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81. 发明授权

US4757370A Circuit package cooling technique with liquid film spreading downward across package surface without separation 失效
标题翻译：电路封装冷却技术，液膜在包装表面向下扩散，无需分离
公开(公告)号：US4757370A
公开(公告)日：1988-07-12
申请号：US2582
申请日：1987-01-12
申请人： Dereje Agonafer , Richard C. Chu , Robert E. Simons
发明人： Dereje Agonafer , Richard C. Chu , Robert E. Simons
IPC分类号： H01L23/473 , H01L23/427 , H01L25/04
CPC分类号： H01L23/427 , H01L2924/0002
摘要： Heat producing components such as semiconductor chips are arranged with a major heat transfer surface at an angle of about 10 degrees to the vertical. A film of a dielectric liquid flows downward across this surface from a catch pan located above the component. The film evaporates and thereby removes heat from the component and the vapor is condensed and returned to the catch pan. The angle of the heat transfer surface helps to prevent separation of the film as it flows downward across the surface. In one embodiment the slanting surface is formed by slanted grooves in an otherwise vertical surface of a semiconductor chip. In other embodiments, a slanting surface or a vertical surface with slanting grooves is formed in place on the chip or is formed separately and attached to the chip or is formed as part of a local enclosure for the chip.

82. 发明授权

US4235494A Data processor enclosure with tambour door 失效
标题翻译：带滚筒门的数据处理器外壳
公开(公告)号：US4235494A
公开(公告)日：1980-11-25
申请号：US972767
申请日：1978-12-26
申请人： Richard C. Chu , James J. LaDue , Clifford I. Shelkofsky
发明人： Richard C. Chu , James J. LaDue , Clifford I. Shelkofsky
IPC分类号： H05K5/02 , E06B3/92 , E06B9/11 , G06F1/16 , H05K9/00 , E06B9/14
CPC分类号： H05K9/0062 , E06B3/921 , E06B9/115
摘要： An enclosure for data processing apparatus has a tambour door that slides in a track to partially open the front of the processor enclosure. The tambour door retracts completely into a canister that has a U shaped track that carries the tambour door. The canister is hinged along one edge of the processor frame so that the canister can be swung out to permit access completely along the front of the enclosure with a minimum of interference from the door and canister and with a minimum intrusion into an aisle alongside the processor.
摘要翻译：用于数据处理设备的外壳具有在轨道中滑动以部分地打开处理器外壳的前部的鼓形门。滚筒门完全缩回到具有U形轨道的罐中，该轨道携带滚筒门。罐沿着处理器框架的一个边缘铰接，使得罐可以摆出来，以允许从门和罐的最小的干扰完全沿着机壳的前部进入，并且与处理器一起最少侵入通道。

83. 发明授权

US4226281A Thermal conduction module 失效
标题翻译：导热模块
公开(公告)号：US4226281A
公开(公告)日：1980-10-07
申请号：US47513
申请日：1979-06-11
申请人： Richard C. Chu
发明人： Richard C. Chu
IPC分类号： H01L23/433 , H01L23/473 , H01L23/40
CPC分类号： H01L23/4338 , H01L23/473 , H01L2924/0002
摘要： A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring means is located between the housing and the pin to provide a predetermined spring loading of the pin-piston against the exposed surface of the chip. A header is located at the outer end of the pin-piston in contact with the exposed surface of the chip thereby, providing multiple pin-piston contact with the exposed surface of the chip regardless of the chip tilt which improves the heat transfer. The heat transfer can be controlled by including or removing pin-pistons in accordance with the heat transfer desired.
摘要翻译：小直径孔的矩阵位于模块壳体中，与待冷却的每个集成电路芯片相邻。销或杆位于每个孔中并从其延伸以与芯片的暴露表面接触。弹簧装置位于壳体和销之间，以提供销 - 活塞抵抗芯片暴露表面的预定弹簧加载。头部位于销 - 活塞的外部与芯片的暴露表面接触的端部，从而提供与芯片暴露表面的多个销 - 活塞接触，而不管切屑倾斜，这改善了热传递。可以根据所需的热传递来包括或移除销活塞来控制传热。

84. 发明授权

US09207002B2 Contaminant separator for a vapor-compression refrigeration apparatus 有权
标题翻译：用于蒸气压缩式制冷装置的污染物分离器
公开(公告)号：US09207002B2
公开(公告)日：2015-12-08
申请号：US13271304
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Evan G. Colgan , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12 , F25B21/02 , F25B43/00 , H05K7/20 , B23P15/26
CPC分类号： F25B21/02 , B23P15/26 , F25B43/00 , F25B43/003 , F25B2400/01 , H05K7/20809 , H05K7/20836 , Y10T29/49359
摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.
摘要翻译：提供了便于冷却电子部件的装置和方法。该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。蒸发器与电子部件联接并冷却。该装置还包括与制冷剂流动路径流体连通的污染物分离器。分离器包括制冷剂冷滤器和热电阵列。通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

