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81. 发明申请

US20100013103A1 Semiconductor embedded module and method for producing the same 有权
标题翻译：半导体嵌入式模块及其制造方法
公开(公告)号：US20100013103A1
公开(公告)日：2010-01-21
申请号：US12458636
申请日：2009-07-17
申请人： Kenichi Kawabata , Toshikazu Endo
发明人： Kenichi Kawabata , Toshikazu Endo
IPC分类号： H01L23/48 , H01L21/304
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/3171 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/82047 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/19041 , H01L2924/19043
摘要： A semiconductor embedded module 1 of the present invention has a configuration in which a semiconductor device 20, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer 10 (second insulating layer). In the semiconductor device 20, a redistribution layer 22 is connected to land electrodes. A protective layer 24 (first insulating layer) is provided on the redistribution layer 22, and is provided with openings such that external connection pads P of the redistribution layer 22 are exposed. Also, the resin layer 10 is formed to cover the protective layer 24, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer 22. The grinding rate of the resin layer 10 is larger than that of the protective layer 24.
摘要翻译：本发明的半导体嵌入式模块1具有将裸片状态的半导体IC（裸片）等电子部件的半导体装置20嵌入树脂层10（第二绝缘层）内的结构，。在半导体器件20中，再分布层22连接到接地电极。在再分配层22上设置有保护层24（第一绝缘层），并且设置有使再分布层22的外部连接焊盘P露出的开口。此外，形成树脂层10以覆盖保护层24，并且在再分布层22的各个外部连接焊盘P的位置处形成通孔V.树脂层10的研磨速度大于保护层24。

82. 发明授权

US07547975B2 Module with embedded semiconductor IC and method of fabricating the module 有权
标题翻译：带嵌入式半导体IC的模块及其制造方法
公开(公告)号：US07547975B2
公开(公告)日：2009-06-16
申请号：US10900458
申请日：2004-07-28
申请人： Minoru Takaya , Hisayuki Abe , Kei Suzuki , Kosuke Takano , Kenichi Kawabata , Toshikazu Endo
发明人： Minoru Takaya , Hisayuki Abe , Kei Suzuki , Kosuke Takano , Kenichi Kawabata , Toshikazu Endo
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/82 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L2221/68359 , H01L2221/68363 , H01L2224/04105 , H01L2224/05026 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16237 , H01L2224/82039 , H01L2224/82138 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H05K1/185 , H01L2924/00 , H01L2224/05599
摘要： A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 μm or smaller, particularly of around 60 μm.
摘要翻译：具有本发明的嵌入式半导体IC的模块包括：第一树脂层，第二树脂层，通过第一和第二树脂层的柱电极;以及安装在第一树脂层和第二树脂层之间的半导体IC。在半导体IC的接地电极上形成有柱状突起，并相对于柱状电极配置。由于在半导体IC上相对于柱状电极形成的柱状凸块的这种定位，螺柱凸块的平面位置基本上是固定的。结果，可以使用非常窄的电极间距为100μm或更小，特别是约60μm的半导体IC。

