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    • 81. 发明申请
    • SURFACE TREATMENT METHOD OF ALUMINUM EXTRUDING DIE, AND ALUMINUM EXTRUDING DIE
    • 铝挤压模具的表面处理方法和铝挤压模具
    • US20090047528A1
    • 2009-02-19
    • US11997213
    • 2006-07-28
    • Teruo TachiKoichi Tanaka
    • Teruo TachiKoichi Tanaka
    • B32B15/04C23C16/22
    • C23C8/02B21C25/025C23C8/26C23C8/34Y10T428/31678
    • A surface treatment method of an aluminum extruding die having wear resistance and separation resistance is provided. The surface treatment method of an aluminum extruding die includes a first nitriding treatment step for forming a diffusion hardened layer 6 containing carbon and nitrogen at a surface layer portion of a die main body 5 by heating and retaining the die main body 5 made of tool steel in a nitriding gas atmosphere containing carburizing gas, and a second nitriding treatment step for forming a compound layer 7 substantially not containing carbon on a surface of the diffusion hardened layer 6 by heating and retaining the die main body 5 to which the first nitriding treatment was executed in a nitriding gas atmosphere not containing carburizing gas.
    • 提供了具有耐磨性和耐分离性的铝挤压模具的表面处理方法。 铝挤压模具的表面处理方法包括:第一氮化处理步骤,通过加热并保持由工具钢制成的模具主体5,在模具主体5的表层部分形成含有碳和氮的扩散硬化层6 在含有渗碳气体的氮化气体气氛中进行第二氮化处理工序,以及第二氮化处理工序,通过加热保持第一氮化处理为原样的模具主体5,在扩散硬化层6的表面上形成基本不含碳的化合物层7 在不含渗碳气体的氮化气体气氛中执行。
    • 82. 发明申请
    • Method for manufacturing SOI wafer
    • 制造SOI晶圆的方法
    • US20080299742A1
    • 2008-12-04
    • US12153519
    • 2008-05-20
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • H01L21/86
    • H01L21/76254H01L21/3065H01L22/12H01L22/20H01L2924/014
    • There is disclosed a method for manufacturing an SOI wafer comprising: a step of implanting at least one of a hydrogen ion and a rare gas ion into a donor wafer to form an ion implanted layer; a step of bonding an ion implanted surface of the donor wafer to a handle wafer; a step of delaminating the donor wafer at the ion implanted layer to reduce a film thickness of the donor wafer, thereby providing an SOI layer; and a step of etching the SOI layer to reduce a thickness of the SOI layer, wherein the etching step includes: a stage of performing rough etching as wet etching; a stage of measuring a film thickness distribution of the SOI layer after the rough etching; and a stage of performing precise etching as dry etching based on the measured film thickness distribution of the SOI layer. There can be provided A method for manufacturing an SOI wafer having high film thickness uniformity of an SOI layer with excellent productivity.
    • 公开了一种用于制造SOI晶片的方法,包括:将氢离子和稀有气体离子中的至少一种注入施主晶片以形成离子注入层的步骤; 将施主晶片的离子注入表面接合到处理晶片的步骤; 在离子注入层分层施主晶片以降低施主晶片的膜厚,从而提供SOI层的步骤; 以及蚀刻所述SOI层以减小所述SOI层的厚度的步骤,其中所述蚀刻步骤包括:执行粗蚀刻的阶段,如湿蚀刻; 在粗蚀刻之后测量SOI层的膜厚分布的阶段; 以及基于所测量的SOI层的膜厚分布,进行干蚀刻的精确蚀刻的阶段。 可以提供一种以优异的生产率制造具有SOI层的高膜厚均匀性的SOI晶片的方法。
    • 83. 发明申请
    • Method for manufacturing semiconductor substrate
    • 半导体衬底的制造方法
    • US20080194078A1
    • 2008-08-14
    • US12010711
    • 2008-01-29
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • H01L21/20
    • H01L21/76254H01L21/02381H01L21/0245H01L21/02532H01L21/0262
    • To obtain a semiconductor substrate having a high-quality Ge-based epitaxial film in a large area, a SiGe mixed crystal buffer layer and a Ge epitaxial film is grown on a main surface of a Si substrate 10. Although high-density defects are introduced in the Ge epitaxial film 11 from an interface between the Ge epitaxial film 11 and the Si substrate 10, the Ge epitaxial film is subjected to a heat treatment at a temperature of not less than 700° C. and not more than 900° C. to cause threading dislocations 12 to change into dislocation-loop defects 12′ near the interface between the Ge epitaxial film 11 and the Si substrate. A main surface of at least one of the Ge epitaxial film 11 with an ion implanted layer and a support substrate 20 is then subjected to a plasma treatment or ozone treatment for the purpose of surface cleaning, surface activation, and the like, after which the main surfaces of the Ge epitaxial film 11 and the support substrate 20 are appressed against and bonded to each other with their surfaces being determined as the joint surfaces. An external impact is then applied to the bonding interface, causing the Ge epitaxial film to be delaminated along a hydrogen ion implanted interface 13, thus obtaining a Ge thin film 14. A surface of the Ge thin film 14 is subsequently subjected to a final surface treatment (for example, CMP) to remove the damage caused by the hydrogen ion implantation, thus resulting in a GeOI substrate having the Ge thin film 14 on the surface thereof.