85. 发明授权

US09167721B2 Direct facility coolant cooling of a rack-mounted heat exchanger 有权
标题翻译：直接设置机架式热交换器的冷却液冷却
公开(公告)号：US09167721B2
公开(公告)日：2015-10-20
申请号：US13305937
申请日：2011-11-29
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , F24F3/14 , F24F11/30 , F24F2110/20 , F25B2600/13 , F25D17/02 , F25D31/002 , F25D2317/04131 , H05K7/20781 , H05K7/20836
摘要： A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.
摘要翻译：提供了一种冷却装置和方法。冷却装置包括冷却剂冷却的热交换器，用于便于散发在电子机架内产生的热量和冷却剂控制装置。冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

86. 发明授权

US09069532B2 Valve controlled, node-level vapor condensation for two-phase heat sink(s) 有权
公开(公告)号：US09069532B2
公开(公告)日：2015-06-30
申请号：US13189598
申请日：2011-07-25
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
摘要： A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

87. 发明授权

US08824143B2 Combined power and cooling rack supporting an electronics rack(S) 有权
标题翻译：组合电源和散热架支持电子机架（S）
公开(公告)号：US08824143B2
公开(公告)日：2014-09-02
申请号：US13271262
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20627 , H05K7/20772 , H05K7/20836
摘要： A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.
摘要翻译：提供了组合的动力和冷却装置，其有助于对与动力和冷却装置不同的一个或多个电子机架供电和冷却。动力和冷却装置包括框架，与框架相关联的一个或多个主体动力组件以及与框架相关联的一个或多个热交换组件。所述一个或多个主体动力组件被配置成向所述一个或多个电子机架提供动力，并且所述一个或多个热交换组件被配置为冷却提供给所述一个或多个电子机架的系统冷却剂。热量由一个或多个热交换组件从系统冷却剂传送到设备冷却剂。在操作中，电源和冷却装置被耦合以向一个或多个电子机架提供电力和冷却。

88. 发明授权

US08813515B2 Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component 有权
标题翻译：热电增强蒸汽压缩制冷装置有助于电子部件的冷却
公开(公告)号：US08813515B2
公开(公告)日：2014-08-26
申请号：US12939574
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B21/02 , F25B40/00 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括制冷剂回路，耦合到制冷剂回路的压缩机以及与制冷剂回路热连通地设置的可控热电阵列。流过制冷剂回路的制冷剂有助于从电子部件散发热量，并且热电阵列设置有位于压缩机上游的制冷剂回路的第一部分与阵列的第一侧热接触，第二部分位于压缩机下游的制冷剂回路的一部分与阵列的第二侧热接触。热电阵列确保进入压缩机的制冷剂回路中的制冷剂通过将通过第二部分的制冷剂的热量传递通过制冷剂回路的第一部分的制冷剂而处于过热的热力学状态。

89. 发明授权

US08783052B2 Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling 有权
标题翻译：冷却液缓冲，蒸汽压缩制冷与储热和压缩机循环
公开(公告)号：US08783052B2
公开(公告)日：2014-07-22
申请号：US12939535
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/24 , F25B2600/0251 , F28D20/021 , F28D2020/0008 , H05K7/20809 , Y02E60/145
摘要： Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通的冷却剂 - 制冷剂热交换器。热缓冲单元与冷却剂回路流体连通地联接，并且制冷剂回路与热交换器流体连通地联接。热交换器将冷却剂回路中的冷却剂的热量散发到制冷剂回路中的制冷剂。压缩机与制冷剂回路流体连通地联接，并且响应于超过热负荷阈值的部件的热负荷而保持接通，并响应于部件的热负荷而循环接通和断开阈。在循环打开和关闭压缩机期间，热存储单元会抑制冷却液回路内冷却液温度的波动。

90. 发明授权

US08743545B2 Thermal expansion-enhanced heat sink for an electronic assembly 失效
标题翻译：用于电子组件的热膨胀增强型散热器
公开(公告)号：US08743545B2
公开(公告)日：2014-06-03
申请号：US13271268
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译：散热器和制造方法被提供用于从电子部件去除热量。散热器包括散热器底座和框架。基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。热界面材料设置在基底表面和电子部件之间。

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