83. 发明申请

US20090048516A1 IMAGE DIAGNOSING DEVICE 有权
标题翻译：图像诊断装置
公开(公告)号：US20090048516A1
公开(公告)日：2009-02-19
申请号：US11914962
申请日：2006-05-18
申请人： Hideki Yoshikawa , Takashi Azuma , Kenichi Kawabata , Kazuaki Sasaki , Shinichiro Umemura
发明人： Hideki Yoshikawa , Takashi Azuma , Kenichi Kawabata , Kazuaki Sasaki , Shinichiro Umemura
IPC分类号： A61B8/00
CPC分类号： A61B8/5207 , A61B5/11 , A61B8/08 , A61B8/461 , A61B8/463 , G06T5/50 , G06T7/223 , G06T2207/10132 , G06T2207/30101
摘要： An diagnostic imaging apparatus for imaging information changing with time and displaying it in real time, composed of an ultrasonic probe (2), having piezoelectric elements arranged in an array form that transmit ultrasonic waves to a target object (1) and acquires a reflection signal from the target object; a body movement measuring unit (12) that constitutes a two-dimensional ultrasonic image using the reflection signal acquired by the ultrasonic probe, sets, in the image plane, a plurality of measuring areas used for measuring the body movement of the target object, and measures the body movement and deformation amounts in the measuring areas; and an image accumulating (subtracting) unit for accumulating or subtracting images using body movement measured by the body movement measurement unit.
摘要翻译：一种诊断成像装置，用于对随时间变化的图像信息随时间变化并实时显示，该超声波探头由超声波探头（2）组成，该超声波探头具有排列成阵列形式的压电元件，以将超声波传送到目标物体（1）并获取反射信号从目标对象; 使用由超声波探头取得的反射信号构成二维超声波图像的身体运动测量单元（12）在图像平面中设置用于测量目标物体的身体运动的多个测量区域，以及测量测量区域的身体运动和变形量; 以及用于通过由身体运动测量单元测量的身体运动来累积或减去图像的图像累积（减去）单元。

84. 发明申请

US20090025965A1 Assembly substrate and method of manufacturing the same 有权
标题翻译：装配基板及其制造方法
公开(公告)号：US20090025965A1
公开(公告)日：2009-01-29
申请号：US12219372
申请日：2008-07-21
申请人： Yoshikazu Kanemaru , Kenichi Kawabata
发明人： Yoshikazu Kanemaru , Kenichi Kawabata
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K3/0052 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0271 , H05K1/112 , H05K1/185 , H05K3/0097 , H05K3/4602 , H05K2201/09136 , H05K2201/10636 , H05K2201/10674 , H05K2201/2009 , H05K2203/0169 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , H01L2224/82 , H01L2924/00
摘要： The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).
摘要翻译：本发明的目的是提供一种易于处理并能够抑制翘曲发生并且提供高生产率和经济效率的组装基板及其制造方法。工作板100在大致矩形的基板11的一个表面上包括绝缘层21，并且电子部件41和板状集成框架51嵌入在绝缘层21的内部。板状集成框架51具有多个凹部53在其内周壁52a处平行布置，并且布置在电子部件41的非放置区域上以围绕多个电子部件41（组）。

85. 发明申请

US20070141759A1 METHOD FOR MANUFACTURING IC-EMBEDDED SUBSTRATE 有权
标题翻译：制造IC嵌入式基板的方法
公开(公告)号：US20070141759A1
公开(公告)日：2007-06-21
申请号：US11612419
申请日：2006-12-18
申请人： Kenji Nagase , Kenichi Kawabata
发明人： Kenji Nagase , Kenichi Kawabata
IPC分类号： H01L21/00
CPC分类号： H01L25/16 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01078 , H01L2924/14 , H01L2924/30107 , H05K1/185 , H05K3/0044 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09518 , H05K2201/10674 , H05K2203/025 , H05K2203/0554 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49151 , Y10T29/49155
摘要： A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.
摘要翻译：一种用于制造嵌入IC的衬底的方法包括：第一步骤，用于将至少具有焊盘电极的IC芯片封装在绝缘层中;第二步骤，用于形成金属层，所述金属层至少具有位于衬垫上方的位置的第一孔 IC芯片的电极和除了安装IC芯片的区域之外的区域上方的位置的第二孔，以及第三步骤，通过其中使用金属层的喷砂处理来选择性地去除绝缘层，从而形成对应于第一孔的第一通孔和对应于第二孔的第二通孔。