    • 为了获得大面积地具有高质量Ge基外延膜的半导体衬底,在Si衬底10的主表面上生长SiGe混晶缓冲层和Ge外延膜。 虽然在Ge外延膜11和Si衬底10之间的界面上在Ge外延膜11中引入高密度缺陷,但Ge外延膜在不低于700℃的温度下进行热处理, 不超过900℃导致穿透位错12变为位于Ge外延膜11和Si衬底之间的界面附近的位错环缺陷12'。 为了表面清洁,表面活化等目的,对具有离子注入层的Ge外延膜11和支撑基板20中的至少一个的主表面进行等离子体处理或臭氧处理,之后, Ge外延膜11和支撑基板20的主表面以其表面被确定为接合表面而相互贴合并彼此结合。 然后对接合界面施加外部冲击,使得Ge外延膜沿着氢离子注入界面13分层,从而获得Ge薄膜14。 随后,对Ge薄膜14的表面进行最终表面处理(例如CMP),以消除由氢离子注入引起的损伤,从而得到其表面上具有Ge薄膜14的GeOI基板。
    • 85. 发明申请
    • SOQ substrate and method of manufacturing SOQ substrate
    • SOQ基板和制造SOQ基板的方法
    • US20080119028A1
    • 2008-05-22
    • US11984184
    • 2007-11-14
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • Shoji AkiyamaYoshihiro KubotaAtsuo ItoKoichi TanakaMakoto KawaiYuuji Tobisaka
    • H01L21/30
    • H01L21/3247H01L21/76254H01L29/78603
    • To lower a process temperature for an SOQ substrate manufacturing process to reduce the degree of surface roughness of an SOQ film and provide a high-quality SOQ substrate.Hydrogen ions are implanted to a surface of a single crystal Si substrate 10 through an oxide film 11 to uniformly form an ion implanted layer 12 at a predetermined depth (average ion implantation depth L) from the surface of the single crystal Si substrate 10, and a bonding surface of the substrate undergoes a plasma treatment or an ozone treatment. An external shock is applied onto the single crystal Si substrate 10 and quartz substrate 20, which are bonded together, to mechanically delaminate a silicon film 13 from a single crystal silicon bulk 14. In this way, the SOQ film 13 is formed on the quartz substrate 20 through the oxide film 11. To further smooth the SOQ film surface, hydrogen heat treatment is performed at a temperature of 1000° C. or less below a quartz glass transition point. When measuring surface roughness of an SOQ film after performing hydrogen heat treatment on a sample having surface roughness of about 5 nm in terms of RMS average value immediately after delamination, a satisfactory measurement result of 0.3 nm or less in terms of RMS average value was obtained.
