会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 84. 发明申请
    • LIGHT GUIDE WITH AT LEAST PARTIALLY NON-TRANSMISSIVE COATING ON LEDGE REGION
    • 在LED区域具有至少部分非透射涂层的光导体
    • US20130176317A1
    • 2013-07-11
    • US13344771
    • 2012-01-06
    • Kebin LiIon Bita
    • Kebin LiIon Bita
    • G06T1/00H01J9/00F21V7/04
    • G02B6/0035G02B6/0038G02B6/0055G02B6/0058
    • This disclosure provides systems, methods and apparatus related to an illumination system for a display device. In one aspect, the illumination system includes a light guide having a view region, which directly overlies display elements of a display, and a ledge region between the view region and a light source that injects light into the light guide. The ledge region is coated with an at least partially non-transmissive layer. The layer can be at least partially absorptive and/or at least partially reflective. In some implementations, the layer can include microstructures configured to turn steep-angle light such that it is redirected across the light guide at a shallower angle. In some implementations, the boundary between the ledge region and the view region of the light guide can have a nonlinear shape.
    • 本公开提供了与显示装置的照明系统相关的系统,方法和装置。 在一个方面,照明系统包括具有直视在显示器的显示元件上的视野区域的光导和在观察区域和将光注入到光导中的光源之间的凸缘区域。 凸缘区域涂覆有至少部分不透射的层。 该层可以是至少部分吸收的和/或至少部分反射的。 在一些实施方案中,该层可以包括构造成转动陡峭角度的光的微结构,使得其以更浅的角度被重定向穿过光导。 在一些实施方案中,凸缘区域和导光体的视野区域之间的边界可以具有非线性形状。
    • 87. 发明申请
    • ELECTROMECHANICAL INTERFEROMETRIC MODULATOR DEVICE
    • 电动干涉式调制器装置
    • US20120134008A1
    • 2012-05-31
    • US12956931
    • 2010-11-30
    • Ion BitaSapna Patel
    • Ion BitaSapna Patel
    • G02B26/00H05K3/10
    • G02B26/001
    • This disclosure provides systems, methods and apparatus for an electromechanical system. In one aspect, an electromechanical interferometric modulator system includes a substrate and a plurality of interferometric modulators (IMODs). At least two different IMOD types correspond to different reflected colors. Each IMOD has an optical stack, an absorber layer, a movable reflective layer, where the movable reflective layer has at least open and collapsed states, and an air gap defined between the movable reflective layer and the optical stack in the open state. The optical stacks define different optical path lengths for each of the different IMOD types by way of different transparent layer thickness and/or material, while the air gap has the same size when in the open state. The IMODs reflect different colors in the closed state and a common appearance in the open state. Use of two absorbers aids in defining the common appearance in the open state and can also improve color saturation.
    • 本公开提供了用于机电系统的系统,方法和装置。 一方面,机电干涉式调制器系统包括衬底和多个干涉式调制器(IMOD)。 至少两种不同的IMOD类型对应于不同的反射颜色。 每个IMOD具有光学堆叠,吸收层,可移动反射层,其中可移动反射层具有至少开放和折叠状态,以及限定在处于打开状态的可移动反射层和光学堆叠之间的气隙。 光学堆叠通过不同的透明层厚度和/或材料为每个不同的IMOD类型定义不同的光路长度,而当处于打开状态时,气隙具有相同的尺寸。 IMOD在关闭状态下反映不同的颜色,并且在打开状态下反映出常见的外观。 使用两个吸收器有助于在打开状态下定义常见外观,也可以改善色彩饱和度。
    • 88. 发明申请
    • LIGHT-BASED SEALING AND DEVICE PACKAGING
    • 基于光的密封和设备包装
    • US20110096508A1
    • 2011-04-28
    • US12605246
    • 2009-10-23
    • Ion BitaJohn H. HongKhurshid S. Alam
    • Ion BitaJohn H. HongKhurshid S. Alam
    • H05K7/00H01L21/28H01L33/00H05K5/00
    • B81C1/00269B81C2203/0109B81C2203/019H01L51/5246
    • Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.
    • 提供了制造和封装具有光吸收薄膜叠层的电子器件的系统和方法。 在一个实施例中,将光施加到设置在基板和背板之间的光吸收薄膜堆叠以将基板密封到背板。 在另一个实施例中,光吸收薄膜叠层包括多个薄膜层。 在另一个实施例中,光吸收薄膜堆叠包括反射层上的间隔层和间隔层上的吸收层。 在又一个实施例中,光吸收薄膜叠层小于200纳米厚。 在又一个实施例中,使用光吸收薄膜叠层将具有玻璃,塑料,金属或硅的衬底密封到具有玻璃,塑料,金属或硅的背板上。 因此,光吸收薄膜叠层用于通过粘接工艺密封类似的或不相似的材料。