86. 发明申请

US20070076320A1 Hard disk drive and wireless data terminal using the same 有权
标题翻译：硬盘驱动器和无线数据终端使用相同
公开(公告)号：US20070076320A1
公开(公告)日：2007-04-05
申请号：US11529975
申请日：2006-09-29
申请人： Toshikazu Endo , Kenichi Kawabata
发明人： Toshikazu Endo , Kenichi Kawabata
IPC分类号： G11B5/012
CPC分类号： G11B5/09 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24137 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , H05K1/0218 , H05K1/0231 , H05K1/0233 , H05K1/0237 , H05K1/0298 , H05K1/186 , H05K3/4688 , H05K2201/086 , H05K2201/09236
摘要： A hard disk drive is provided with a platter, a spindle motor for driving the platter, an arm with a magnetic head attached to a distal end thereof, a voice coil motor for driving the arm, a first circuit substrate, and a drive casing for accommodating and electrically shielding the platter, spindle motor, arm, voice coil motor, and first circuit substrate. The first circuit substrate has a multilayer substrate, a plurality of digital ICs that is embedded as bare chips in the multilayer substrate, and a bus line for connecting the digital ICs. The digital ICs are disposed in a mutually horizontal configuration.
摘要翻译：硬盘驱动器设有一个盘片，用于驱动盘片的主轴电机，一个安装在其末端的磁头的臂，一个用于驱动臂的音圈马达，一个第一电路基板和一个用于容纳和电屏蔽盘，主轴电机，臂，音圈电机和第一电路基板。第一电路基板具有多层基板，作为裸芯片嵌入多层基板的多个数字IC以及用于连接数字IC的总线。数字IC以相互水平的配置布置。

87. 发明申请

US20070016042A1 Ultrasonic apparatus for diagnosis and therapy 有权
标题翻译：超声波诊断和治疗设备
公开(公告)号：US20070016042A1
公开(公告)日：2007-01-18
申请号：US11336849
申请日：2006-01-23
申请人： Kenichi Kawabata , Nami Sugita , Shinichiro Umemura
发明人： Kenichi Kawabata , Nami Sugita , Shinichiro Umemura
IPC分类号： A61B8/00
CPC分类号： A61B8/08 , A61B8/481 , A61B2090/378 , A61N7/02
摘要： The ultrasonic apparatus for a diagnosis and therapy includes: a first ultrasound probe, a second ultrasound probe, and an ultrasound exposure apparatus for exposing ultrasounds for a phase shift, diagnosis, and therapy, respectively; an echo detection device for detecting an ultrasound echo; control parts for the phase shift for causing the shift in an ultrasound contrast agent by exposing the ultrasound for the shift through the first device, and for the diagnosis for detecting the shift of the agent, using the echo detected by the detection device, corresponding to an exposure of the ultrasound for the diagnosis by the second device; a difference calculation device for calculating a difference over time of the shift detected by the control part for the diagnosis; a device for positioning for deciding a target position where the difference is produced; and a control part for the therapy for exposing the ultrasound for the therapy to the decided target position through the exposure apparatus.
摘要翻译：用于诊断和治疗的超声波装置分别包括：第一超声波探头，第二超声波探头和用于分别暴露超声波用于相移，诊断和治疗的超声波曝光装置; 用于检测超声回波的回波检测装置; 用于通过使超声波暴露于第一装置的移位而引起超声造影剂移位的相移的控制部件，以及使用由检测装置检测到的回波来检测试剂的移位的诊断，对应于超声波对第二装置进行诊断的曝光; 差分计算装置，用于计算由用于诊断的控制部分检测到的位移的时间差; 用于确定产生差异的目标位置的定位装置; 以及用于通过曝光装置将用于治疗的超声波暴露于所确定的目标位置的治疗的控制部分。

