • 82. 发明授权
    • Method of forming an adhesive bond
    • 形成粘结剂的方法
    • US08747606B2
    • 2014-06-10
    • US13076921
    • 2011-03-31
    • Tao XieHamid G. KiaWilliam R. RodgersMan ZhangChen-Shih Wang
    • Tao XieHamid G. KiaWilliam R. RodgersMan ZhangChen-Shih Wang
    • B32B37/00B29C65/00
    • C09J123/0853B32B7/12B32B27/18B32B2262/101C09J5/06C09J175/04C09J2423/04C09J2429/00C09J2431/00
    • A method of forming an adhesive bond between a first substrate and a second substrate includes applying a semi-crystalline polymeric adhesive composition to a bonding area of the first substrate, and, after applying, disposing the second substrate adjacent to and in contact with the composition to form a workpiece. After disposing, the method includes heating the workpiece to cure the composition and thereby form a crosslinked polymeric adhesive material. After heating, the method includes cooling the workpiece such that the material has a crystalline molecular structure. Concurrent to cooling, the method includes imposing a stress on the material to thereby orient the crystalline molecular structure in a desired direction, and, after imposing, dissipating the stress along the crystalline molecular structure in the desired direction to thereby form the adhesive bond between the first substrate and the second substrate.
    • 在第一基板和第二基板之间形成粘合剂粘合的方法包括将半结晶聚合物粘合剂组合物施加到第一基底的粘合区域,并且在施加之后,将第二基底与组合物相邻并且与组合物接触 以形成工件。 在处理之后,该方法包括加热工件以固化组合物,从而形成交联的聚合物粘合剂材料。 加热后,该方法包括冷却工件使得该材料具有结晶分子结构。 与冷却同时,该方法包括对材料施加应力,从而将结晶分子结构定向在期望的方向,并且在施加之后沿着所需方向沿着结晶分子结构消散应力,从而形成在 第一衬底和第二衬底。