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81. 发明授权

US08600182B2 Method and apparatus for compression of image data based on display parameters 有权
标题翻译：基于显示参数压缩图像数据的方法和装置
公开(公告)号：US08600182B2
公开(公告)日：2013-12-03
申请号：US13402309
申请日：2012-02-22
申请人： Tsuneo Hayashi , Shinji Watanabe , Masahito Yamane , Takeshi Uemori
发明人： Tsuneo Hayashi , Shinji Watanabe , Masahito Yamane , Takeshi Uemori
IPC分类号： G06T7/00 , G06T9/00
CPC分类号： H04N19/44 , H04N19/167 , H04N19/46
摘要： An information processing apparatus includes a display time acquiring unit that acquires a display time for each predetermined unit region of an image and a compression control unit that controls compression of the image for each unit region based on the display time.
摘要翻译：信息处理装置包括显示时间获取单元，其基于显示时间获取图像的每个预定单位区域的显示时间和控制每个单位区域的图像的压缩的压缩控制单元。

82. 发明授权

US08584649B2 Engine control apparatus 失效
标题翻译：发动机控制装置
公开(公告)号：US08584649B2
公开(公告)日：2013-11-19
申请号：US13179238
申请日：2011-07-08
申请人： Shinji Watanabe
发明人： Shinji Watanabe
IPC分类号： F02D41/08
CPC分类号： F02D29/02 , F02D9/02 , F02D11/106 , F02D41/0002 , F02D41/042 , F02D41/062 , F02D41/1401 , F02D2041/1422 , F02D2200/021 , F02D2200/501 , F02N11/0818 , Y02T10/42
摘要： An engine control apparatus includes an ISS control unit provided with an ISS determination unit for inputting at least an engine cooling water temperature, vehicle speed, and brake information, and target opening setting unit for setting a target opening in an idle stop/start control period. A throttle control unit is provided with a proportional gain correction coefficient operator for correcting a proportional gain to a value that is larger than a proportional gain outside the idle stop/start control period, a throttle opening feedback controller for performing throttle opening feedback control based on an opening deviation between a target opening and an actual opening, and a PWM driver outputting a voltage proportional to the operation amount, to a motor.
摘要翻译：发动机控制装置包括ISS控制单元，该ISS控制单元设置有用于至少输入发动机冷却水温度，车速和制动信息的ISS确定单元和用于在怠速停止/起动控制周期内设定目标开度的目标开度设定单元。节气门控制单元设置有比例增益校正系数运算器，用于将比例增益校正为大于怠速停止/开始控制周期之外的比例增益的值;节气门开度反馈控制器，用于基于目标开度和实际开度之间的开度偏差，以及输出与操作量成比例的电压的PWM驱动器。

83. 发明申请

US20130285476A1 POWER SUPPLY DEVICE, INVERTER DEVICE, POWER TOOL 审中-公开
标题翻译：电源装置，逆变器装置，电动工具
公开(公告)号：US20130285476A1
公开(公告)日：2013-10-31
申请号：US13978572
申请日：2012-01-16
申请人： Yasushi Nakano , Kazuhiko Funabashi , Yoshikazu Kawano , Shinji Watanabe , Miyoji Onose , Haruhisa Fujisawa
发明人： Yasushi Nakano , Kazuhiko Funabashi , Yoshikazu Kawano , Shinji Watanabe , Miyoji Onose , Haruhisa Fujisawa
IPC分类号： H02M7/44
CPC分类号： H02M7/44 , H02J7/0065
摘要： A power supply device includes: a battery pack; a transforming unit configured to transform a DC voltage supplied from the battery pack; and a control unit configured to determine, based on a characteristic of the battery pack, whether or not the converting unit performs an outputting operation.
摘要翻译：电源装置包括：电池组; 变换单元，被配置为变换从所述电池组提供的直流电压; 以及控制单元，被配置为基于所述电池组的特性来确定所述转换单元是否执行输出操作。