88. 发明授权

US07149830B2 Semiconductor device and microcontroller 有权
标题翻译：半导体器件和微控制器
公开(公告)号：US07149830B2
公开(公告)日：2006-12-12
申请号：US10947538
申请日：2004-09-23
申请人： Norihiro Nakatsuhama , Yoshiaki Nagatomi , Kenichi Kawabata , Tomohide Yamamoto , Kenji Nakata , Hironori Aono , Masatoshi Konishi
发明人： Norihiro Nakatsuhama , Yoshiaki Nagatomi , Kenichi Kawabata , Tomohide Yamamoto , Kenji Nakata , Hironori Aono , Masatoshi Konishi
IPC分类号： G06F13/24
CPC分类号： G06F13/24
摘要： A semiconductor device in which input terminals for external interrupts can be set as desired. A plurality of external input terminals can be specified as interrupt terminals which output an input signal to an external interrupt circuit via an interrupt terminal selector. A selection control circuit specifies whether a plurality of external input terminals are used as interrupt terminals. According to the selection control circuit, the interrupt terminal selector outputs to the external interrupt circuit an input signal entered from an external input terminal which is specified as an interrupt terminal out of the plurality of external input terminals.
摘要翻译：可以根据需要设定用于外部中断的输入端子的半导体装置。可以将多个外部输入端子指定为通过中断端子选择器将输入信号输出到外部中断电路的中断端子。选择控制电路指定多个外部输入端子是否用作中断端子。根据选择控制电路，中断终端选择器向外部中断电路输出从多个外部输入端子中指定为中断端子的外部输入端子输入的输入信号。

89. 发明申请

US20050154110A1 Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition 审中-公开
标题翻译：复合介电材料，复合电介质基板，预浸料，涂覆金属箔，成型片，复合磁性基板，基板，双面金属箔包覆基板，阻燃基板，聚乙烯基苄基醚树脂组合物，热固性聚乙烯基苄基醚树脂组合物及其制备方法热固性聚乙烯基苄基醚树脂组合物
公开(公告)号：US20050154110A1
公开(公告)日：2005-07-14
申请号：US11045160
申请日：2005-01-31
申请人： Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
发明人： Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
IPC分类号： H01B3/44 , H01P1/203 , H01P1/205 , H01P5/10 , H01P5/18 , H01P7/04 , H01P7/08 , H01Q1/38 , H05K1/02 , H05K1/03 , H05K1/16 , H05K9/00 , C08K3/10
CPC分类号： H01P5/185 , H01B3/442 , H01P1/203 , H01P1/20345 , H01P1/2056 , H01P5/10 , H01P5/187 , H01P7/04 , H01P7/082 , H01P7/084 , H01Q1/38 , H05K1/024 , H05K1/0326 , H05K1/0373 , H05K1/162 , H05K1/165 , H05K9/0075 , H05K2201/012 , H05K2201/0209 , H05K2201/086 , Y10T428/31692 , Y10T428/31855
摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric, ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
摘要翻译：包含由聚乙烯基苄基醚化合物产生的树脂和分散在其中的电介质陶瓷粉末的复合电介质材料可用于高频区域。还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

90. 发明授权

US06908960B2 COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN 失效
标题翻译：复合介电材料，复合电介质基板，预制件，涂覆金属箔，成型片，复合磁性基板，基板，双面金属箔基板，阻燃基板，聚乙烯苯醚树脂组合物，热稳定剂
公开(公告)号：US06908960B2
公开(公告)日：2005-06-21
申请号：US09748261
申请日：2000-12-27
申请人： Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
发明人： Minoru Takaya , Hisashi Kobuke , Toshikazu Endo , Seiji Takahara , Toshiyuki Abe , Hiroshige Ohkawa , Masami Sasaki , Kenichi Kawabata
IPC分类号： H01B3/44 , H01P1/203 , H01P1/205 , H01P5/10 , H01P5/18 , H01P7/04 , H01P7/08 , H01Q1/38 , H05K1/02 , H05K1/03 , H05K1/16 , H05K9/00 , C08K3/40
CPC分类号： H01P5/185 , H01B3/442 , H01P1/203 , H01P1/20345 , H01P1/2056 , H01P5/10 , H01P5/187 , H01P7/04 , H01P7/082 , H01P7/084 , H01Q1/38 , H05K1/024 , H05K1/0326 , H05K1/0373 , H05K1/162 , H05K1/165 , H05K9/0075 , H05K2201/012 , H05K2201/0209 , H05K2201/086 , Y10T428/31692 , Y10T428/31855
摘要： A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
摘要翻译：包含由聚乙烯基苄基醚化合物和分散在其中的介电陶瓷粉末产生的树脂的复合电介质材料可用于高频区域。还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

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