    • 为了降低SOQ基板制造工艺的工艺温度以降低SOQ膜的表面粗糙度并提供高质量的SOQ基板。 通过氧化膜11将氢离子注入到单晶Si衬底10的表面,以从单晶硅衬底10的表面以预定深度(平均离子注入深度L)均匀地形成离子注入层12,以及 基板的接合面进行等离子体处理或臭氧处理。 对结合在一起的单晶Si衬底10和石英衬底20施加外部冲击,从而将硅膜13与单晶硅体14机械地分层。这样,SOQ膜13形成在石英 基板20通过氧化膜11.为了进一步平滑SOQ膜表面,在石英玻璃化转变点以下1000℃以下的温度下进行氢热处理。 在对分层后的RMS平均值的表面粗糙度约为5nm的样品进行氢热处理后,测定SOQ膜的表面粗糙度,得到满意的平均值为0.3nm以下的测定结果 。
    • 86. 发明申请
    • Method for producing single crystal silicon solar cell and single crystal silicon solar cell
    • 单晶硅太阳能电池和单晶硅太阳能电池的制造方法
    • US20080099065A1
    • 2008-05-01
    • US11907902
    • 2007-10-18
    • Atsuo ItoShoji AkiyamaMakoto KawaiKoichi TanakaYuuji TobisakaYoshihiro Kubota
    • Atsuo ItoShoji AkiyamaMakoto KawaiKoichi TanakaYuuji TobisakaYoshihiro Kubota
    • H01L31/04B29C65/00
    • H01L31/1804H01L31/1896Y02B10/10Y02E10/547Y02P70/521
    • There is disclosed a method for producing a single crystal silicon solar cell comprising the steps of: implanting hydrogen ions or rare gas ions into a single crystal silicon substrate through an ion implanting surface thereof to form an ion implanted layer in the single crystal silicon substrate; forming a transparent electroconductive film on a surface of a transparent insulator substrate; conducting a surface activating treatment for the ion implanting surface of the single crystal silicon substrate and/or a surface of the transparent electroconductive film on the transparent insulator substrate; bonding the ion implanting surface of the single crystal silicon substrate and the surface of the transparent electroconductive film on the transparent insulator substrate to each other; applying an impact to the ion implanted layer to mechanically delaminate the single crystal silicon substrate thereat to leave a single crystal silicon layer; and forming a p-n junction in the single crystal silicon layer. There can be provided a single crystal silicon solar cell where a light conversion layer is provided as a thin-film for effective utilization of silicon as a starting material of the silicon solar cell, which single crystal silicon solar cell is excellent in conversion characteristics and is less in degradation due to light irradiation, and which single crystal silicon solar cell is provided as a see-through type solar cell that is usable as a natural lighting window material of a house or the like.
    • 公开了一种用于制造单晶硅太阳能电池的方法,包括以下步骤:通过其离子注入表面将氢离子或稀有气体离子注入到单晶硅衬底中,以在单晶硅衬底中形成离子注入层; 在透明绝缘体基板的表面上形成透明导电膜; 对透明绝缘体基板上的单晶硅衬底的离子注入表面和/或透明导电膜的表面进行表面激活处理; 将透明绝缘体基板上的单晶硅衬底的离子注入表面和透明导电膜的表面彼此接合; 对离子注入层施加冲击以在其上机械分层单晶硅衬底以留下单晶硅层; 并在单晶硅层中形成p-n结。 可以提供一种单晶硅太阳能电池,其中提供光转换层作为有效利用硅作为硅太阳能电池的起始材料的薄膜,该单晶硅太阳能电池的转换特性优异,并且是 由于光照射而导致的劣化较少,并且提供单晶硅太阳能电池作为可用作房屋等的自然采光窗材料的透明型太阳能电池。
    • 90. 发明申请
    • Image forming apparatus and printing control method therefor
    • 图像形成装置及其印刷控制方法
    • US20060210297A1
    • 2006-09-21
    • US11374005
    • 2006-03-14
    • Koichi Tanaka
    • Koichi Tanaka
    • G03G15/00
    • G03G15/232G03G15/502G03G15/5087G03G15/6514G03G2215/00109G03G2215/00725
    • The present invention is an image forming apparatus having no two-sided printing mechanism in which, by setting a front side printed paper sheet in a manual paper feed section, the paper sheet is taken from the manual paper feed section and a back side printing is executed. At this moment, when a paper detecting switch 24 detects presence of a paper sheet on a manual paper feed tray 23 at the end of the front side printing, a message meaning to remove the paper sheet and thereafter to set the front side printed paper sheet is given. Whether the paper sheet is removed or not is detected according to a change-over of the paper detecting switch 24, and the back side printing is executed after the paper sheet is removed and the front side printed paper sheet is set. As a result, erroneous back side printing on an improper paper sheet can be prevented and a two-sided printing can be correctly executed.
    • 本发明是一种没有双面打印机构的图像形成装置,其中通过将手动进纸部分中的正面打印纸张设置为从手动进纸部分取出纸张,并且背面打印为 执行。 此时,当纸张检测开关24在正面打印结束时检测到手纸进纸托盘23上的纸张的存在时,消除了用于取出纸张的消息,此后设置正面打印纸张 给出。 根据纸张检测开关24的转换来检测纸张是否被去除,并且在纸张被移除并且正面打印纸张被设置之后执行背面打印。 结果,可以防止在不适当的纸张上的错误的背面打印,并且可以正确地执行双面打印。