84. 发明申请

US20130237664A1 URETHANE RESIN PARTICLES 有权
标题翻译： URETHANE树脂颗粒
公开(公告)号：US20130237664A1
公开(公告)日：2013-09-12
申请号：US13884771
申请日：2011-11-09
申请人： Shinji Watanabe , Yasuhiro Tsudo , Masaki Inaba , Jun Takeuchi , Yuko Matsumoto
发明人： Shinji Watanabe , Yasuhiro Tsudo , Masaki Inaba , Jun Takeuchi , Yuko Matsumoto
IPC分类号： C08G18/83 , C08K5/04 , C08L75/12
CPC分类号： C08G18/831 , B29C41/003 , B29C41/18 , B29K2075/00 , C08G18/12 , C08G18/2815 , C08G18/2825 , C08G18/3215 , C08G18/345 , C08G18/346 , C08G18/42 , C08G18/4202 , C08G18/4208 , C08G18/6659 , C08G18/73 , C08G18/8064 , C08G2140/00 , C08K5/04 , C08K5/092 , C08K5/103 , C08L75/12 , C08L75/06
摘要： Provided is a slush molding material which exhibits excellent low-temperature meltability and heat resistance and which can yield a molded product having excellent tensile strength and elongation. The present invention is urethane resin particles (D1) comprising a urethane or urethane-urea resin (U1) that has residues (j) bonded thereto covalently, said residues (j) being residues derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, or urethane resin particles (D2) comprising a urethane resin composition (S2) which comprises both a urethane or urethane-urea resin (U2) and a compound (E) that has a residue (j) derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, said compound (E) being represented by general formula (1), wherein the residues (j) are linked respectively to urethane or urea groups (u) of the resin (U1) or (U2) by hydrogen bonds.
摘要翻译：提供一种具有优异的低温熔融性和耐热性的搪塑成型材料，并且可以得到具有优异的拉伸强度和伸长率的成型体。本发明是包含具有共价键合的残基（j）的氨基甲酸酯或氨基甲酸酯 - 尿素树脂（U1）的聚氨酯树脂颗粒（D1），所述残基（j）是通过除去羟基从至少三价芳族多元羧酸衍生的残基基团或聚氨酯树脂颗粒（D2），其包含氨基甲酸酯或氨基甲酸酯 - 脲树脂（U2）和具有衍生自至少三价芳族化合物的残基（j）的化合物（E）的聚氨酯树脂组合物（S2）通过除去羟基的多元羧酸，所述化合物（E）由通式（1）表示，其中残基（j）分别通过氢气与树脂（U1）或（U2）的氨基甲酸酯基或脲基（u）连接债券。

85. 发明申请

US20130105957A1 LEAD FRAME SEMICONDUCTOR DEVICE 有权
标题翻译：引线框架半导体器件
公开(公告)号：US20130105957A1
公开(公告)日：2013-05-02
申请号：US13659557
申请日：2012-10-24
申请人： Shinji Watanabe , Akihisa Eimori
发明人： Shinji Watanabe , Akihisa Eimori
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , H01L21/561 , H01L23/3107 , H01L23/49548 , H01L23/49551 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/92247 , H01L2224/97 , H01L2924/13091 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
摘要翻译：引线框架包括：设置在前表面上的芯片安装区域; 引线区域，包括沿芯片安装区域的面内方向布置的多个凹凸部分; 以及布置在所述凹部中的端子。前表面的引线区域的厚度小于端子从前表面的厚度。

86. 发明授权

US08399574B2 Resin powder composition for slush molding and molded articles 有权
标题翻译：用于搪塑的树脂粉末组合物和模塑制品
公开(公告)号：US08399574B2
公开(公告)日：2013-03-19
申请号：US12529274
申请日：2007-12-03
申请人： Shinya Fujibayashi , Shinji Watanabe , Chikara Ohto , Shuji Nakagawa , Ikuo Takahashi , Shigekazu Suzuki
发明人： Shinya Fujibayashi , Shinji Watanabe , Chikara Ohto , Shuji Nakagawa , Ikuo Takahashi , Shigekazu Suzuki
IPC分类号： C08G18/02 , C08G18/09 , C08G18/10 , C08G18/48
CPC分类号： B29C41/18 , B60R13/02 , B60R13/0892 , C08G18/12 , C08G18/2825 , C08G18/4202 , C08G18/797 , C08G2140/00 , C08L75/04 , C08L79/00 , C08L2666/20 , C08G18/3256
摘要： The present invention provides a resin powder composition for slush molding which can give slush molded articles with more excellent hydrolysis resistance. The present invention relates to a resin powder composition for slush molding which is characterized by comprising as the main component a thermoplastic polyurethane resin powder, preferably a thermoplastic polyurethane elastomer powder, and containing a polycarbodiimide prepared by polymerizing tetramethylxylylene diisocyanate, alkoxy terminated one having a number average molecular weight of 500 to 30,000.
摘要翻译：本发明提供了一种用于搪塑的树脂粉末组合物，其可以提供具有更优异的耐水解性的搪塑制品。本发明涉及一种用于搪塑的树脂粉末组合物，其特征在于，以热塑性聚氨酯树脂粉末为主要成分，优选热塑性聚氨酯弹性体粉末，并含有通过聚合四甲基亚二甲苯基二异氰酸酯制备的聚碳化二亚胺，平均分子量为500〜30,000。

87. 发明授权

US08304905B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08304905B2
公开(公告)日：2012-11-06
申请号：US13192049
申请日：2011-07-27
申请人： Satoshi Matsui , Tsuyoshi Eda , Akira Matsumoto , Yoshitaka Kyougoku , Shinji Watanabe , Hirokazu Honda
发明人： Satoshi Matsui , Tsuyoshi Eda , Akira Matsumoto , Yoshitaka Kyougoku , Shinji Watanabe , Hirokazu Honda
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03462 , H01L2224/0401 , H01L2224/05567 , H01L2224/05647 , H01L2224/11462 , H01L2224/11622 , H01L2224/11849 , H01L2224/13007 , H01L2224/13022 , H01L2224/13147 , H01L2224/1354 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2224/05552
摘要： A semiconductor device includes a semiconductor chip, wiring formed thereon, a first insulating film formed on the wiring, provided with a first opening, a pad electrode formed so as to be in contact with the wiring, a second insulating film formed on the pad electrode film, provided with a second opening, and a flip chip bump formed so as to be in contact with the pad electrode film. In this case, the second insulating film exists between the flip chip bump and the pad electrode film, in a region directly underneath the outer edge of the flip chip bump, as seen in a plan view, and the outer edge of the flip chip bump is formed in a region inside the outer edge of the pad electrode film.
摘要翻译：半导体器件包括半导体芯片，形成在其上的布线，形成在布线上的第一绝缘膜，设置有第一开口，形成为与布线接触的焊盘电极，形成在焊盘电极上的第二绝缘膜具有第二开口的膜，以及形成为与焊盘电极膜接触的倒装芯片凸块。在这种情况下，如俯视图所示，第二绝缘膜存在于倒装芯片凸块和焊盘电极膜之间的直接在倒装芯片凸块的外边缘下方的区域中，并且倒装芯片凸块的外边缘形成在焊盘电极膜的外边缘内的区域中。

88. 发明授权

US08144482B2 Circuit board device, wiring board interconnection method, and circuit board module device 有权
标题翻译：电路板装置，接线板互连方式及电路板模块装置
公开(公告)号：US08144482B2
公开(公告)日：2012-03-27
申请号：US12227803
申请日：2007-05-14
申请人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126
摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
摘要翻译：电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起和 106）电连接。

89. 发明授权

US08119918B2 Printed circuit board and semiconductor package 失效
标题翻译：印刷电路板和半导体封装
公开(公告)号：US08119918B2
公开(公告)日：2012-02-21
申请号：US12066474
申请日：2006-09-01
申请人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
发明人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
IPC分类号： H05K1/11
CPC分类号： H01L23/49827 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H05K1/0271 , H05K1/115 , H05K3/108 , H05K3/403 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , H05K2201/09645 , H05K2201/09745 , H05K2201/09909 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要翻译：本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。弯曲。印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。在至少设置在通孔基底孔12a附近的第二布线层16的区域中，形成有减轻应力消除部分17，该部分减轻了当电绝缘材料时可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力基材12弯曲。

90. 发明申请

US20100307782A1 Electric Rotating Tool 有权
标题翻译：电动旋转工具
公开(公告)号：US20100307782A1
公开(公告)日：2010-12-09
申请号：US12867239
申请日：2009-02-16
申请人： Kazutaka Iwata , Kenichirou Yoshida , Shinji Watanabe
发明人： Kazutaka Iwata , Kenichirou Yoshida , Shinji Watanabe
IPC分类号： B25F5/00 , B25B21/00 , H02P29/02
CPC分类号： B25F5/00 , H02H7/0854 , H02P29/0241
摘要： A current detection circuit (18) detects that a drive current of the stator coil (2d) is exceeding a threshold value Ir. A rotation number detection circuit (17) detects that the number of rotations of a rotor (2a) is lower than a threshold value Nr. A computing part (20) outputs a PWM signal which switches a semiconductor switching element (3a) of the inverter circuit part (3). The computing part (20) changes the threshold values Ir and Nr in accordance with the PWM duty of the PWM signal determined in accordance with a pressed distance of a switch trigger (7) and detects a locked state of the motor (2) on the conditions that the motor current I is exceeding the set threshold value Ir and that the number of rotations N thereof is lower than the threshold value Nr.
摘要翻译：电流检测电路（18）检测出定子线圈（2d）的驱动电流超过阈值Ir。旋转数检测电路（17）检测转子（2a）的转数低于阈值Nr。计算部件（20）输出切换逆变器电路部（3）的半导体开关元件（3a）的PWM信号。计算部件（20）根据根据开关触发器（7）的按压距离确定的PWM信号的PWM占空比来改变阈值Ir和Nr，并检测电动机（2）的锁定状态电动机电流I超过设定阈值Ir并且其转数N低于阈值Nr的条件。

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